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    Method of manufacturing electronic components using intaglio plate having dual releasing layers
    22.
    发明授权
    Method of manufacturing electronic components using intaglio plate having dual releasing layers 失效
    使用具有双重释放层的凹版印刷电路板制造方法

    公开(公告)号：US06347584B1

    公开(公告)日：2002-02-19

    申请号：US09589346

    申请日：2000-06-08

    申请人： Eiji Kawamoto ,  Kazuhiro Miura ,  Masaaki Hayama ,  Yoshihisa Takase

    发明人： Eiji Kawamoto ,  Kazuhiro Miura ,  Masaaki Hayama ,  Yoshihisa Takase

    IPC分类号： B41N106

    CPC分类号： B41N1/06 ,  B41M1/10 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0393 ,  H05K3/207 ,  H05K2203/0113

    摘要： A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.

    摘要翻译： 使用凹版印刷制造电子元件以提高印刷产量的方法。 使用具有双重释放层结构的凹版1。 在这种结构中，通过化学吸收在凹版1的表面上形成第一释放层2，通过物理吸附在第一释放层上形成第二释放层3。 这种结构使得凹版印刷机1具有稳定的剥离能力，从而提高印刷产率。 此外，由于可以根据需要添加第二释放层3，所以即使在重复使用凹版印刷的情况下也不会降低打印质量。 此外，双释放层结构可以提高凹版印刷版1的释放能力的耐久性。结果，可以以优异的成品率在基板上形成电子部件的图案。

    Voltage converter module
    26.
    发明授权
    Voltage converter module 失效
    电压转换器模块

    公开(公告)号：US06985364B2

    公开(公告)日：2006-01-10

    申请号：US10470552

    申请日：2002-10-04

    申请人： Hiroshi Higashitani ,  Masaaki Hayama ,  Yuji Mido

    发明人： Hiroshi Higashitani ,  Masaaki Hayama ,  Yuji Mido

    IPC分类号： H05K7/06 ,  H01L23/52

    CPC分类号： H01L23/5389 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/16 ,  H01L2924/19105 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

    摘要： A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

    摘要翻译： 电压转换器模块通过多层第一连接层，第一内部布线层，部件内置层，第二内部布线层，第二连接层和电容器安装层而形成，并且构建电容器 - 与树脂复合层。 形成在第一连接层的端子表面上的连接端子，第一内部布线层，第二内部布线层和电容器安装层通过通孔导体彼此电耦合。 第二内部布线层将电压转换器IC耦合到周边组件，两者都被并入组件内置层中。 集成在电容器内置层中的第一电容器和第二电容器安装到电容器安装层。 这种结构形成电路，其中第一电容器耦合到第二电容器，在电压转换器IC和接地之间。

    Manufacturing method of wiring board, and conductive paste used therein
    29.
    发明授权
    Manufacturing method of wiring board, and conductive paste used therein 失效
    接线板的制造方法及其中使用的导电糊

    公开(公告)号：US06514364B2

    公开(公告)日：2003-02-04

    申请号：US09459778

    申请日：1999-12-13

    申请人： Kazuhiro Miura ,  Yoshihisa Takase ,  Masaaki Hayama ,  Eiji Kawamoto ,  Yuji Yagi

    发明人： Kazuhiro Miura ,  Yoshihisa Takase ,  Masaaki Hayama ,  Eiji Kawamoto ,  Yuji Yagi

    IPC分类号： B32B3112

    CPC分类号： H05K3/207 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/386 ,  H05K3/4647 ,  H05K2203/0113

    摘要： The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.

    摘要翻译： 导电粒子可以不受粘合剂层的软化和去除的影响而被烧结。 结果，可以形成高精度的布线图案，而不会导致导电图案的变形。 其包括在膜上填充具有导电性成分和树脂的导电膏的布线图案的槽的步骤，将具有导电性浆料的膜的导电性糊料侧表面粘接到陶瓷基板的粘合剂层侧面的工序 具有粘合剂层的步骤，通过从具有膜，导电浆料，粘合剂层，陶瓷基板和膜的第一层压体剥离薄膜基材，在粘合剂层表面上形成导电图案的步骤，并且将导电浆料填充物 将凹槽放置在粘合剂层的表面上，以及烧制具有陶瓷基板，粘合剂层和导电图案的第二层压体的步骤，去除粘合剂层并烧结导电颗粒，其中导电 糊剂至少（i）在粘合剂层软化之后烧结，或（ii）在粘合剂层被燃烧之后。

    Method for fabricating an electronic part by intaglio printing
    30.
    发明授权
    Method for fabricating an electronic part by intaglio printing 失效
    通过凹版印刷制造电子部件的方法

    公开(公告)号：US5609704A

    公开(公告)日：1997-03-11

    申请号：US309049

    申请日：1994-09-20

    申请人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

    发明人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

    IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/20 ,  H05K3/46 ,  B32B31/12 ,  B32B31/20

    CPC分类号： B82Y30/00 ,  H05K3/207 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K2203/0113 ,  H05K3/4667 ,  H05K3/4685 ,  Y10T156/1064

    摘要： A pattern, in which a groove of an optional position is deeper than that of the other portion, is formed on a surface of a flexible resin sheet by laser process, and then a fluorine-carbon monomolecular film release layer is formed on the surface of the thus obtained pattern, thereby forming an intaglio plate. The intaglio plate is filled with Ag paste and then dried. The intaglio plate is then laminated onto an insulating substrate, on which a thermoplastic resin layer is formed using heat rollers. Thereafter, the intaglio plate is peeled from the insulating substrate so that the pattern of the Ag paste is transferred thereon, and the conductor pattern is formed through burning. Further, an insulating layer is formed so as to cover the conductor pattern and another conductor pattern is formed on the insulating layer, whereby forming a multilayered structure. In some cases, a difference in height of the lower layer conductor pattern is provided and the higher portion thereof functions as a via hole electrode for electrically connecting the lower and upper conductor patterns. Thus, provided are a method of fabricating electronic parts which is capable of forming fine patterns with high accuracy as well as easily fabricating a multilayered structure of a conductor pattern with high performance.

    摘要翻译： 通过激光工艺在柔性树脂片的表面上形成可选择位置的沟槽比其他部分更深的图案，然后在表面上形成氟碳单分子膜剥离层 由此形成凹版，从而形成凹版。 凹版印刷板填充Ag膏，然后干燥。 然后将凹版印刷板层压到绝缘基板上，使用热辊在其上形成热塑性树脂层。 此后，将凹版板从绝缘基板剥离，使得Ag糊料的图案转印到其上，并且通过燃烧形成导体图案。 此外，形成绝缘层以覆盖导体图案，并且在绝缘层上形成另一个导体图案，从而形成多层结构。 在一些情况下，提供下层导体图案的高度差，其较高部分用作用于电连接下导体图案和上导体图案的通孔电极。 因此，提供了一种能够以高精度形成精细图案的电子部件的制造方法，并且容易地制造具有高性能的导体图案的多层结构。