公开(公告)号：US20190301034A1

公开(公告)日：2019-10-03

申请号：US16432857

申请日：2019-06-05

Applicant: Fabric8Labs, Inc.

Inventor： David Forrest Pain ,  David Morgan Wirth ,  Jeffrey William Herman

IPC: C25D1/00 ,  C25D15/00 ,  B33Y70/00 ,  C25D3/38 ,  C25D3/22 ,  C25D3/40 ,  B33Y30/00 ,  C25D3/12 ,  C25D3/20 ,  C25D3/24 ,  C25D21/12 ,  C25D3/44 ,  C25D3/46 ,  C25D5/04 ,  C25D5/10 ,  C25D9/02 ,  B33Y10/00 ,  B33Y50/02 ,  C25D17/12

Abstract: An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller. in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.

公开(公告)号：US10351965B2

公开(公告)日：2019-07-16

申请号：US15028051

申请日：2014-04-16

Applicant: Oriental Electro Plating Corporation

Inventor： Hiroyoshi Takahashi

IPC: C25D5/50 ,  C25D5/12 ,  H01R13/03 ,  C25D3/12 ,  C25D3/40 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48 ,  C25F1/00 ,  C25F5/00 ,  C25D3/30

Abstract: Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

公开(公告)号：US09777385B2

公开(公告)日：2017-10-03

申请号：US15415246

申请日：2017-01-25

Applicant: Fabric8Labs, Inc.

Inventor： David Morgan Wirth ,  David Forest Pain ,  Jeffrey William Herman

IPC: C25D1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/00 ,  C25D3/12 ,  C25D3/20 ,  C25D3/24 ,  C25D3/40 ,  C25D3/44 ,  C25D3/46 ,  C25D5/04 ,  C25D5/10 ,  C25D9/02 ,  C25D21/12 ,  C25D3/22 ,  C25D3/38 ,  C25D17/12

CPC classification number: C25D1/003 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/00 ,  C25D3/12 ,  C25D3/20 ,  C25D3/22 ,  C25D3/24 ,  C25D3/38 ,  C25D3/40 ,  C25D3/44 ,  C25D3/46 ,  C25D5/04 ,  C25D5/10 ,  C25D9/02 ,  C25D15/00 ,  C25D17/12 ,  C25D21/12

Abstract: An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

公开(公告)号：US09637833B2

公开(公告)日：2017-05-02

申请号：US13726251

申请日：2012-12-24

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Matsuko Saito ,  Makoto Sakai ,  Shinjiro Hayashi

IPC: C25D3/40 ,  C25D5/02 ,  H01L21/288 ,  C25D3/38

CPC classification number: C25D3/38 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76898 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2201/0959

Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.

公开(公告)号：US20170107637A1

公开(公告)日：2017-04-20

申请号：US15394937

申请日：2016-12-30

Applicant: The Royal Mint Limited

Inventor： Jeffrey L. Conroy ,  Philip B. Forshee ,  James A. Shearer

IPC: C25D15/00 ,  G07D7/12 ,  C25D17/06 ,  G07D5/00 ,  C25D7/00 ,  C25D3/40

CPC classification number: C25D7/00 ,  B32B15/01 ,  C23C18/1637 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1662 ,  C23C18/31 ,  C23C18/36 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D3/58 ,  C25D5/02 ,  C25D5/10 ,  C25D7/005 ,  C25D15/00 ,  C25D17/16 ,  G07D5/00 ,  G07D7/12 ,  G07F7/0813 ,  Y10T428/12493

Abstract: Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.

公开(公告)号：US5665219A

公开(公告)日：1997-09-09

申请号：US446824

申请日：1995-06-01

Applicant: Ning Yu

Inventor： Ning Yu

IPC: C25D3/30 ,  C25D3/40 ,  C25D5/10 ,  C25D5/44 ,  H01B13/00 ,  C25D7/06

CPC classification number: C25D5/10 ,  C25D5/44

Abstract: Process for continuous manufacture of an electrical conductor consisting of an at least partially aluminium-based central core coated by continuous electrodeposition with at least one metal layer, including pretreatment of the surface of the core, characterized in that the following are subsequently performed successively on the core,a) an electrochemical deposition of copper in an aqueous bath maintained at a temperature of between 20.degree. C. and 60.degree. C., containing KCN, CuCN, K.sub.2 CO.sub.3 and KNaC.sub.4 H.sub.4 O.sub.6 with a current intensity of between 1 and 10 A/dm.sup.2 ;b) rinsing at ambient temperature;c) an electrochemical deposition of tin in an aqueous bath maintained at a temperature of between 20.degree. C. and 60.degree. C., containing essentially tin dissolved in methanesulphonic acid and, optionally, additives, with a current intensity of between 1 and 100 A/dm.sup.2 ;d) rinsing with water at 60.degree. C.

Abstract translation: PCT No.PCT / FR93 / 01148 Sec。 371日期：1995年6月1日 102（e）1995年6月1日PCT 1993年11月22日PCT公布。 公开号WO94 / 13866 日期1994年6月23日连续制造电导体的方法，该电导体由至少部分铝基中心芯组成，所述至少部分铝基中心芯通过连续电沉积涂覆有至少一个金属层，包括芯的表面的预处理，其特征在于： 随后在芯上连续进行a）在保持在20℃至60℃的水浴中的铜的电化学沉积，其含有KCN，CuCN，K 2 CO 3和KNaC 4 H 4 O 6，电流强度介于1和 10 A / dm2; b）在环境温度下冲洗; c）在维持在20℃至60℃的水浴中的锡的电化学沉积，其基本上含有溶解在甲磺酸中的锡和任选的添加剂，其电流强度为1至100A / dm2; d）在60℃下用水冲洗

公开(公告)号：US3532610A

公开(公告)日：1970-10-06

申请号：US3532610D

申请日：1967-10-27

Applicant: KEWANEE OIL CO

Inventor： ROSE ARTHUR H DU

IPC: C07D293/10 ,  C07D517/04 ,  C25D3/40 ,  C23B5/18 ,  C23B5/46

CPC classification number: C07D293/10 ,  C07D517/04 ,  C25D3/40

公开(公告)号：US3497530A

公开(公告)日：1970-02-24

申请号：US3497530D

申请日：1969-05-05

Applicant: KEWANEE OIL CO

Inventor： MOY PAUL W

IPC: C25D3/40 ,  C07D99/00

CPC classification number: C25D3/40

公开(公告)号：US3351656A

公开(公告)日：1967-11-07

申请号：US46866565

申请日：1965-05-18

Applicant: ALLIED RES PRODUCTS INC

Inventor： PETER LEENDERS ,  CREUTZ HANS G

IPC: C07C59/105 ,  C25D3/40

CPC classification number: C25D3/40 ,  C07C59/105

公开(公告)号：US3309293A

公开(公告)日：1967-03-14

申请号：US41154364

申请日：1964-11-16

Applicant: ELECHEM CORP

Inventor： OSTROW BARNET D ,  NOBEL FRED I

IPC: C25D3/40

CPC classification number: C25D3/40