公开(公告)号：US20120264258A1

公开(公告)日：2012-10-18

申请号：US13442878

申请日：2012-04-10

申请人： Junhua LUO ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua LUO ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/78

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US20110189823A1

公开(公告)日：2011-08-04

申请号：US13004028

申请日：2011-01-11

申请人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

发明人： Junhua Luo ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

摘要： A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices.

摘要翻译： 无引线型半导体封装通过将管芯附接到引线框架的标志的顶表面，然后贴合引线框架的标记和引线的底表面而形成。 芯片焊盘通过导线连接到引线，然后将组件放入模具中并用塑料材料封装。 模具追踪在引线框架的标志和引线之间以及引线本身之间具有突起，这导致引线之间以及引脚之间形成凹痕。 该方法对于制造四边形无铅（QFN）器件和功率QFN型器件特别有用。

公开(公告)号：US20100283135A1

公开(公告)日：2010-11-11

申请号：US12753118

申请日：2010-04-02

申请人： Jinzhong YAO ,  Zhigang Bai ,  Junhua Luo ,  Meijiang Song ,  Hong Zhu

发明人： Jinzhong YAO ,  Zhigang Bai ,  Junhua Luo ,  Meijiang Song ,  Hong Zhu

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06165 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame including a lead frame structure having a die support area and a plurality of electrical contact areas has shallow recesses formed on a surface of the lead frame structure.

摘要翻译： 包括具有管芯支撑区域和多个电接触区域的引线框架结构的引线框架具有形成在引线框架结构的表面上的浅凹槽。

公开(公告)号：US20090099454A1

公开(公告)日：2009-04-16

申请号：US11975091

申请日：2007-10-16

申请人： Jinzhong Yao ,  Zhiqiang Chen ,  Wenping Zhou

发明人： Jinzhong Yao ,  Zhiqiang Chen ,  Wenping Zhou

IPC分类号： A61B8/00

CPC分类号： G01S7/5208 ,  A61B8/483 ,  G01S15/8925 ,  G10K11/345 ,  G10K11/346

摘要： An ultrasonic image scanning system for scanning an organic object includes a 2D array probe constructed with transducer elements in both azimuth and elevation dimension. There is a multiplexer disposed in one dimension to route the transducer elements to system front-end channels, while the other dimension can sum into the first dimension with various element number.

摘要翻译： 用于扫描有机物体的超声波图像扫描系统包括由方位角和仰角尺寸的换能器元件构成的2D阵列探针。 有一个多路复用器设置在一个维度上以将换能器元件路由到系统前端通道，而另一个尺寸可以与各种元件数量相加到第一维度中。

公开(公告)号：US09214447B2

公开(公告)日：2015-12-15

申请号：US14277061

申请日：2014-05-14

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

摘要翻译： 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20150294924A1

公开(公告)日：2015-10-15

申请号：US14552497

申请日：2014-11-25

申请人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

发明人： Zhigang Bai ,  Jinzhong Yao ,  Lan Chu Tan

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/58 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

摘要翻译： 半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型 。 集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。 形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。 第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

公开(公告)号：US08901721B1

公开(公告)日：2014-12-02

申请号：US13972885

申请日：2013-08-21

申请人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

发明人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49517 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.

摘要翻译： 基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。 模具通过接合线电连接到引线指。 管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。 一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。 密封剂包括用于接收第二组的引导指的槽或槽。

公开(公告)号：US08859339B2

公开(公告)日：2014-10-14

申请号：US13794789

申请日：2013-03-12

申请人： Zhigang Bai ,  Jinzhong Yao

发明人： Zhigang Bai ,  Jinzhong Yao

IPC分类号： H01L21/56 ,  B29C45/14 ,  B29C70/72 ,  H03K19/0185

CPC分类号： H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H03K19/018521 ,  H01L2924/00014

摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.

摘要翻译： 用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。 第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。 在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

公开(公告)号：US08859336B2

公开(公告)日：2014-10-14

申请号：US13398816

申请日：2012-02-16

申请人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Zhigang Bai ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L21/50 ,  H01L23/433 ,  H01L23/31 ,  H01L23/16 ,  H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

摘要翻译： 一种组装半导体器件的方法包括将半导体管芯的阵列放置在管芯支撑件上。 提供一种帽阵列结构，其具有由帽框架结构支撑的相应的帽阵列。 在模具追逐中，盖阵列结构和模具支撑件上的半导体管芯阵列与盖延伸在对应的半导体管芯上对齐。 半导体管芯阵列和盖阵列通过模具化合物封装在模具追逐中。 将具有相应盖的半导体管芯的封装单元从模具中取出并分离。 编码封装的单元可以包括从封装单元去除盖框架结构。

公开(公告)号：US20140284806A1

公开(公告)日：2014-09-25

申请号：US14183511

申请日：2014-02-18

申请人： Junhua Luo ,  Nan Xu ,  Jinzhong Yao

发明人： Junhua Luo ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/48 ,  H01L25/00

CPC分类号： H01L23/49513 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/8349 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0665

摘要： A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support.

摘要翻译： 半导体器件具有第一半导体管芯和半导体管芯，所述半导体管芯具有在导电管芯支承件上并排连接到第一和第二接合区域的电接触元件和后表面。 将电绝缘材料层施加到模具支撑件的第一结合区域。 一层电绝缘粘合剂粘合材料通过电绝缘材料层将第一半导体管芯的背面附接到管芯支撑件的第一接合区域。 一层导电粘合剂粘合材料将第二半导体管芯的背面连接到管芯支撑件的第二接合区域。