公开(公告)号：US20220306880A1

公开(公告)日：2022-09-29

申请号：US17654586

申请日：2022-03-12

申请人： Yuki Shingai ,  Hiroyuki Naito ,  Keisuke Shiba

发明人： Yuki Shingai ,  Hiroyuki Naito ,  Keisuke Shiba

IPC分类号： C09D11/322 ,  C09D11/107 ,  C09D11/101 ,  C09D11/033 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/112

摘要： Provided is an inkjet active-energy-ray-curable composition including a bisphenol-type methacrylate, a low-viscosity monomer, and an inorganic filler.

公开(公告)号：US07902568B2

公开(公告)日：2011-03-08

申请号：US11993729

申请日：2006-07-10

申请人： Makoto Morikawa ,  Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Yasuharu Ueno ,  Hiroyuki Naito

发明人： Makoto Morikawa ,  Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Yasuharu Ueno ,  Hiroyuki Naito

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.

摘要翻译： 发光模块（2）包括具有导体图案的安装板（1）和经由导线（21）安装在导体图案上的多个发光元件（15）。 当垂直于安装板（1）观察时，每根导线（21）朝向导体图案的延伸方向定向成定向。 这可以防止电线（21）的阴影重叠，从而可以抑制亮度不均匀。

公开(公告)号：US07591409B2

公开(公告)日：2009-09-22

申请号：US11815623

申请日：2006-06-07

申请人： Hiroyuki Naito ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa

发明人： Hiroyuki Naito ,  Satoshi Shida ,  Yasuharu Ueno ,  Makoto Morikawa

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： B23K20/10 ,  H01L21/67138 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.

摘要翻译： 本发明的半导体器件接合装置1包括：在半导体器件10和基板11之间设置凸点14的状态下将半导体器件10向基板11侧按压的按压部件15; 通过对半导体装置10和基板11中的至少一个施加超声波振动来使半导体装置10和基板11相对振动的超声波振动施加部件16; 时间测量部件17，其测量从开始施加超声波振动的时刻到半导体器件10被按压预定距离的时间所需的时间段; 以及控制构件18，其基于由时间测量构件17测量的时间段来控制后续接合期间的超声波振动的输出。

公开(公告)号：USD586764S1

公开(公告)日：2009-02-17

申请号：US29283242

申请日：2007-08-08

申请人： Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Hiroyuki Naito

设计人： Takaari Uemoto ,  Keiji Nishimoto ,  Satoshi Shida ,  Hiroyuki Naito

公开(公告)号：US20090039376A1

公开(公告)日：2009-02-12

申请号：US11631583

申请日：2005-07-26

申请人： Takaari Uemoto ,  Hiroyuki Naito

发明人： Takaari Uemoto ,  Hiroyuki Naito

IPC分类号： H01L33/00

CPC分类号： H01L24/11 ,  F21K9/20 ,  F21K9/233 ,  F21K9/90 ,  F21V5/007 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/1134 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

摘要： Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a).

摘要翻译： 提供了具有高可靠性并且几乎不引起发光器件和导电焊盘之间的导电故障的光源。 在本发明的LED光源中，使用凸块（55a，55b）将LED裸芯片安装在基板的导电焊盘上。 LED裸芯片（D65）在后表面设置有p电极（Lp）和n电极（Ln）。 p电极（Lp）的面积比n电极（Ln）大。 p电极（Lp）经由四个凸块（55a）与相应的导电焊盘接合，而n电极（Ln）通过一个凸块（55b）与相应的导电焊盘接合。 n电极（Ln）和凸块（55b）之间的接合面积（Sn）大于p电极（Lp）和凸块（55a）之间的接合面积（Sp）。

公开(公告)号：US20050119486A1

公开(公告)日：2005-06-02

申请号：US10481262

申请日：2002-03-20

申请人： Toshiharu Ohta ,  Satoshi Komoriya ,  Toshiharu Yoshino ,  Kouichi Uoto ,  Yumi Nakamoto ,  Hiroyuki Naito ,  Akiyoshi Mochizuki ,  Tsutomu Nagata ,  Hideyuki Kanno ,  Noriyasu Haginoya ,  Kenji Yoshikawa ,  Masatoshi Nagamochi ,  Syozo Kobayashi ,  Makoto Ono

发明人： Toshiharu Ohta ,  Satoshi Komoriya ,  Toshiharu Yoshino ,  Kouichi Uoto ,  Yumi Nakamoto ,  Hiroyuki Naito ,  Akiyoshi Mochizuki ,  Tsutomu Nagata ,  Hideyuki Kanno ,  Noriyasu Haginoya ,  Kenji Yoshikawa ,  Masatoshi Nagamochi ,  Syozo Kobayashi ,  Makoto Ono

IPC分类号： C07D401/12 ,  A61K20060101 ,  A61P20060101 ,  A61P7/02 ,  A61P9/00 ,  A61P9/10 ,  A61P29/00 ,  C07D20060101 ,  C07D209/42 ,  C07D401/14 ,  C07D417/12 ,  C07D417/14 ,  C07D487/04 ,  C07D495/04 ,  C07D498/04 ,  C07D513/04 ,  C07D513/14 ,  C07D519/00 ,  C07K5/06 ,  C07K5/08 ,  C07D405/00

CPC分类号： C07D487/04 ,  A61K31/428 ,  A61K31/429 ,  A61K31/4365 ,  A61K31/437 ,  A61K31/4439 ,  A61K31/444 ,  A61K31/454 ,  A61K31/4545 ,  C07D209/42 ,  C07D401/12 ,  C07D401/14 ,  C07D417/12 ,  C07D417/14 ,  C07D495/04 ,  C07D498/04 ,  C07D513/04 ,  C07D513/14 ,  C07K5/06191 ,  C07K5/0827

摘要： A compound represented by the general formula (1): Q1-Q2-T0-N(R1)-Q3-N(R2)-T1-Q4  (1) wherein R1 and R2 are hydrogen atoms or the like; Q1 is a saturated or unsaturated, 5- or 6-membered cyclic hydrocarbon group which may be substituted, or the like; Q2 is a single bond or the like; Q3 is a group in which Q5 is an alkylene group having 1 to 8 carbon atoms, or the like; and T0 and T1 are carbonyl groups or the like; a salt thereof, a solvate thereof, or an N-oxide thereof. The compound is useful as an agent for preventing and/or treating cerebral infarction, cerebral embolism, myocardial infarction, angina pectoris, pulmonary infarction, pulmonary embolism, Buerger's disease, deep venous thrombosis, disseminated intravascular coagulation syndrome, thrombus formation after valve or joint replacement, thrombus formation and reocclusion after angioplasty, systemic inflammatory response syndrome (SIRS), multiple organ dysfunction syndrome (MODS), thrombus formation during extracorporeal circulation, or blood clotting upon blood drawing.

摘要翻译： 由通式（1）表示的化合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> Q ^{1 -N（R 1） - N（R 2） - N（R 2） - T （1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R 1 < / SUP>和R 2是氢原子等; Q 1是可被取代的饱和或不饱和的5或6元环烃基，等等; Q 2是单键等; Q 3是其中Q 5是具有1〜8个碳原子的亚烷基等的基团; T 0和T 1是羰基等; 其盐，其溶剂合物或其N-氧化物。 该化合物可用作预防和/或治疗脑梗塞，脑栓塞，心肌梗死，心绞痛，肺梗塞，肺栓塞，Buerger病，深静脉血栓形成，弥散性血管内凝血综合征，瓣膜或关节置换后血栓形成 ，血管成形术后的血栓形成和再闭塞，全身炎症反应综合征（SIRS），多器官功能障碍综合征（MODS），体外循环期间的血栓形成或血液抽血时的凝血。}

公开(公告)号：US20050110161A1

公开(公告)日：2005-05-26

申请号：US10958246

申请日：2004-10-06

申请人： Hiroyuki Naito ,  Satoshi Shida ,  Hiroshi Haji ,  Makoto Morikawa

发明人： Hiroyuki Naito ,  Satoshi Shida ,  Hiroshi Haji ,  Makoto Morikawa

IPC分类号： H01L21/607 ,  H01L23/485 ,  H01L23/498 ,  H01L33/62 ,  H01L23/48

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/1131 ,  H01L2224/1134 ,  H01L2224/11505 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81194 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85424 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： By arranging bonding members formed of a gold nanopaste between chip-electrodes and board-electrodes, making the chip-electrodes are brought in contact with the respective board-electrodes via the bonding members and applying ultrasonic vibrations to the bonding members in the contact state, the bonding members are bonded to the board-electrodes and the chip-electrodes.

摘要翻译： 通过在芯片电极和板电极之间设置由金纳米糊状物形成的接合部件，通过接合部件使芯片电极与各个基板电极接触，并且在接触状态下对接合部件施加超声波振动， 接合部件与基板电极和芯片电极接合。

公开(公告)号：US6071943A

公开(公告)日：2000-06-06

申请号：US200750

申请日：1998-11-30

申请人： Noriaki Shioiri ,  Tadashi Mikami ,  Shinichi Morimoto ,  Kazuo Yamazaki ,  Hiroyuki Naito ,  Junji Okawa ,  Noriyuki Kawamoto ,  Hiroshi Hasegawa ,  Koichi Tachibana ,  Susumu Sato ,  Toshio Yokoyama

发明人： Noriaki Shioiri ,  Tadashi Mikami ,  Shinichi Morimoto ,  Kazuo Yamazaki ,  Hiroyuki Naito ,  Junji Okawa ,  Noriyuki Kawamoto ,  Hiroshi Hasegawa ,  Koichi Tachibana ,  Susumu Sato ,  Toshio Yokoyama

IPC分类号： C07D233/54 ,  C07D233/64 ,  C07D233/70 ,  C07D405/12 ,  A01N43/50

CPC分类号： C07D233/64 ,  C07D405/12

摘要： Disclosed herein are an imidazole derivative represented by the following general formula (1): ##STR1## wherein R.sup.1 is a hydrogen atom, or an alkyl, alkoxy or alkoxycarbonyl group, and R.sup.2, R.sup.3 and R.sup.4 are the same or different from one another and are independently a hydrogen or halogen atom, an alkyl, halogenoalkyl, hydroxyl or alkoxy group, or the like, or a salt thereof, and a medicine comprising such a compound. The compound specifically suppresses the production of particular cytokine and is hence useful as an active ingredient for immune function modulators and the like.

摘要翻译： 本文公开了由以下通式（1）表示的咪唑衍生物：其中R1是氢原子或烷基，烷氧基或烷氧基羰基，R2，R3和R4彼此相同或不同，独立地为 氢或卤素原子，烷基，卤代烷基，羟基或烷氧基等，或其盐，以及包含这种化合物的药物。 该化合物特别抑制特定细胞因子的产生，因此可用作免疫功能调节剂等的活性成分。

公开(公告)号：US5292799A

公开(公告)日：1994-03-08

申请号：US928478

申请日：1992-08-12

申请人： Hiroyuki Naito ,  Tomio Suzuki ,  Kimie Watanabe

发明人： Hiroyuki Naito ,  Tomio Suzuki ,  Kimie Watanabe

IPC分类号： C08K5/00 ,  C08K5/55 ,  C09D183/04 ,  C08K3/10

CPC分类号： C08K5/0025 ,  C08K5/55 ,  Y10S528/901

摘要： A solvent-free, cold-setting ternary organosiloxane composition is disclosed, which contains (A) liquid organopolysiloxane, (B) a cross-linking agent, and (C) a curing catalyst, said organopolysiloxane (A) being constituted by organosilicon group of X--Si (wherein X represents a hydrogen atom or a monovalent hydrocarbyl group) and functional side chain of OR (wherein R represents a hydrogen atom, a C.sub.1 -C.sub.5 alkyl group or an acyl group), said cross-linking agent (B) being one or more organometallic compounds selected from the group consisting of an organoaluminum compound, an organoboron compound, an organosilicon compound, an organotitanium compound and an organozirconium compound having at least one functional group selected from among an alkoxy group, an acyloxy group and an oxime group, and said curing catalyst (C) being a metal-containing organic compound, with the total contents of the metal elements of the ternary composition being 40% by weight or more in terms of MO.sub.y/2 (wherein M represents aluminum, boron, silicon, titanium or zirconium, and y represents a valency of the metal element). A transparent film, a coating material, a binder and a structure formed by using same are also disclosed.

摘要翻译： 公开了一种无溶剂的冷固三元有机硅氧烷组合物，其含有（A）液体有机聚硅氧烷，（B）交联剂和（C）固化催化剂，所述有机聚硅氧烷（A）由有机硅基团 所述交联剂（B）的X-Si（其中X表示氢原子或一价烃基）和OR的官能侧链（其中R表示氢原子，C1-C5烷基或酰基） 是选自有机铝化合物，有机硼化合物，有机硅化合物，有机钛化合物和具有至少一个选自烷氧基，酰氧基和肟中的官能团的有机锆化合物的一种或多种有机金属化合物 并且所述固化催化剂（C）是含金属的有机化合物，三元组成的金属元素的总含量以MOy / 2计为40重量％以上（其中M 表示铝，硼，硅，钛或锆，y表示金属元素的价）。 还公开了透明膜，涂料，粘合剂和使用它们形成的结构。

公开(公告)号：US4750103A

公开(公告)日：1988-06-07

申请号：US749478

申请日：1985-06-27

申请人： Toshimi Abo ,  Hiroyuki Naito ,  Hatsuo Nagaishi ,  Kunifumi Sawamoto ,  Tatsuo Morita ,  Yoshihisa Kawamura

发明人： Toshimi Abo ,  Hiroyuki Naito ,  Hatsuo Nagaishi ,  Kunifumi Sawamoto ,  Tatsuo Morita ,  Yoshihisa Kawamura

IPC分类号： F02P5/152 ,  G01L23/22 ,  F02D41/04

CPC分类号： G01L23/225 ,  F02P5/152 ,  Y02T10/46

摘要： A system for detecting and controlling an engine knocking the determination of occurrence of knocking is based on a present data on the detected pressure vibration energy in a combustion chamber of the engine and a value associated with a previous data on the detected pressure vibration energy in the combustion chamber so that an accurate detection of engine knocking can always be achieved. Furthermore, the knocking can be discriminated from the background noise even when the engine revolution speed is high.

摘要翻译： 用于检测和控制引擎敲击敲击发生的确定的系统基于关于在发动机的燃烧室中检测到的压力振动能量的现有数据，以及与先前关于检测到的压力振动能量的数据相关联的值 燃烧室，从而始终可以实现发动机爆震的准确检测。 此外，即使在发动机转速高的情况下，也可以与背景噪声区分开。