公开(公告)号：US08178390B2

公开(公告)日：2012-05-15

申请号：US11817520

申请日：2006-02-20

Applicant: Joachim Mahler ,  Alfred Haimerl ,  Michael Bauer ,  Angela Kessler ,  Wolfgang Schober

Inventor： Joachim Mahler ,  Alfred Haimerl ,  Michael Bauer ,  Angela Kessler ,  Wolfgang Schober

IPC: H01L21/00

CPC classification number: H01L23/49894 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.

Abstract translation: 公开了半导体部件。 在一个实施例中，半导体部件包括布置在基板上的半导体芯片和至少部分地围绕半导体芯片的壳体。 衬底至少部分地设置有聚合物泡沫层。

公开(公告)号：US07834467B2

公开(公告)日：2010-11-16

申请号：US11692322

申请日：2007-03-28

Applicant: Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/28 ,  H01L23/495

CPC classification number: H01L23/3142 ,  B82Y10/00 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S977/742 ,  Y10S977/785 ,  Y10S977/831 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

Abstract translation: 一层改善了半导体器件中不同部件的界面之间的粘附。 第一部件的界面包括电路载体的表面，第二部件的界面包括塑料封装模塑料的接触表面。 粘附改善层包括聚合链分子和碳纳米管的混合物。

公开(公告)号：US07728053B2

公开(公告)日：2010-06-01

申请号：US11511518

申请日：2006-08-29

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: C08K9/00

CPC classification number: H01L23/293 ,  B29C45/0001 ,  B29C45/0013 ,  B29C45/14655 ,  B29K2101/10 ,  C08J3/241 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plastic housing composition for embedding semiconductor devices in a plastic housing includes a multicomponent plastic material, where at least one component is distributed in the plastic material in drop-shaped and/or spherical units. The drop-shaped and/or spherical units are surrounded by dimensionally stable sheaths made from a plastic sheath material. The multicomponent plastic further includes a reactive curing system that cures when the plastic sheaths are torn open. The dimensionally stable plastic sheath material is deformation-sensitive, so that the sheaths tear open under mechanical deformation loading, which initiates and/or accelerates the curing process.

Abstract translation: 用于将半导体器件嵌入塑料壳体中的塑料外壳组合物包括多组分塑料材料，其中至少一种组分以液滴形式和/或球形单元分布在塑料材料中。 液滴形状和/或球形单元被由塑料护套材料制成的尺寸稳定的护套包围。 多组分塑料还包括当塑料护套被撕开时固化的反应性固化体系。 尺寸稳定的塑料护套材料是变形敏感的，使得护套在机械变形负载下撕开，这引发和/或加速固化过程。

公开(公告)号：US07629660B2

公开(公告)日：2009-12-08

申请号：US11446253

申请日：2006-06-02

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L31/16

CPC classification number: H01L27/14618 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2221/68363 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/82

Abstract: A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which itself includes a transparent plastic material. The sensor chip has an active top side and a back side, wherein a sensor area is arranged on the active top side and flipchip contacts are provided outside of the sensor area on the active top side. These flipchip contacts are electrically connected to a circuit structure, wherein the circuit structure allows free access to the sensor area. The sensor chip including the sensor area and the flipchip contacts and a part of the circuit structure which is electrically connected to the flipchip contacts are embedded in the transparent plastic material, wherein the transparent plastic material includes a rubber-elastic substance.

Abstract translation: 公开了一种包括传感器芯片的半导体传感器部件及其制造方法。 在一个实施例中，半导体传感器部件包括本身包括透明塑料材料的封装。 传感器芯片具有有源顶侧和背面，其中传感器区域布置在主动顶侧上，并且触发芯片触点设置在主动顶侧上的传感器区域的外部。 这些倒装芯片触点电连接到电路结构，其中电路结构允许自由地访问传感器区域。 包括传感器区域和倒装芯片触点的传感器芯片和电连接到倒装芯片触点的电路结构的一部分嵌入透明塑料材料中，其中透明塑料材料包括橡胶弹性物质。

公开(公告)号：US20080173097A1

公开(公告)日：2008-07-24

申请号：US11867117

申请日：2007-10-04

Applicant: Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

Inventor： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC: G01L7/00 ,  G03F7/00

CPC classification number: G01L19/0069 ,  G01L19/146 ,  G01L19/147 ,  H01L23/49877 ,  H01L23/5389 ,  H01L31/0203 ,  H01L2224/16245 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/105 ,  H05K3/185 ,  H05K2201/0133 ,  H05K2201/0236 ,  H05K2203/107

Abstract: A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.

Abstract translation: 这里描述了包括具有空腔的壳体和传感器芯片的半导体传感器部件及其制造方法。 壳体包括到壳体的周围的开口，并且传感器芯片包括面向开口的传感器区域。 传感器芯片嵌入壳体的空腔中，其背面和边缘侧面为橡胶弹性层，其中橡胶弹性层包括可切割的有机金属或无机金属络合物。 复合物的金属在橡胶弹性层的顶侧可自由接近的方式形成金属核，用于将传感器芯片的传感器区域与腔室的空腔中的接触垫电连接的布线。

公开(公告)号：US20080111216A1

公开(公告)日：2008-05-15

申请号：US11860556

申请日：2007-09-25

Applicant: Michael BAUER ,  Alfred HAIMERL ,  Angela KESSLER ,  Joachim MAHLER ,  Wolfgang SCHOBER

Inventor： Michael BAUER ,  Alfred HAIMERL ,  Angela KESSLER ,  Joachim MAHLER ,  Wolfgang SCHOBER

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H05K3/284 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/142 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.

Abstract translation: 一种部件装置，包括载体，具有电触头的壳体中的部件和封装载体的模制化合物，壳体中的半导体部件和电触点，其中将部件施加在载体上，并且其中提供载体 具有孔，以及用于制造部件布置的方法，其中，所述载体设置有孔，所述部件位于所述载体上，所述部件连接到所述载体，所述部件与所述载体位于所述引线框架中，并且所述布置 被模塑料包围。

公开(公告)号：US20070268674A1

公开(公告)日：2007-11-22

申请号：US11751755

申请日：2007-05-22

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H05K5/00

CPC classification number: H05K5/062 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L25/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K5/0247 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic module includes a component housing and at least one semiconductor chip. The semiconductor chip is arranged on a circuit carrier in the component housing. The semiconductor chip is connected to an upper face of the circuit carrier via connection elements. In this case, the semiconductor chip, the connection elements and, partially, the circuit carrier are embedded in a plastic housing compound. A metal plate which is structured into lead interconnects and contact connecting pads is provided on the upper face of the component housing.

Abstract translation: 电子模块包括部件壳体和至少一个半导体芯片。 半导体芯片布置在部件壳体中的电路载体上。 半导体芯片通过连接元件连接到电路载体的上表面。 在这种情况下，半导体芯片，连接元件和部分地，电路载体被嵌入在塑料外壳中。 构成引线互连和接触连接焊盘的金属板设置在部件壳体的上表面上。

公开(公告)号：US20070182021A1

公开(公告)日：2007-08-09

申请号：US11620784

申请日：2007-01-08

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H01L23/3192 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity εr lower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.

Abstract translation: 半导体元件包括布置在半导体芯片的布线结构上的倒装芯片触点。 布线结构包括至少一个金属化层和由低k材料制成的至少一个电介质绝缘层，其具有低于二氧化硅的相对介电常数的相对介电常数εεr。 倒装芯片触点布置在上金属化层的接触区域上，并且具有由无铅焊接护套包围的聚合物芯。

公开(公告)号：US20070054530A1

公开(公告)日：2007-03-08

申请号：US11511518

申请日：2006-08-29

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01R13/52

CPC classification number: H01L23/293 ,  B29C45/0001 ,  B29C45/0013 ,  B29C45/14655 ,  B29K2101/10 ,  C08J3/241 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plastic housing composition for embedding semiconductor devices in a plastic housing includes a multicomponent plastic material, where at least one component is distributed in the plastic material in drop-shaped and/or spherical units. The drop-shaped and/or spherical units are surrounded by dimensionally stable sheaths made from a plastic sheath material. The multicomponent plastic further includes a reactive curing system that cures when the plastic sheaths are torn open. The dimensionally stable plastic sheath material is deformation-sensitive, so that the sheaths tear open under mechanical deformation loading, which initiates and/or accelerates the curing process.

Abstract translation: 用于将半导体器件嵌入塑料壳体中的塑料外壳组合物包括多组分塑料材料，其中至少一种组分以液滴形式和/或球形单元分布在塑料材料中。 液滴形状和/或球形单元被由塑料护套材料制成的尺寸稳定的护套包围。 多组分塑料还包括当塑料护套被撕开时固化的反应性固化体系。 尺寸稳定的塑料护套材料是变形敏感的，使得护套在机械变形负载下撕开，这引发和/或加速固化过程。

公开(公告)号：US20060273420A1

公开(公告)日：2006-12-07

申请号：US11446253

申请日：2006-06-02

Applicant: Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

Inventor： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L31/0232 ,  H01L21/00

CPC classification number: H01L27/14618 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2221/68363 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/82

Abstract: A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which itself includes a transparent plastic material. The sensor chip has an active top side and a back side, wherein a sensor area is arranged on the active top side and flipchip contacts are provided outside of the sensor area on the active top side. These flipchip contacts are electrically connected to a circuit structure, wherein the circuit structure allows free access to the sensor area. The sensor chip including the sensor area and the flipchip contacts and a part of the circuit structure which is electrically connected to the flipchip contacts are embedded in the transparent plastic material, wherein the transparent plastic material includes a rubber-elastic substance.