公开(公告)号：US20070258229A1

公开(公告)日：2007-11-08

申请号：US10555913

申请日：2004-05-05

申请人： Stanton Weaver ,  Thomas Stecher ,  Anant Setlur ,  Alok Srivastava ,  Holly Comanzo ,  Charles Becker ,  Thomas Soules ,  Chen-Lun Hsing ,  Rebecca Bompiedi

发明人： Stanton Weaver ,  Thomas Stecher ,  Anant Setlur ,  Alok Srivastava ,  Holly Comanzo ,  Charles Becker ,  Thomas Soules ,  Chen-Lun Hsing ,  Rebecca Bompiedi

IPC分类号： F21V9/16

CPC分类号： F21K9/64 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A lighting apparatus (10) comprises a light engine (12) producing ultra violet radiation. An enclosure (14) surrounds a radiation generating area of the light engine (12) to encompass the radiation. At least one wall (28) of the enclosure (14) is substantially reflective of the ultraviolet radiation. The enclosure (14) includes a replaceable top portion (30) which includes a phosphor portion (32). The phosphor portion (32) is spaced from the radiation generating area of the light engine (12) by a height of the enclosure (14).

摘要翻译： 照明装置（10）包括产生紫外辐射的光引擎（12）。 外壳（14）围绕光引擎（12）的辐射产生区域以包围辐射。 外壳（14）的至少一个壁（28）基本上反射紫外线。 外壳（14）包括可更换的顶部（30），其包括磷光体部分（32）。 荧光体部分（32）与光引擎（12）的辐射产生区域隔开外壳（14）的高度。

公开(公告)号：US20060292722A1

公开(公告)日：2006-12-28

申请号：US11468709

申请日：2006-08-30

申请人： Charles Becker ,  Stanton Weaver ,  Thomas Stecher

发明人： Charles Becker ,  Stanton Weaver ,  Thomas Stecher

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

摘要： A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

摘要翻译： 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

公开(公告)号：US07147208B1

公开(公告)日：2006-12-12

申请号：US11090683

申请日：2005-03-25

申请人： Renato Guida ,  Stanton Weaver

发明人： Renato Guida ,  Stanton Weaver

IPC分类号： F16K31/12

CPC分类号： F16K7/14 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0034 ,  F16K2099/0076 ,  F16K2099/0078

摘要： A valve and concomitant method of controlling flow of a fluid with a valve comprising isolating a fluid path from a valve stem with a diaphragm in a valve body, blocking the fluid path with a plunger having a stroke of less than approximately 500 micrometers, driving the plunger with an actuator, and operating the valve at a frequency of at least approximately 20 Hz but with a flow of at least approximately 5.0E-04 kg/sec.

摘要翻译： 一种用于控制流体与阀的流动的阀和伴随方法，包括：将具有隔膜的阀杆与流体路径隔离在阀体中，用具有小于约500微米冲程的柱塞阻塞流体路径， 柱塞，其具有致动器，并且以至少约20Hz的频率操作阀，但是具有至少约5.0E-04kg / sec的流量。

公开(公告)号：US20060005947A1

公开(公告)日：2006-01-12

申请号：US10887601

申请日：2004-07-09

申请人： Mehmet Arik ,  Stanton Weaver

发明人： Mehmet Arik ,  Stanton Weaver

IPC分类号： F28D15/00

CPC分类号： H01L33/648 ,  F21K9/00 ,  F21W2131/103 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48464 ,  H05K1/0203 ,  H05K1/05 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.

摘要翻译： 发光装置（10,110,210,310,410）包括一个或多个发光芯片（12,112,212,312,412）和支撑件（13,14,144,214,314,414），所述支撑件 发光芯片设置在其上。 支撑件包括附接有发光芯片的第一侧和与第一侧相对的第二侧。 热超导传热介质（22,122,222,322,422）设置在支撑件的内部容积中并且热连接支撑件的第一和第二侧。 热超导传热介质具有比铜的热导率至少大1500倍的导热系数。

公开(公告)号：US20050097941A1

公开(公告)日：2005-05-12

申请号：US10706767

申请日：2003-11-12

申请人： Peter Sandvik ,  Vinayak Tilak ,  Jesse Tucker ,  Stanton Weaver ,  David Shaddock ,  Jonathan Male ,  John Lemmon ,  Mark Woodmansee ,  Venkatesan Manivannan ,  Deborah Haitko

发明人： Peter Sandvik ,  Vinayak Tilak ,  Jesse Tucker ,  Stanton Weaver ,  David Shaddock ,  Jonathan Male ,  John Lemmon ,  Mark Woodmansee ,  Venkatesan Manivannan ,  Deborah Haitko

IPC分类号： G01N27/414 ,  G01N33/00 ,  G01N7/00

CPC分类号： G01N27/4141 ,  G01N33/0037 ,  Y02A50/245

摘要： A gas sensor device including a semiconductor substrate; one or more catalytic gate-electrodes deposited on a surface of the semiconductor substrate; one or more ohmic contacts deposited on the surface of the semiconductor substrate and a passivation layer deposited on at least a portion of the surface; wherein the semiconductor substrate includes a material selected from the group consisting of silicon carbide, diamond, Group III nitrides, alloys of Group III nitrides, zinc oxide, and any combinations thereof.

摘要翻译： 一种气体传感器装置，包括半导体衬底; 沉积在半导体衬底的表面上的一个或多个催化栅电极; 沉积在半导体衬底的表面上的一个或多个欧姆接触层和沉积在该表面的至少一部分上的钝化层; 其中所述半导体衬底包括选自碳化硅，金刚石，III族氮化物，III族氮化物的合金，氧化锌及其任何组合的材料。

公开(公告)号：US20050006754A1

公开(公告)日：2005-01-13

申请号：US10614497

申请日：2003-07-07

申请人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

发明人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

IPC分类号： F28F13/18 ,  H01L23/373 ,  H01L23/473 ,  H01L23/485 ,  H01L33/62 ,  H01L33/64 ,  H01L23/10

CPC分类号： F28F13/185 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/473 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L33/62 ,  H01L33/648 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1703 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

摘要翻译： 半导体器件管芯（10,116）设置在散热支撑结构（30,100）上。 纳米管区域（52,120）包含纳米管（54,126）布置在散热支撑结构（30,100）的表面上或散热支撑结构（30,100）中。 纳米管区域（52,120）被布置成有助于从半导体器件管芯（10,116）到散热支撑结构（30,100）的热传递。 在一个实施例中，半导体器件管芯（10）包括管芯电极（20,22），并且支撑结构（30）包括由至少一些纳米管区域（52）限定的接触焊盘（40,42）。 接触焊盘（40,42）与管芯电极（20,22）电接触和机械接触。 在另一个实施例中，散热支撑结构（100）包括在支撑结构（100）中侧向设置的微通道（120）。 至少一些纳米管区域设置在微通道（100）的内部。

公开(公告)号：US20080042163A1

公开(公告)日：2008-02-21

申请号：US11925396

申请日：2007-10-26

申请人： Stanton Weaver

发明人： Stanton Weaver

IPC分类号： H01L29/40 ,  H05K3/00

CPC分类号： F25B21/00 ,  F25B2321/003 ,  Y02B30/66 ,  Y10T29/49147

摘要： A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.

摘要翻译： 一种热转印装置，具有第一基底层，第二基底层和设置在第一基底层和第二基底层之间的第一和第二电极。 热转印装置还包括设置在第一电极和第二电极之间的释放层和邻近第一和第二电极设置的致动器。 致动器适于将第一和第二电极与释放层分开以打开第一和第二电极之间的热电穿孔间隙，并且其中致动器适于主动地控制热电穿孔间隙。

公开(公告)号：US20060068611A1

公开(公告)日：2006-03-30

申请号：US10955639

申请日：2004-09-30

申请人： Stanton Weaver ,  James Bray ,  Ahmed Elasser ,  Seth Taylor

发明人： Stanton Weaver ,  James Bray ,  Ahmed Elasser ,  Seth Taylor

IPC分类号： H05K1/00 ,  C23C14/00 ,  B32B37/00 ,  H01S4/00

CPC分类号： H01J45/00 ,  B32B2310/024 ,  H01L35/00 ,  Y10T29/49002

摘要： A method of manufacturing a heat transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier on the first or second thermally conductive substrates and disposing a low work function material on the first or second thermally conductive substrates in an area oriented between the patterned electrical barrier in a configuration in which the first and second thermally conductive substrates are positioned opposite from one another. The method also includes bonding the first and second thermally conductive substrates in the configuration and extracting a plurality of units having opposite sections of the first and second thermally conductive substrates, each unit having a portion of the patterned electrical barrier disposed about the low work function material.

摘要翻译： 一种制造传热装置的方法，包括提供基本上原子上平坦的第一和第二导热基板，在第一或第二导热基板上提供图案化的电阻挡层，并将低功函数材料设置在第一或第二导热基板上 在其中第一和第二导热基板彼此相对定位的构造中的图案化电阻挡之间的区域中。 该方法还包括将第一导热基板和第二导热基板结合在一起并且提取具有第一和第二导热基板的相对部分的多个单元，每个单元具有围绕低功函数材料设置的图案化电阻挡部分 。

公开(公告)号：US20050258438A1

公开(公告)日：2005-11-24

申请号：US10851273

申请日：2004-05-21

申请人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

发明人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

IPC分类号： F21K99/00 ,  H01L21/00 ,  H01L25/075 ,  H01L33/64 ,  H01L33/00

CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

公开(公告)号：US20050239227A1

公开(公告)日：2005-10-27

申请号：US10831862

申请日：2004-04-26

申请人： Srinath Aanegola ,  James Petroski ,  Emil Radkov ,  Stanton Weaver

发明人： Srinath Aanegola ,  James Petroski ,  Emil Radkov ,  Stanton Weaver

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/075 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/48 ,  H01L33/52 ,  H01L33/58 ,  H01L33/00

CPC分类号： H01L33/52 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00

摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

摘要翻译： 发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410） ，14,16,212,412）。 透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。 与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。 密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。