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21.发明申请公开(公告)号：US20140001514A1
公开(公告)日：2014-01-02
申请号：US13539944
申请日：2012-07-02
申请人： Hans-Joachim Schulze , Franz Hirler , Anton Mauder , Helmut Strack , Frank Kahlmann , Gerhard Miller
发明人： Hans-Joachim Schulze , Franz Hirler , Anton Mauder , Helmut Strack , Frank Kahlmann , Gerhard Miller
IPC分类号： H01L29/36 , H01L21/225
CPC分类号： H01L29/66348 , H01L21/2205 , H01L21/2658 , H01L29/0619 , H01L29/0634 , H01L29/0638 , H01L29/0878 , H01L29/102 , H01L29/1095 , H01L29/165 , H01L29/167 , H01L29/36 , H01L29/402 , H01L29/404 , H01L29/407 , H01L29/7397 , H01L29/7428 , H01L29/7802 , H01L29/7811 , H01L29/7813 , H01L29/7816 , H01L29/861 , H01L29/872
摘要： A semiconductor device includes a device region. The device region includes at least one device region section including dopant atoms of a first doping type and with a first doping concentration of at least 1E16 cm−3 and dopant atoms of a second doping type and with a second doping concentration of at least 1E16 cm−3.
摘要翻译： 半导体器件包括器件区域。 器件区域包括至少一个器件区域部分，其包括第一掺杂类型的掺杂剂原子和具有至少1E16cm-3的第一掺杂浓度和第二掺杂类型的掺杂剂原子，并且具有至少1E16cm的第二掺杂浓度 -3。
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公开(公告)号：US20120256250A1
公开(公告)日：2012-10-11
申请号：US13082679
申请日：2011-04-08
IPC分类号： H01L27/06 , H01L21/336
CPC分类号： H01L21/823487 , H01L27/0694 , H01L27/1207 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor component includes a sequence of layers, the sequence of layers including a first insulator layer, a first semiconductor layer disposed on the first insulator layer, a second insulator layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the second insulator layer. The semiconductor component also includes a plurality of devices at least partly formed in the first semiconductor layer. A first one of the plurality of devices is a power transistor formed in a first region of the first semiconductor layer and a first region of the second semiconductor layer. The first region of the first and second semiconductor layers are in electrical contact with one another through a first opening in the second insulator layer.
摘要翻译： 半导体部件包括一层层，所述层序列包括第一绝缘体层，设置在第一绝缘体层上的第一半导体层，设置在第一半导体层上的第二绝缘体层，以及设置在第二绝缘体层上的第二半导体层 绝缘体层。 半导体部件还包括至少部分地形成在第一半导体层中的多个器件。 多个器件中的第一个是在第一半导体层的第一区域和第二半导体层的第一区域中形成的功率晶体管。 第一和第二半导体层的第一区域通过第二绝缘体层中的第一开口彼此电接触。
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公开(公告)号：US20120223420A1
公开(公告)日：2012-09-06
申请号：US13470830
申请日：2012-05-14
IPC分类号： H01L29/06
CPC分类号： H01L29/0649 , H01L21/0237 , H01L21/02642 , H01L21/02647 , H01L21/31144 , H01L21/74 , H01L21/76224 , H01L21/7624 , H01L21/76248 , H01L21/76283
摘要： One aspect includes a semiconductor arrangement with a semiconductor body having a first surface. A buried material layer is in the semiconductor body, the buried material layer being arranged distant to the first surface. A monocrystalline semiconductor material is arranged between the material layer and the first surface, and a monocrystalline semiconductor material adjoins the material layer in a lateral direction of the semiconductor body.
摘要翻译： 一个方面包括具有半导体本体的具有第一表面的半导体装置。 掩埋材料层位于半导体本体中，掩埋材料层被布置成远离第一表面。 单晶半导体材料布置在材料层和第一表面之间，单晶半导体材料在半导体主体的横向方向上邻接材料层。
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公开(公告)号：US20100210091A1
公开(公告)日：2010-08-19
申请号：US12769976
申请日：2010-04-29
IPC分类号： H01L21/762 , H01L21/461 , H01L21/22 , H01L21/38 , H01L21/302
CPC分类号： H01L21/26506 , H01L21/263 , H01L21/3242
摘要： A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the semiconductor body via the first side to a target depth of the semiconductor body; bonding the first side of the semiconductor body to a carrier substrate; forming an n-doped zone in the semiconductor body by heating the semiconductor body such that a pn junction arises in the semiconductor body; and removing the second side of the semiconductor body at least as far as a space charge zone spanned at the pn junction.
摘要翻译： 一种制造半导体的方法包括提供具有第一侧和第二侧的p掺杂半导体本体; 通过第一侧将半导体本体中的质子注入半导体本体的目标深度; 将半导体主体的第一侧接合到载体基板; 通过加热所述半导体本体从而在半导体本体中形成pn结，形成半导体本体中的n掺杂区; 以及移除所述半导体本体的所述第二侧至少与在所述pn结处跨过的空间电荷区域一样远。
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25.发明授权Metal-semiconductor contact, semiconductor component, integrated circuit arrangement and method 有权金属半导体接触，半导体元件，集成电路布置和方法公开(公告)号：US07560783B2
公开(公告)日：2009-07-14
申请号：US11455397
申请日：2006-06-19
IPC分类号： H01L29/772
CPC分类号： H01L29/7805 , H01L21/28512 , H01L21/28568 , H01L29/0634 , H01L29/0847 , H01L29/1095 , H01L29/167 , H01L29/32 , H01L29/456 , H01L29/7395 , H01L29/7802 , H01L29/7803 , H01L29/7813 , H01L29/861 , H01L29/8613
摘要： The present invention relates to a metal-semiconductor contact comprising a semiconductor layer and comprising a metallization applied to the semiconductor layer, a high dopant concentration being introduced into the semiconductor layer such that a non-reactive metal-semiconductor contact is formed between the metallization and the semiconductor layer. The metallization and/or the semiconductor layer are formed in such a way that only a fraction of the introduced doping concentration is electrically active, and a semiconductor layer doped only with this fraction of the doping concentration only forms a Schottky contact when contact is made with the metallization. Furthermore, the invention relates to a semiconductor component comprising a drain zone, body zones embedded therein and source zones again embedded therein. The semiconductor component has metal-semiconductor contacts in which the contacts made contact only with the source zones but not with the body zones.
摘要翻译： 本发明涉及包含半导体层并包含施加到半导体层的金属化的金属 - 半导体接触，将高掺杂浓度引入到半导体层中，使得在金属化和金属化之间形成非反应性金属 - 半导体接触 半导体层。 金属化和/或半导体层以这样的方式形成，使得只有一部分引入的掺杂浓度是电活性的，并且仅当这一部分掺杂浓度掺杂的半导体层仅在与...接触时形成肖特基接触 金属化。 此外，本发明涉及一种半导体部件，其包括漏区，嵌入其中的主体区和再次嵌入其中的源区。 半导体部件具有金属半导体触点，触点仅与源极区域接触而不与主体区域接触。
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公开(公告)号：US08288258B2
公开(公告)日：2012-10-16
申请号：US12769976
申请日：2010-04-29
IPC分类号： H01L21/306
CPC分类号： H01L21/26506 , H01L21/263 , H01L21/3242
摘要： A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the semiconductor body via the first side to a target depth of the semiconductor body; bonding the first side of the semiconductor body to a carrier substrate; forming an n-doped zone in the semiconductor body by heating the semiconductor body such that a pn junction arises in the semiconductor body; and removing the second side of the semiconductor body at least as far as a space charge zone spanned at the pn junction.
摘要翻译： 一种制造半导体的方法包括提供具有第一侧和第二侧的p掺杂半导体本体; 通过第一侧将半导体本体中的质子注入半导体本体的目标深度; 将半导体主体的第一侧接合到载体基板; 通过加热所述半导体本体从而在半导体本体中形成pn结，形成半导体本体中的n掺杂区; 以及移除所述半导体本体的所述第二侧至少与在所述pn结处跨过的空间电荷区域一样远。
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27.发明申请METHOD FOR TREATING AN OXYGEN-CONTAINING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR COMPONENT 审中-公开用于处理含氧半导体波长的方法和半导体元件公开(公告)号：US20110042791A1
公开(公告)日：2011-02-24
申请号：US12161472
申请日：2007-01-19
IPC分类号： H01L29/08 , H01L21/26 , H01L21/322
CPC分类号： H01L21/26506 , H01L21/263 , H01L21/3221 , H01L21/3225 , H01L29/0873 , H01L29/0878 , H01L29/32 , H01L29/66704 , H01L29/66727 , H01L29/861
摘要： A method for treating an oxygen-containing semiconductor wafer, and semiconductor component. One embodiment provides a first side, a second side opposite the first side. A first semiconductor region adjoins the first side. A second semiconductor region adjoins the second side. The second side of the wafer is irridated such that lattice vacancies arise in the second semiconductor region. A first thermal process is carried out the duration of which is chosen such that oxygen agglomerates form in the second semiconductor region and that lattice vacancies diffuse from the first semiconductor region into the second semiconductor region.
摘要翻译： 一种处理含氧半导体晶片和半导体元件的方法。 一个实施例提供了第一侧，与第一侧相对的第二侧。 第一半导体区域邻接第一侧。 第二半导体区域邻接第二侧。 搅拌晶片的第二面使得在第二半导体区域中出现晶格空位。 进行第一热处理，其持续时间被选择为使得在第二半导体区域中形成氧团聚体，并且晶格空位从第一半导体区扩散到第二半导体区域。
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28.发明申请Capacitor Structure in Trench Structures of Semiconductor Devices and Semiconductor Devices Comprising Capacitor Structures of this Type and Methods for Fabricating the Same 有权包括这种类型的电容器结构的半导体器件和半导体器件的沟槽结构中的电容器结构及其制造方法公开(公告)号：US20100264456A1
公开(公告)日：2010-10-21
申请号：US12827035
申请日：2010-06-30
CPC分类号： H01L29/66181 , H01L27/10861 , H01L28/82
摘要： A capacitor structure in trench structures of a semiconductor device includes conductive regions made of metallic and/or semiconducting materials. The conducting regions are surrounded by a dielectric and form stacked layers in the trench structure of the semiconductor device.
摘要翻译： 半导体器件的沟槽结构中的电容器结构包括由金属和/或半导体材料制成的导电区域。 导电区域被电介质包围，并在半导体器件的沟槽结构中形成叠层。
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公开(公告)号：US07317252B2
公开(公告)日：2008-01-08
申请号：US10686849
申请日：2003-10-16
IPC分类号： H01L23/48
CPC分类号： H01L29/7802 , H01L29/1604 , H01L29/41766 , H01L29/456 , H01L29/7396 , H01L29/7813 , H01L2924/0002 , H01L2924/00
摘要： A contact configuration has an ohmic contact between a metalization layer and a semiconductor body of monocrystalline semiconductor material. An amorphous semiconductor layer is formed between the metalization layer and the monocrystalline semiconductor body. The layer is formed of the same semiconductor material as the body. The contact configuration is either produced by applying amorphous semiconductor material on the semiconductor body (e.g., sputtering, vapor deposition, glow discharge) or by damage formation in the semiconductor body.
摘要翻译： 接触构造在金属化层和单晶半导体材料的半导体本体之间具有欧姆接触。 在金属化层和单晶半导体本体之间形成非晶半导体层。 该层由与本体相同的半导体材料形成。 接触构造是通过在半导体本体上施加非晶半导体材料（例如溅射，气相沉积，辉光放电）或通过半导体本体中的损伤形成来制造的。
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公开(公告)号：US08110868B2
公开(公告)日：2012-02-07
申请号：US11435979
申请日：2006-05-17
IPC分类号： H01L29/78
CPC分类号： H01L29/7802 , H01L29/0634 , H01L29/0653 , H01L29/0696 , H01L29/0878 , H01L29/1095 , H01L29/407 , H01L29/41766 , H01L29/4916 , H01L29/66734 , H01L29/7803 , H01L29/7804 , H01L29/7813 , H01L29/872
摘要： A semiconductor component having a semiconductor body is disclosed. In one embodiment, the semiconductor component includes a drift zone of a first conductivity type, a drift control zone composed of a semiconductor material which is arranged adjacent to the drift zone at least in places, a dielectric which is arranged between the drift zone and the drift control zone at least in places. A quotient of the net dopant charge of the drift control zone, in an area adjacent to the accumulation dielectric and the drift zone, divided by the area of the dielectric arranged between the drift control zone and the drift zone is less than the breakdown charge of the semiconductor material in the drift control zone.
摘要翻译： 公开了一种具有半导体本体的半导体部件。 在一个实施例中，半导体部件包括第一导电类型的漂移区，由半导体材料构成的漂移控制区，该半导体材料至少位于与漂移区相邻的位置处，布置在漂移区和 漂移控制区至少在地方。 漂移控制区的净掺杂剂电荷在与积聚电介质和漂移区相邻的区域除以布置在漂移控制区和漂移区之间的介质的面积除以小于 漂移控制区中的半导体材料。
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