公开(公告)号：US20110100952A1

公开(公告)日：2011-05-05

申请号：US12892047

申请日：2010-09-28

Applicant: Ji-Eun KIM ,  Nam-Keun Oh ,  Jung-Hyun Park ,  Young-Ji Kim ,  Jong-Gyu Choi ,  Sang-Duck Kim

Inventor： Ji-Eun KIM ,  Nam-Keun Oh ,  Jung-Hyun Park ,  Young-Ji Kim ,  Jong-Gyu Choi ,  Sang-Duck Kim

IPC: H05K3/06

CPC classification number: H05K3/4007 ,  H05K3/061 ,  H05K3/205 ,  H05K2201/0367 ,  H05K2203/0152 ,  H05K2203/0376

Abstract: A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.

Abstract translation: 公开了一种制造具有凸块的印刷电路板的方法。 该方法包括制备其上形成有第一电路的第一载体，将第一载体压缩到绝缘层的一个表面，使得第一电路被掩埋，根据凸点将在第一载体上堆叠抗蚀剂 通过蚀刻第一载体形成和形成凸块。 根据本发明的实施例，可以减小印刷电路板中的凸块与其相邻凸块之间的高度差，从而可以更好地实现电子部件和印刷电路板之间的电连接。

公开(公告)号：US20100193491A1

公开(公告)日：2010-08-05

申请号：US12676024

申请日：2008-08-27

Applicant: Sang-Bum Cho ,  Byoung-Jin Jung ,  Myung-Ha Park ,  Jung-Hyun Park

Inventor： Sang-Bum Cho ,  Byoung-Jin Jung ,  Myung-Ha Park ,  Jung-Hyun Park

IPC: H05B1/00

CPC classification number: H01L21/67103 ,  H01L21/67109 ,  H01L21/6831

Abstract: A substrate support unit of a substrate processing apparatus includes a first support member, a second support member, a buffer member and a tube. The first support member has an electrode and a heater built-in and supports the substrate. The second support member is disposed beneath the first support member to support the first support member. The buffer member is disposed between the first support member and the second support member to form an air gap between the first support member and the second support member so as to reduce heat transfer between the first support member and the second support member. The tube is connected with a lower surface of the first support member. Further, the tube extends through the second support member and receives lines for applying power to the electrode and the heater.

Abstract translation: 基板处理装置的基板支撑单元包括第一支撑构件，第二支撑构件，缓冲构件和管。 第一支撑构件具有内置的电极和加热器，并支撑基板。 第二支撑构件设置在第一支撑构件下方以支撑第一支撑构件。 缓冲构件设置在第一支撑构件和第二支撑构件之间，以在第一支撑构件和第二支撑构件之间形成气隙，以减少第一支撑构件和第二支撑构件之间的热传递。 管与第一支撑构件的下表面连接。 此外，管延伸穿过第二支撑构件并且接收用于向电极和加热器施加电力的线。

公开(公告)号：US20100132876A1

公开(公告)日：2010-06-03

申请号：US12508224

申请日：2009-07-23

Applicant: Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

IPC: C25D5/02 ,  B32B37/00 ,  B32B38/00

CPC classification number: B32B37/02 ,  B32B2457/08 ,  C25D5/022 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/0384

Abstract: Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.

Abstract translation: 公开了印刷电路板的制造方法。 制造具有用于层间连接的通孔的印刷电路板的方法可以包括在载体的一侧上形成电路图案，将载体的一侧压在绝缘体的一侧，去除载体，形成贯穿该载体的孔 通过处理电路图案的一端，并且在孔内形成导电材料以使导电材料对应于通孔。

公开(公告)号：US07707715B2

公开(公告)日：2010-05-04

申请号：US12005610

申请日：2007-12-28

Applicant: Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

Inventor： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC: H05K3/00

CPC classification number: H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract translation: 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US20090313524A1

公开(公告)日：2009-12-17

申请号：US12268534

申请日：2008-11-11

Applicant: Hyun Ho CHOI ,  Kyung Hun JANG ,  Jung Hyun PARK ,  Yong Ho CHO ,  Dong Jo PARK

Inventor： Hyun Ho CHOI ,  Kyung Hun JANG ,  Jung Hyun PARK ,  Yong Ho CHO ,  Dong Jo PARK

IPC: H03M13/11 ,  G06F11/10

CPC classification number: H03M13/356 ,  H03M13/1102 ,  H03M13/1148 ,  H03M13/353 ,  H04L1/0009 ,  H04L1/04

Abstract: A low density parity code (LDPC) encoding and decoding devices and encoding and decoding methods thereof are provided. An LDPC encoding device includes an information obtaining unit which obtains status information of at least two frequency bands, a matrix generation unit which generates a parity check matrix based on the status information, the parity check matrix including sub matrices which correspond to the at least two frequency bands, and an encoder which generates data bits and parity bits using an LDPC with the generated parity check matrix.

Abstract translation: 提供了一种低密度奇偶校验码（LDPC）编码和解码装置及其编码和解码方法。 LDPC编码装置包括获取至少两个频带的状态信息的信息获取单元，基于状态信息生成奇偶校验矩阵的矩阵生成单元，所述奇偶校验矩阵包括对应于所述至少两个频带的子矩阵 频带，以及使用具有所生成的奇偶校验矩阵的LDPC生成数据位和奇偶校验位的编码器。

公开(公告)号：US20090298439A1

公开(公告)日：2009-12-03

申请号：US12349303

申请日：2009-01-06

Applicant: Hyun Ho Choi ,  Yong Ho Cho ,  Jung Hyun Park ,  Dong Jo Park

Inventor： Hyun Ho Choi ,  Yong Ho Cho ,  Jung Hyun Park ,  Dong Jo Park

IPC: H04B17/00

CPC classification number: H04L27/2649 ,  H04W16/14 ,  H04W72/02

Abstract: A cognitive radio (CR) communication apparatus and method is provided. A cognitive radio (CR) communication apparatus includes a signal receiving unit which receives signals from a primary user of a primary system and a secondary transmitter of a secondary system, the received signals including an element associated with at least one known signal of the secondary transmitter, and a determination unit which determines whether a signal of the primary user exists from among the received signals based on the element associated with the at least one known signal.

Abstract translation: 提供了一种认知无线电（CR）通信装置和方法。 认知无线电（CR）通信装置包括信号接收单元，其接收来自主系统的主用户的信号和次系统的辅助发射机，所接收的信号包括与次发射机的至少一个已知信号相关联的元件 以及确定单元，其基于与所述至少一个已知信号相关联的元素，从接收信号中存在主要用户的信号。

公开(公告)号：US07550316B2

公开(公告)日：2009-06-23

申请号：US11715906

申请日：2007-03-09

Applicant: Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An aspect of the present invention features a manufacturing method of a board on chip package. The method can comprise: (a) laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; (b) patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; (c) removing the dry film; (d) laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; (e) etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; (f) mounting a semiconductor chip on the solder ball pad by a flip chip bonding; (g) molding the semiconductor chip with a passivation material; (h) removing the carrier film and the thin metal film; and (i) laminating a lower photo solder resist under the solder ball pad. The board on chip package and the manufacturing method thereof according to the present invention can design a high density circuit since a circuit pattern is formed using a seed layer.

Abstract translation: 本发明的一个方面的特征在于片上封装的制造方法。 该方法可以包括：（a）在载体膜上层压干膜，其一面由薄金属膜层压; （b）通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; （c）去除干膜; （d）层压除了形成焊锡球焊盘的部分之外的上光阻焊剂; （e）蚀刻形成在上层光阻抗层未层叠的部分上的金属薄膜; （f）通过倒装芯片接合将半导体芯片安装在焊球垫上; （g）用钝化材料模制半导体芯片; （h）去除载体膜和金属薄膜; 和（i）在焊球垫下方层叠下光阻焊剂。 根据本发明的片上封装及其制造方法可以设计高密度电路，因为使用种子层形成电路图案。

公开(公告)号：US20090095508A1

公开(公告)日：2009-04-16

申请号：US12149610

申请日：2008-05-05

Applicant: Jung-Hyun Park ,  Ji-Eun Kim ,  Myung-Sam Kang

Inventor： Jung-Hyun Park ,  Ji-Eun Kim ,  Myung-Sam Kang

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K3/205 ,  H01L21/4846 ,  H05K3/243 ,  H05K3/421 ,  H05K2201/09481 ,  H05K2203/0376 ,  H05K2203/0574 ,  Y10T29/49155

Abstract: A printed circuit board and a method for manufacturing the same are disclosed. The manufacturing method includes: forming a first plating resist corresponding to the circuit pattern on a surface of each of a first carrier and a second carrier; forming a second plating resist corresponding to the pad on each of the surfaces; forming the pad by performing plating over each of the surfaces; stripping the second plating resists; forming the circuit pattern by performing plating over each of the surfaces; pressing the first carrier and the second carrier with an insulation layer interposed between the first carrier and the second carrier such that the circuit patterns face each other; and removing the first carrier and the second carrier. Since plating bars need not be used, the degree of freedom in designing circuits can be increased, and circuits of higher densities can be designed.

Abstract translation: 公开了一种印刷电路板及其制造方法。 制造方法包括：在第一载体和第二载体的每一个的表面上形成与电路图案相对应的第一电镀抗蚀剂; 在每个表面上形成对应于所述垫的第二电镀抗蚀剂; 通过在每个表面上进行电镀来形成焊盘; 剥离第二电镀抗蚀剂; 通过在每个表面上进行电镀来形成电路图案; 用绝缘层将所述第一载体和所述第二载体按压在所述第一载体和所述第二载体之间，使得所述电路图案彼此面对; 以及去除所述第一载体和所述第二载体。 由于不需要使用电镀棒，因此能够提高设计电路的自由度，能够设计更高密度的电路。

公开(公告)号：US20090011220A1

公开(公告)日：2009-01-08

申请号：US12153155

申请日：2008-05-14

Applicant: Jung-Hyun Park ,  Jeong-Woo Park ,  Sang-Duck Kim ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Myung-Sam Kang

Inventor： Jung-Hyun Park ,  Jeong-Woo Park ,  Sang-Duck Kim ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Myung-Sam Kang

IPC: H05K1/05 ,  B29C65/42 ,  B32B7/00 ,  B32B7/12

CPC classification number: H05K3/205 ,  H05K3/108 ,  H05K3/4602 ,  H05K2203/1536 ,  Y10T428/249984 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31721 ,  Y10T428/31993

Abstract: A carrier and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing a printed circuit board may include: forming a first circuit pattern on each of a pair of release layers, which are attached respectively to either side of a base layer by adhesive layers; detaching the pair of release layers from the base layer; stacking and pressing the pair of release layers onto either side of an insulation substrate such that the first circuit patterns are buried in the insulation substrate; and separating the pair of release layers. By forming a circuit pattern on each of a pair of release layers with a single process, and transferring the circuit pattern into each side of an insulation substrate, the manufacturing process can be shortened and circuit patterns can be formed to a high density.

Abstract translation: 公开了载体和制造印刷电路板的方法。 制造印刷电路板的方法可以包括：在一对剥离层中的每一个上形成第一电路图案，其分别通过粘合剂层附着在基层的任一侧; 将一对释放层从基层分离; 堆叠并将一对释放层压在绝缘基板的任一侧上，使得第一电路图案被埋在绝缘基板中; 并分离一对释放层。 通过利用单一工艺在一对释放层的每一个上形成电路图案，并将电路图案转移到绝缘基板的每一侧，可以缩短制造工艺并且可以以高密度形成电路图案。

公开(公告)号：US07473091B2

公开(公告)日：2009-01-06

申请号：US11726704

申请日：2007-03-22

Applicant: Myung Sung Woo ,  Dong Yeon Jung ,  Sung Ho Han ,  Yun Hyng Lee ,  Jung Hyun Park

Inventor： Myung Sung Woo ,  Dong Yeon Jung ,  Sung Ho Han ,  Yun Hyng Lee ,  Jung Hyun Park

IPC: B29C43/36

CPC classification number: C03B11/08 ,  C03B11/005 ,  C03B11/122 ,  C03B11/125 ,  C03B11/16 ,  C03B2215/49 ,  C03B2215/80 ,  C03B2215/86 ,  Y02P40/57 ,  Y10S425/808

Abstract: Disclosed herein is an apparatus for manufacturing a megapixel multi-focus lens. The lens manufacturing apparatus of the present invention includes a loading means for supplying a mold body, in which a blank, interposed between upper and lower molds, is placed, to a forming position, a compression-forming means, which preheats, compresses and cools the supplied mold body such that the blank is formed into a multi-focus lens having an aspherical surface, and a discharge means, which discharges the multi-focus lens formed by the compression-forming means. Therefore, processes from loading to discharging can be automated, so that the productivity of the apparatus for manufacturing the multi-focus lens can be markedly enhanced. Furthermore, because the lens manufacturing apparatus is covered with a cabinet, a superior appearance thereof is ensured. In addition, because various electric components for controlling the compression-forming means are provided in the cabinet, it is not necessary to separately install electrical control parts for mechanical parts.

Abstract translation: 本文公开了一种用于制造百万像素多焦点透镜的装置。 本发明的透镜制造装置包括：用于供给模具主体的装载装置，在模具主体中，将设置在上模和下模之间的坯料放置到成形位置，预压，压缩和冷却的压缩成形装置 提供的模具体使得坯料形成为具有非球面的多焦点透镜，以及排出由压缩成形装置形成的多焦点透镜的放电装置。 因此，从加载到放电的过程可以自动化，从而可以显着提高用于制造多焦点透镜的装置的生产率。 此外，由于透镜制造装置被机壳覆盖，因此确保了其优良的外观。 此外，由于在机壳中设置用于控制压缩成形装置的各种电气部件，因此不需要分别安装用于机械部件的电气控制部件。