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    THROUGH-HOLE ELECTRONIC DEVICE WITH DOUBLE HEAT-SINK
    21.
    发明申请
    THROUGH-HOLE ELECTRONIC DEVICE WITH DOUBLE HEAT-SINK 有权
    具有双重加热的通孔 - 电子设备

    公开(公告)号：US20130285229A1

    公开(公告)日：2013-10-31

    申请号：US13871857

    申请日：2013-04-26

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

    IPC: H01L23/367

    CPC classification number: H01L23/3677 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink.

    Abstract translation: 电子设备包括第一芯片和第二芯片，其中每个芯片在第一表面上具有第一导电端子，在第二表面上具有第二导电端子。 绝缘体围绕第一和第二芯片，与第一和第二芯片的第一导电端子耦合的第一散热器和与第一和第二芯片的第二导电端子耦合的第二散热器。 第一散热器和/或第二散热器的一部分从绝缘体露出。 电子设备包括从绝缘体暴露的第一导电引线和第二导电引线，用于电子器件在电子板上的通孔安装，第一导电引线与第一散热器和第二导电引线相连接 加上第二个散热器。

    WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CIRCUIT BOARD
    22.
    发明申请
    WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CIRCUIT BOARD 有权
    表面安装电子设备在印刷电路板上的波纹焊接

    公开(公告)号：US20130126590A1

    公开(公告)日：2013-05-23

    申请号：US13655555

    申请日：2012-10-19

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

    IPC: B23K31/02

    CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

    Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

    Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

    ELECTRONIC SYSTEM FOR REFLOW SOLDERING
    23.
    发明申请
    ELECTRONIC SYSTEM FOR REFLOW SOLDERING 有权
    用于反射焊接的电子系统

    公开(公告)号：US20130083489A1

    公开(公告)日：2013-04-04

    申请号：US13626322

    申请日：2012-09-25

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Matteo Sebastiano Dimauro ,  Sebastiano Russo ,  Rosalba Cacciola ,  Cristiano Gianluca Stella

    IPC: H05K7/00 ,  B23K31/02 ,  H01B5/00 ,  H01R9/00 ,  H05K7/20

    CPC classification number: H05K1/111 ,  H05K3/3431 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

    Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

    Abstract translation: 电子系统包括绝缘结构元件，其具有被配置为将电子系统与至少一个另外的电子系统耦合的耦合表面。 电子系统还包括至少一个至少部分地暴露在耦合表面上的导电接触元件。 每个导电接触元件具有支撑导电接触元件的回流焊接的焊接表面与另外的电子系统的相应的另外的接触元件。 此外，每个导电接触元件具有从绝缘结构元件突出的至少一个侧表面。 导电接触元件的焊接表面包括在突出侧表面具有开口端的至少一个通道，该通道构造成便于在回流焊接期间产生的废气的分散。

    Power semiconductor device with a double island surface mount package
    24.
    发明授权
    Power semiconductor device with a double island surface mount package 有权

    公开(公告)号：US11658108B2

    公开(公告)日：2023-05-23

    申请号：US17142738

    申请日：2021-01-06

    Applicant: STMicroelectronics S.r.l.

    Inventor： Cristiano Gianluca Stella ,  Agatino Minotti

    IPC: H01L23/498 ,  H01L23/373

    CPC classification number: H01L23/49844 ,  H01L23/3735 ,  H01L23/49822

    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.

    Package for power device and method of making the same
    29.
    发明授权
    Package for power device and method of making the same 有权
    功率器件封装及其制作方法

    公开(公告)号：US09202766B2

    公开(公告)日：2015-12-01

    申请号：US13871861

    申请日：2013-04-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

    IPC: H01L23/34 ,  H01L25/07 ,  H01L23/433 ,  H01L23/492 ,  H01L23/495

    CPC classification number: H01L23/34 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.

    Abstract translation: 功率器件包括半导体材料芯片和另外的半导体材料芯片，其中至少一个功率晶体管被集成在其中; 每个芯片包括在第一表面上的第一导电端子，以及在与第一表面相对的第二表面上的第二导电端子和控制端子，以及嵌入所述芯片和所述另外的芯片的绝缘体。 在根据本公开的一个或多个实施例的解决方案中，所述芯片的第一表面面向所述另外的芯片的第二表面，并且功率器件还包括布置在所述芯片和所述另外的芯片之间的第一散热器， 与所述芯片的第一导电端子和所述另外芯片的第二导电端子耦合，所述另外芯片的控制端子与第一散热器电绝缘。

    Manufacturing of DSC type electronic devices by means of spacer insert
    30.
    发明授权
    Manufacturing of DSC type electronic devices by means of spacer insert 有权
    通过间隔插入件制造DSC型电子器件

    公开(公告)号：US09159644B2

    公开(公告)日：2015-10-13

    申请号：US13629156

    申请日：2012-09-27

    Applicant: STMicroelectronics S.r.l.

    Inventor： Tommaso Casabianca ,  Cristiano Gianluca Stella

    IPC: H01L23/433 ,  H01L23/495 ,  H01L21/56 ,  A01B1/00

    CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed.

    Abstract translation: DSC型器件制造工艺包括将电路组件放置在模具中。 电路组件包括第一散热器，安装在第一散热器上的半导体芯片，安装在半导体芯片上的第二散热器和与半导体芯片电连接的引脚块。 第一散热器的外表面和销块的外表面与模具的第一内表面接触。 间隔件插入件放置成与模具的第二内表面和第二散热器的外表面接触并定位在模具的第二内表面之间。 模具填充有随后硬化的绝缘材料。 硬化后，从第一散热器，销块和第二散热片的外表面暴露出来，从模具中取出所得装置。

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