公开(公告)号：US07709968B2

公开(公告)日：2010-05-04

申请号：US10985119

申请日：2004-11-10

申请人： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

发明人： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

摘要： A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：US20050173805A1

公开(公告)日：2005-08-11

申请号：US10985119

申请日：2004-11-10

申请人： Philip Damberg ,  Belgacem Haba ,  David Tuckerman ,  Teck-Gyu Kang

发明人： Philip Damberg ,  Belgacem Haba ,  David Tuckerman ,  Teck-Gyu Kang

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

摘要： A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：US08133808B2

公开(公告)日：2012-03-13

申请号：US11522885

申请日：2006-09-18

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20090133254A1

公开(公告)日：2009-05-28

申请号：US12321210

申请日：2009-01-16

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K3/02

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US08604348B2

公开(公告)日：2013-12-10

申请号：US13155825

申请日：2011-06-08

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K1/00 ,  H05K1/16

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US08378487B2

公开(公告)日：2013-02-19

申请号：US13356752

申请日：2012-01-24

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US08046912B2

公开(公告)日：2011-11-01

申请号：US12321210

申请日：2009-01-16

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K3/02

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US20120126407A1

公开(公告)日：2012-05-24

申请号：US13356752

申请日：2012-01-24

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L23/498 ,  H01L21/762

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20080067663A1

公开(公告)日：2008-03-20

申请号：US11522885

申请日：2006-09-18

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20050279916A1

公开(公告)日：2005-12-22

申请号：US11120711

申请日：2005-05-03

申请人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

发明人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/225

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H04M2250/52 ,  H04N5/2253 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00

摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.

摘要翻译： 公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。 图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。 根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。 各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。