公开(公告)号：US20060051895A1

公开(公告)日：2006-03-09

申请号：US11233177

申请日：2005-09-23

申请人： Tomoyuki Abe ,  Yasuo Yamagishi

发明人： Tomoyuki Abe ,  Yasuo Yamagishi

IPC分类号： H01L21/48 ,  H01L21/50 ,  H01L21/4763

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/10165 ,  H01L2224/1182 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73203 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K3/3436 ,  H05K3/3489 ,  H05K3/3494 ,  H05K3/4682 ,  H05K2203/0475 ,  H05K2203/111 ,  Y02P70/613 ,  H01L2224/0401

摘要： A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (30A), with a solder bump electrode (31) containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X′), with an electrode section (21) corresponding to the solder bump electrode (31), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode (31) and the electrode section (21) by pressing the electronic component (30A) against the wiring board (X′), with the solder bump electrodes (31) and the electrode sections (21) abutting against each other.

摘要翻译： 一种电子元件安装板（X）的制造方法，其特征在于，具备将包含焊锡材料的焊料凸块电极（31）加热至高于熔点的第一温度的电子部件（30A）的升温工序 的焊料，同时将与焊料凸块电极（31）对应的电极部分（21）加热到低于第一温度的第二温度的布线板（X'）。 该方法还包括一个接合步骤，用焊料凸块电极（31）和焊料凸块电极（31）将焊料凸块电极（31）和电极部分（21）压接在电路板（30A） 电极部分（21）彼此抵靠。

公开(公告)号：US20060012460A1

公开(公告)日：2006-01-19

申请号：US11232012

申请日：2005-09-22

申请人： Kozo Shimizu ,  Yasuo Yamagishi

发明人： Kozo Shimizu ,  Yasuo Yamagishi

IPC分类号： B05D5/12 ,  H01C8/00 ,  B32B15/02

CPC分类号： H01B1/22 ,  H01B1/02 ,  H01C7/005 ,  H01C7/008 ,  H01C17/06526 ,  H01C17/06586 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K3/321 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2991

摘要： A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or electronic devices can be electrically connected. The conductive composition layer is formed by subjecting to heat treatment at a temperature lower than 230° C. a conductive composition comprising conductive particles having a metal base material and a metal coating material thereon as well as a thermosetting resin having a curing temperature that is lower than 230° C. and/or a thermoplastic resin having a melting point that is lower than 230° C.

公开(公告)号：US4699863A

公开(公告)日：1987-10-13

申请号：US800334

申请日：1985-11-21

申请人： Norio Sawatari ,  Yasuo Yamagishi ,  Katsuji Ebisu ,  Yoshimichi Katagiri ,  Toshiaki Narusawa

发明人： Norio Sawatari ,  Yasuo Yamagishi ,  Katsuji Ebisu ,  Yoshimichi Katagiri ,  Toshiaki Narusawa

IPC分类号： G03G15/20 ,  G03G9/08 ,  G03G9/097 ,  G03G13/20

CPC分类号： G03G13/20 ,  G03G9/09741

摘要： A flash fixing process characterized by using a powdery developing toner comprising at least 80% by weight of a bisphenol A/epichlorohydrin type epoxy resin or a polyester resin as the binder resin, 1 to 10% by weight of a dye or pigment as the colorant and 1 to 10% by weight of a specific aminium compound.

摘要翻译： 一种闪光定影方法，其特征在于使用包含至少80重量％的双酚A /表氯醇型环氧树脂或聚酯树脂作为粘合剂树脂的粉末显影调色剂，1至10重量％的染料或颜料作为着色剂 和1〜10重量％的特定的铵化合物。

公开(公告)号：US20060255817A1

公开(公告)日：2006-11-16

申请号：US11486054

申请日：2006-07-14

申请人： Yasuo Yamagishi

发明人： Yasuo Yamagishi

IPC分类号： G01R31/02

CPC分类号： G01R1/07378 ,  G01R31/2886 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05599

摘要： A probe card including probes, a build-up interconnection layer having a multilayer interconnection structure therein and carrying the probes on a top surface in electrical connection with the multilayer interconnection structure, and a capacitor provided on the build-up interconnection layer in electrical connection with one of the probes via the multilayer interconnection structure, wherein the multilayer interconnection structure includes an inner via-contact in the vicinity of the probe and the capacitor is embedded in a resin insulation layer constituting the build-up layer.

摘要翻译： 一种探针卡，包括探针，其中具有多层互连结构的堆叠互连层，并且在与多层互连结构电连接的顶表面上承载探针;以及电容器，其设置在积层互连层上，与电连接 通过多层互连结构的探针中的一个，其中多层互连结构包括在探针附近的内部通孔接触，并且电容器嵌入构成堆积层的树脂绝缘层中。

公开(公告)号：US07097366B2

公开(公告)日：2006-08-29

申请号：US10990983

申请日：2004-11-18

申请人： Tsuyoshi Aoki ,  Masayuki Kato ,  Yasuo Yamagishi ,  Tomoyuki Akahoshi ,  Nawalage Florence Cooray ,  Mamoru Kurashina

发明人： Tsuyoshi Aoki ,  Masayuki Kato ,  Yasuo Yamagishi ,  Tomoyuki Akahoshi ,  Nawalage Florence Cooray ,  Mamoru Kurashina

IPC分类号： G02B6/36

CPC分类号： G02B6/30 ,  G02B6/4226 ,  G02B6/4239

摘要： An optoelectronic component is mounted at a precise position on a waveguide substrate so as to reduce loss in propagating light, and electrically connect electrodes on the waveguide substrate and the optoelectronic component. The waveguide substrate has an optical waveguide and a recessed portion for mounting the optoelectronic component, and electrodes are arranged on the recessed portion. A great number of globular elastic conductive particles are distributed on the bottom surface of the recessed portion. Thereafter, the optoelectronic component is placed in the recessed portion so as to press the globular elastic conductive particles, and alignment between the optical waveguide in the waveguide substrate and an optical waveguide in the optoelectronic component is adjusted. Then, the optoelectronic component is fixed to the waveguide substrate with an optical adhesive while the alignment is precisely adjusted.

摘要翻译： 光电子部件安装在波导基板上的精确位置，以便减少传播光的损耗，并且电连接波导基板上的电极和光电子部件。 波导基板具有用于安装光电子部件的光波导和凹部，电极布置在凹部上。 大量的球形弹性导电颗粒分布在凹陷部分的底表面上。 此后，将光电子部件放置在凹部中，以便按压球形弹性导电颗粒，并且调整波导基板中的光波导与光电子部件中的光波导之间的对准。 然后，通过光学粘合剂将光电子部件固定在波导基板上，同时精确调整对准。

公开(公告)号：US06947625B2

公开(公告)日：2005-09-20

申请号：US11034924

申请日：2005-01-14

申请人： Motoyuki Nishizawa ,  Masatoshi Ishii ,  Yasuo Yamagishi

发明人： Motoyuki Nishizawa ,  Masatoshi Ishii ,  Yasuo Yamagishi

IPC分类号： G02F1/05 ,  G02F1/295 ,  G02F1/313 ,  G02B6/35

CPC分类号： G02F1/295 ,  G02F1/05 ,  G02F1/313

摘要： The optical deflector comprises: an optical waveguide 12 of a dielectric material having electrooptical effect; and a pair of electrodes 10, 14 opposed to each other across the optical waveguide, an electric field is applied between the opposed electrodes to change a refractive index of the dielectric material to thereby control a propagating direction of signal light propagating in the optical waveguide 12, wherein the dielectric material has a first refractive index in its initial state, has a second refractive index by application of an electric field of a first polarity, and retains as a third refractive index a refractive index obtained after the electric field has been removed. The dielectric material has the third refractive index has the first refractive index by the application of an electric field of a second polarity different from the first polarity and removal of the electric field.

公开(公告)号：US20050123228A1

公开(公告)日：2005-06-09

申请号：US11034924

申请日：2005-01-14

申请人： Motoyuki Nishizawa ,  Masatoshi Ishii ,  Yasuo Yamagishi

发明人： Motoyuki Nishizawa ,  Masatoshi Ishii ,  Yasuo Yamagishi

IPC分类号： G02F1/05 ,  G02F1/295 ,  G02F1/313

CPC分类号： G02F1/295 ,  G02F1/05 ,  G02F1/313

摘要： The optical deflector comprises: an optical waveguide 12 of a dielectric material having electrooptical effect; and a pair of electrodes 10, 14 opposed to each other across the optical waveguide, an electric field is applied between the opposed electrodes to change a refractive index of the dielectric material to thereby control a propagating direction of signal light propagating in the optical waveguide 12, wherein the dielectric material has a first refractive index in its initial state, has a second refractive index by application of an electric field of a first polarity, and retains as a third refractive index a refractive index obtained after the electric field has been removed. The dielectric material has the third refractive index has the first refractive index by the application of an electric field of a second polarity different from the first polarity and removal of the electric field.

摘要翻译： 光偏转器包括：具有电光效应的电介质材料的光波导12; 以及在光波导上彼此相对的一对电极10,14，在相对电极之间施加电场以改变电介质材料的折射率，从而控制在光波导12中传播的信号光的传播方向 其中所述电介质材料在其初始状态下具有第一折射率，通过施加第一极性的电场具有第二折射率，并且将作为第三折射率的折射率保持为在去除电场之后获得的折射率。 电介质材料具有通过施加与第一极性不同的第二极性的电场和电场的去除而具有第一折射率的第一折射率。

公开(公告)号：US06596094B2

公开(公告)日：2003-07-22

申请号：US09993615

申请日：2001-11-27

申请人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

发明人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

IPC分类号： B23K35363

CPC分类号： B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y10T428/12063 ,  Y10T428/12882

摘要： A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

公开(公告)号：US6025258A

公开(公告)日：2000-02-15

申请号：US516284

申请日：1995-08-17

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

摘要翻译： 一种用于在半导体芯片上制造焊料凸块的方法。 制备具有平坦表面的焊球形成构件和以预定图案布置在平坦表面上的多个空腔。 然后用焊膏填充空腔，并将焊球形成构件加热到高于焊料熔点的温度，使得焊膏中的熔融焊料粉由于表面张力而形成焊球。 然后将半导体芯片移动到焊球形成部件，以将加热的焊球从焊球形成部件转移到半导体芯片。

公开(公告)号：US5643831A

公开(公告)日：1997-07-01

申请号：US547532

申请日：1995-10-24

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H05K3/3484 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

摘要翻译： 一种使用具有空腔的焊球形成板制造半导体器件的方法。 该板由具有<110>结晶平面中的平坦表面的硅板制成，并且在<1-11>晶面中平行取向。 通过蚀刻在板的平坦表面上形成空腔，使用具有菱形形状的开口的掩模，其布置成使得菱形的一侧大致平行于<1-11>晶面。 结果，形成了具有楔形底部的空腔。 然后用焊膏填充空腔，并在板中处于倾斜位置的同时加热以在空腔中形成焊球。 然后将焊球从板转移到半导体芯片。