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    High Density Split-Gate Memory Cell
    331.
    发明申请
    High Density Split-Gate Memory Cell 审中-公开
    高密度分离栅极存储单元

    公开(公告)号：US20160217849A1

    公开(公告)日：2016-07-28

    申请号：US15002302

    申请日：2016-01-20

    Applicant: Silicon Storage Technology, Inc.

    Inventor： Nhan Do ,  Xian Liu ,  Vipin Tiwari ,  Hieu Van Tran

    IPC: G11C11/419 ,  G11C16/14 ,  H01L29/66 ,  H01L29/423 ,  H01L29/788

    CPC classification number: G11C11/419 ,  G11C16/0458 ,  G11C16/14 ,  H01L27/11521 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7887

    Abstract: A method of forming a memory device that includes forming on a substrate, a first insulation layer, a first conductive layer, a second insulation layer, a second conductive layer, a third insulation layer. First trenches are formed through third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer, leaving side portions of the first conductive layer exposed. A fourth insulation layer is formed at the bottom of the first trenches that extends along the exposed portions of the first conductive layer. The first trenches are filled with conductive material. Second trenches are formed through the third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer. Drain regions are formed in the substrate under the second trenches. A pair of memory cells results, with a single continuous channel region extending between drain regions for the pair of memory cells.

    Abstract translation: 一种形成存储器件的方法，包括在衬底上形成第一绝缘层，第一导电层，第二绝缘层，第二导电层，第三绝缘层。 第一沟槽通过第三绝缘层，第二导电层，第二绝缘层和第一导电层形成，从而使第一导电层的侧面部分露出。 第一绝缘层形成在沿第一导电层的暴露部分延伸的第一沟槽的底部。 第一个沟槽填充有导电材料。 第二沟槽通过第三绝缘层，第二导电层，第二绝缘层和第一导电层形成。 在第二沟槽下的衬底中形成漏区。 导致一对存储单元，其中单个连续沟道区域在用于该对存储单元的漏极区域之间延伸。

    Split Gate Non-volatile Flash Memory Cell Having Metal Gates And Method Of Making Same
    332.
    发明申请
    Split Gate Non-volatile Flash Memory Cell Having Metal Gates And Method Of Making Same 有权
    具有金属门的分流门非易失性闪存单元及其制作方法

    公开(公告)号：US20160197088A1

    公开(公告)日：2016-07-07

    申请号：US14589650

    申请日：2015-01-05

    Applicant: Silicon Storage Technology, Inc.

    Inventor： Chun-Ming Chen ,  Man-Tang Wu ,  Jeng-Wei Yang ,  Chien-Sheng Su

    IPC: H01L27/115 ,  H01L29/51 ,  H01L29/49 ,  H01L29/66 ,  H01L21/28 ,  H01L21/02 ,  H01L29/788 ,  H01L29/423 ,  H01L29/45

    CPC classification number: H01L27/11521 ,  H01L21/02181 ,  H01L21/02186 ,  H01L21/02189 ,  H01L21/28273 ,  H01L27/11524 ,  H01L29/42328 ,  H01L29/45 ,  H01L29/4916 ,  H01L29/495 ,  H01L29/511 ,  H01L29/517 ,  H01L29/66825 ,  H01L29/788 ,  H01L29/7881

    Abstract: A non-volatile memory cell includes a substrate of a first conductivity type, having a first region of a second conductivity type, a second region of the second conductivity type spaced apart from the first region, forming a channel region therebetween. A floating gate is disposed over and insulated from a first portion of the channel region which is adjacent the first region. A select gate is disposed over a second portion of the channel region adjacent to the second region, the select gate being formed of a metal material and being insulated from the second portion of the channel region by a layer of silicon dioxide and a layer of high K insulating material. A control gate is disposed over and insulated from the floating gate. An erase gate is disposed over and insulated from the first region, and disposed laterally adjacent to and insulated from the floating gate.

    Abstract translation: 非易失性存储单元包括第一导电类型的衬底，具有第二导电类型的第一区域，与第一区域间隔开的第二导电类型的第二区域，在它们之间形成沟道区域。 浮置栅极设置在与第一区域相邻的沟道区域的第一部分之上并与其绝缘。 选择栅极设置在与第二区域相邻的沟道区域的第二部分上，选择栅极由金属材料形成并且通​​过二氧化硅层和高层与沟道区域的第二部分绝缘 K绝缘材料。 控制栅极设置在浮动栅极上并与浮动栅极绝缘。 擦除栅极设置在第一区域的上方并与第一区域绝缘，并且横向地邻近浮动栅极并与其隔离。

    Method Of Making Embedded Memory Device With Silicon-On-Insulator Substrate
    335.
    发明申请
    Method Of Making Embedded Memory Device With Silicon-On-Insulator Substrate 有权
    使用绝缘体上硅衬底制造嵌入式存储器件的方法

    公开(公告)号：US20160086962A1

    公开(公告)日：2016-03-24

    申请号：US14491596

    申请日：2014-09-19

    Applicant: Silicon Storage Technology, Inc.

    Inventor： Chien-Sheng Su ,  Hieu Van Tran ,  Mandana Tadayoni ,  Nhan Do ,  Jeng-Wei Yang

    IPC: H01L27/115 ,  H01L21/762 ,  H01L29/423 ,  H01L21/306 ,  H01L29/66 ,  H01L29/06

    CPC classification number: H01L27/11531 ,  H01L21/28273 ,  H01L21/30604 ,  H01L21/76224 ,  H01L21/7624 ,  H01L27/11521 ,  H01L27/11534 ,  H01L27/1207 ,  H01L29/0649 ,  H01L29/42328 ,  H01L29/66825

    Abstract: A method of forming a semiconductor device starts with a substrate of silicon, a first insulation layer on the silicon, and a silicon layer on the first insulation layer. The silicon layer and the insulation layer are removed just from a second substrate area. A second insulation layer is formed over the silicon layer in the substrate first area and over the silicon in the second substrate area. A first plurality of trenches is formed in the first substrate area that each extends through all the layers and into the silicon. A second plurality of trenches is formed in the second substrate area that each extends through the second insulation layer and into the silicon. An insulation material is formed in the first and second trenches. Logic devices are formed in the first substrate area, and memory cells are formed in the second substrate area.

    Abstract translation: 形成半导体器件的方法从硅衬底，硅上的第一绝缘层和第一绝缘层上的硅层开始。 仅从第二衬底区域去除硅层和绝缘层。 第二绝缘层形成在衬底第一区域中的硅层之上并且在第二衬底区域中的硅上方。 第一多个沟槽形成在第一衬底区域中，每个沟槽延伸穿过所有层并进入硅中。 第二多个沟槽形成在第二衬底区域中，每个沟槽延伸穿过第二绝缘层并进入硅中。 绝缘材料形成在第一和第二沟槽中。 逻辑器件形成在第一衬底区域中，并且存储器单元形成在第二衬底区域中。

    Double patterning method of forming semiconductor active areas and isolation regions
    336.
    发明授权
    Double patterning method of forming semiconductor active areas and isolation regions 有权
    形成半导体有源区和隔离区的双重图案化方法

    公开(公告)号：US09293358B2

    公开(公告)日：2016-03-22

    申请号：US14162309

    申请日：2014-01-23

    Applicant: Silicon Storage Technology, Inc.

    Inventor： Jeng-Wei Yang ,  Chien-Sheng Su

    IPC: H01L21/336 ,  H01L21/762 ,  H01L21/308

    CPC classification number: H01L21/76224 ,  H01L21/3086 ,  H01L21/3088

    Abstract: A method of forming active areas and isolation regions in a semiconductor substrate using a double patterning process. The method include forming a first material on the substrate surface, forming a second material on the first material, forming a plurality of first trenches into the second material wherein the plurality of first trenches are parallel to each other, forming a second trench into the second material wherein the second trench is perpendicular to and crosses the plurality of first trenches in a central region of the substrate, filling the first and second trenches with a third material, removing the second material to form third trenches in the third material that are parallel to each other and do not extend through the central region of the substrate, and extending the third trenches through the first material and into the substrate.

    Abstract translation: 使用双重图案化工艺在半导体衬底中形成有源区和隔离区的方法。 该方法包括在衬底表面上形成第一材料，在第一材料上形成第二材料，在第二材料中形成多个第一沟槽，其中多个第一沟槽彼此平行，形成第二沟槽 材料，其中所述第二沟槽在所述衬底的中心区域中垂直于所述第一沟槽并与所述多个第一沟槽交叉，用第三材料填充所述第一和第二沟槽，移除所述第二材料以在所述第三材料中形成平行于所述第三材料的第三沟槽 彼此不延伸穿过衬底的中心区域，并且延伸第三沟槽穿过第一材料并进入衬底。

    Non-volatile memory cell with self aligned floating and erase gates, and method of making same
    337.
    发明授权
    Non-volatile memory cell with self aligned floating and erase gates, and method of making same 有权
    具有自对准浮动和擦除栅极的非易失性存储单元及其制造方法

    公开(公告)号：US09293204B2

    公开(公告)日：2016-03-22

    申请号：US14252929

    申请日：2014-04-15

    Applicant: Silicon Storage Technology, Inc.

    Inventor： Nhan Do ,  Jinho Kim ,  Xian Liu

    IPC: H01L29/788 ,  H01L27/115 ,  G11C16/04 ,  G11C16/14 ,  H01L29/66 ,  H01L29/423

    CPC classification number: G11C16/14 ,  G11C16/0416 ,  H01L27/11521 ,  H01L27/11553 ,  H01L29/42328 ,  H01L29/42336 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7889

    Abstract: A memory device, and method of making the same, in which a trench is formed into a substrate of semiconductor material. The source region is formed under the trench, and the channel region between the source and drain regions includes a first portion that extends substantially along a sidewall of the trench and a second portion that extends substantially along the surface of the substrate. The floating gate is disposed in the trench, and is insulated from the channel region first portion for controlling its conductivity. A control gate is disposed over and insulated from the channel region second portion, for controlling its conductivity. An erase gate is disposed at least partially over and insulated from the floating gate. An electrically conductive coupling gate is disposed in the trench, adjacent to and insulated from the floating gate, and over and insulated from the source region.

    Abstract translation: 存储器件及其制造方法，其中将沟槽形成为半导体材料的衬底。 源极区形成在沟槽下方，并且源极和漏极区域之间的沟道区域包括基本上沿着沟槽的侧壁延伸的第一部分和基本上沿着衬底的表面延伸的第二部分。 浮栅设置在沟槽中，与沟道区第一部分绝缘，用于控制其导电性。 控制栅极设置在沟道区第二部分之上并与沟道区第二部分绝缘，以控制其导电性。 擦除栅极至少部分地布置在浮栅上并与浮栅绝缘。 导电耦合栅极设置在沟槽中，与浮动栅极相邻并与其隔离，并且与源极区域隔离并且绝缘。

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