公开(公告)号：US09331001B2

公开(公告)日：2016-05-03

申请号：US13819209

申请日：2010-09-02

Applicant: Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

Inventor： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC: H01L23/40 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H01L23/495 ,  H01L25/07 ,  H01L23/00

CPC classification number: H01L23/40 ,  G01N29/07 ,  G01N2291/044 ,  G01N2291/2697 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49548 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

Abstract translation: 半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上 半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。

公开(公告)号：US20140145193A1

公开(公告)日：2014-05-29

申请号：US14129342

申请日：2012-04-26

Applicant: Takuya Kadoguchi ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

Inventor： Takuya Kadoguchi ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC: H01L21/66 ,  H01L23/495

CPC classification number: H01L23/49562 ,  H01L22/34 ,  H01L23/3114 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A problem to be solved is to provide a lead frame and a power module having high material yield.A lead frame includes a plurality of first leads extending to one side of an area in which a semiconductor device is disposed in a planar view; a plurality of second leads extending to another side that is opposite the one side of the area in which the semiconductor device is disposed in a planar view; a third lead arranged outside of one of the plurality of first leads positioned at an edge of the plurality of first leads in a planar view; and a wiring part that is connected to the third lead, acts as a part of a guide frame of the plurality of first leads, the plurality of second leads, and the third lead, and acts as a wiring connected to the third lead after parts of the guide frame other than the part of the guide frame have been cut off.

Abstract translation: 要解决的问题是提供具有高材料产量的引线框架和功率模块。 引线框架包括延伸到其中半导体器件在平面图中设置的区域的一侧的多个第一引线; 多个第二引线延伸到在平面图中与半导体器件设置的区域的一侧相对的另一侧; 第三引线，布置在平面图中位于所述多个第一引线的边缘的所述多个第一引线中的一个之外; 以及连接到第三引线的布线部分，用作多个第一引线，多个第二引线和第三引线的引导框架的一部分，并且用作连接到第三引线的布线部件 引导框架除了引导框架的一部分已被切断。

公开(公告)号：US20140120365A1

公开(公告)日：2014-05-01

申请号：US14123872

申请日：2012-05-23

Applicant: Tatsuya Miyoshi ,  Seiji Nakajima ,  Hiroki Nakamaru

Inventor： Tatsuya Miyoshi ,  Seiji Nakajima ,  Hiroki Nakamaru

IPC: C21D8/02

CPC classification number: C21D8/0242 ,  B32B15/013 ,  B32B15/04 ,  B32B15/043 ,  C21D1/673 ,  C21D8/0205 ,  C22C18/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/28 ,  C22C38/32 ,  C22C38/60 ,  C23C28/00 ,  C23C28/02 ,  C23C28/021 ,  C23C28/025 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/34 ,  C25D3/562 ,  C25D5/36 ,  C25D5/50 ,  C25D7/0614 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12757 ,  Y10T428/12799 ,  Y10T428/12806 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/2495 ,  Y10T428/27 ,  Y10T428/273

Abstract: A hot-pressing steel sheet has excellent oxidation resistance to be capable of suppressing the formation of scales and ZnO during hot pressing as well as is excellent in cold pressing properties. A process of manufacturing a hot pressed member uses the steel sheet. The hot-pressing steel sheet includes a coating layer containing 10 to 25 mass % of Ni and a balance of Zn and inevitable impurities and having a mass per unit area of 10 to 90 g/m2, and a lubricating layer containing a solid lubricant, in the order named on the surface of a steel sheet.

Abstract translation: 热压钢板具有优异的抗氧化性，能够抑制热压时的氧化皮和氧化锌的形成，并且具有优异的冷压性。 制造热压部件的方法使用钢板。 热压钢板包括含有10〜25质量％的Ni，余量的Zn和不可避免的杂质，每单位面积质量为10〜90g / m 2的涂层，以及含有固体润滑剂的润滑层， 以钢板表面命名。

公开(公告)号：US20130333436A1

公开(公告)日：2013-12-19

申请号：US13991055

申请日：2011-11-30

Applicant: Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroki Nakamaru

Inventor： Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroki Nakamaru

IPC: B21D22/02

CPC classification number: B21D22/022 ,  B32B15/013 ,  B32B15/015 ,  C21D1/673 ,  C21D9/46 ,  C22C18/00 ,  C22C38/001 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C23C2/06 ,  C23C2/28 ,  C25D3/12 ,  C25D3/565 ,  C25D5/12 ,  C25D5/14 ,  C25D5/50 ,  C25D7/0614 ,  G01N19/02

Abstract: The invention provides methods for manufacturing warm press-formed members which can ensure post-coating corrosion resistance. A method for manufacturing warm press-formed members includes heating a steel sheet to a temperature in the range from 200 to 800° C. and warm press-forming the steel sheet at a temperature in the above range of temperatures, the steel sheet having a Zn—Ni alloy coating layer on its surface, the coating layer including 10 to 25 mass % Ni and the balance being Zn and inevitable impurities and having a coating weight of 10 to 90 g/m2.

Abstract translation: 本发明提供了制造能够确保涂层后耐腐蚀性的热压成型件的方法。 一种制造暖压成形构件的方法包括将钢板加热到200-800℃的温度，并在上述温度范围内的温度下对钢板进行热压成形，该钢板具有 Zn-Ni合金涂层表面，涂层含有10〜25质量％的Ni，余量为Zn和不可避免的杂质，涂层重量为10〜90g / m2。

公开(公告)号：US20130252017A1

公开(公告)日：2013-09-26

申请号：US13988915

申请日：2011-11-18

Applicant: Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroki Nakamaru

Inventor： Seiji Nakajima ,  Tatsuya Miyoshi ,  Hiroki Nakamaru

IPC: B32B15/01 ,  B32B15/04 ,  C21D8/02

CPC classification number: B32B15/01 ,  B21D22/208 ,  B32B15/012 ,  B32B15/013 ,  B32B15/043 ,  C21D1/18 ,  C21D8/0242 ,  C21D9/00 ,  C21D9/46 ,  C22C18/00 ,  C22C18/04 ,  C22C21/10 ,  C22C38/001 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/28 ,  C22C38/32 ,  C22C38/60 ,  C23C2/06 ,  C23C2/26 ,  C23C2/28 ,  C23C28/02 ,  C25D3/565 ,  C25D5/50 ,  Y10T428/12535 ,  Y10T428/12799 ,  Y10T428/12937

Abstract: A steel sheet for hot pressing that is capable of suppressing formation of scales or ZnO in hot pressing and excellent in oxidation resistance, and a method for manufacturing a hot-pressed member using the steel sheet are provided. The steel sheet for hot pressing includes a base steel sheet and a plating layer that is formed on a surface of the base steel sheet at a coating weight of 10 to 90 g/m2 and contains 10 to 25% by mass of Ni and the balance Zn with inevitable impurities.

Abstract translation: 提供一种能够抑制热压成型或氧化锌的热压钢板，耐氧化性优异，以及使用该钢板的热压部件的制造方法。 用于热压的钢板包括基材钢板和镀覆层，该镀层以10〜90g / m 2的涂布量形成在基材钢板的表面上，并且含有10〜25质量％的Ni，余量 Zn含有不可避免的杂质。

公开(公告)号：US20130154081A1

公开(公告)日：2013-06-20

申请号：US13819221

申请日：2010-09-02

Applicant: Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

Inventor： Takuya Kadoguchi ,  Yoshikazu Suzuki ,  Masaya Kaji ,  Kiyofumi Nakajima ,  Tatsuya Miyoshi ,  Takanori Kawashima ,  Tomomi Okumura

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/29099 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Abstract translation: 一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制 使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。

公开(公告)号：US20110173555A1

公开(公告)日：2011-07-14

申请号：US12974965

申请日：2010-12-21

Applicant: TATSUYA MIYOSHI

Inventor： TATSUYA MIYOSHI

IPC: G06F3/048

CPC classification number: G06F17/24

Abstract: A copy and paste operation allows selection from a copy source display area to be copied from a display screen of a display unit and pasted to a paste destination display area without losing the original appearance and style. A processing unit determines from data generated on the style of a copy source and data on the paste destination style, whether the paste destination style would change the copy source style. If it is determined that the paste destination style would change the copy source style, the copy source style is processed into the paste destination style in order to make the paste destination style consistent with the copy source style. The paste destination display area then displays the copy source display area pasted therein with the copy source style.

Abstract translation: 复制和粘贴操作允许从复制源显示区域的选择从显示单元的显示屏幕复制并粘贴到粘贴目标显示区域，而不会失去原始的外观和风格。 处理单元根据复制源的样式和粘贴目的地风格上的数据生成的数据确定粘贴目的地样式是否会更改复制源样式。 如果确定粘贴目的地样式将更改复制源样式，则将复制源样式处理为粘贴目标样式，以使粘贴目标样式与复制源样式保持一致。 然后，粘贴目标显示区域显示其中粘贴的复制源显示区域，并具有复制源样式。

公开(公告)号：US20070003743A1

公开(公告)日：2007-01-04

申请号：US11202850

申请日：2005-08-12

Applicant: Masaaki Asano ,  Yasuko Baba ,  Hidemasa Oshige ,  Tatsuya Miyoshi

Inventor： Masaaki Asano ,  Yasuko Baba ,  Hidemasa Oshige ,  Tatsuya Miyoshi

IPC: B32B3/10 ,  H01L51/52 ,  H05B33/02

CPC classification number: H01L27/322 ,  B82Y20/00 ,  B82Y30/00 ,  H01L51/5215 ,  H01L51/5253 ,  H01L2251/5369 ,  H01L2251/568 ,  H05B33/28 ,  Y10T428/24851 ,  Y10T428/25 ,  Y10T428/256

Abstract: The main object of the present invention is to provide an inexpensive color filter substrate for an organic EL element and an organic EL display device which are capable of displaying good images having no defects such as dark spots. To attain the object, the invention provides a color filter substrate for an organic EL element having a substrate, a colored layer formed in a pattern form on/over the substrate, and a transparent electrode layer and a conductive layer laminated, in any order, on/over the colored layer, wherein the conductive layer is a coated film.

Abstract translation: 本发明的主要目的是提供一种廉价的有机EL元件用滤色器基板和有机EL显示装置，其能够显示没有缺陷的良好图像，例如黑点。 为了实现该目的，本发明提供一种有机EL元件的滤色器基板，其具有基板，以图案形式形成在基板上的着色层，以及以任何顺序层压的透明电极层和导电层， 在着色层上/上方，其中导电层是涂膜。

公开(公告)号：US06280535B1

公开(公告)日：2001-08-28

申请号：US09029574

申请日：1998-03-23

Applicant: Tatsuya Miyoshi ,  Takahiro Kubota ,  Masaru Sagiyama ,  Yoshiharu Sugimoto ,  Masaaki Yamashita

Inventor： Tatsuya Miyoshi ,  Takahiro Kubota ,  Masaru Sagiyama ,  Yoshiharu Sugimoto ,  Masaaki Yamashita

IPC: C23C2224

Abstract: A production method for a lead-containing hot-galvanized chromated steel sheet with excellent resistance to blackening and white rust formation comprises: (a) plating a steel sheet in a hot-galvanizing bath containing 0.05-0.3 wt. % lead and 0.1-0.3 wt. % aluminum; (b) coating this with a chromating solution containing chromium (VI) ions, chromium (III) ions and nitrate ions in which the Cr(III)/Cr(VI) molar ratio is 1/9-1/1 and the nitrate ion to total chromium ion molar ratio is 0.1-1.6; and (c) without washing with water, drying the sheet at 40-250 deg. C., to form a 5-50 mg/m integral 2 (in terms of chromium) chromate film.

公开(公告)号：US5393605A

公开(公告)日：1995-02-28

申请号：US94077

申请日：1993-07-22

Applicant: Tatsuya Miyoshi ,  Toshiyuki Okuma ,  Masaaki Yamashita ,  Toyofumi Watanabe ,  Norio Kosaka

Inventor： Tatsuya Miyoshi ,  Toshiyuki Okuma ,  Masaaki Yamashita ,  Toyofumi Watanabe ,  Norio Kosaka

IPC: B05D7/00 ,  C08G18/12 ,  C09D5/08 ,  C09D175/04 ,  B32B15/08

CPC classification number: B05D7/51 ,  C08G18/12 ,  C08L79/02 ,  C09D175/04 ,  C09D5/08 ,  C23C22/30 ,  C23C28/321 ,  C23C28/34 ,  B05D2202/00 ,  B05D2350/20 ,  B05D2350/65 ,  C08G2150/90 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/265 ,  Y10T428/273 ,  Y10T428/31605

Abstract: A zinciferous plated steel sheet excellent in press-formability and corrosion resistance, which comprises: a steel sheet, a zinciferous plating layer formed on at least one surface of the steel sheet, a chromate film formed on the zinciferous plating layer, and a resin film formed on the chromate film. The resin film comprises a solvent-base thermosetting resin, a solid internal lubricant and a rust-preventive pigment. The solvent-base thermosetting resin comprises: (A) urethane prepolymer containing a hydroxyl group, and (B) at least one of a block polyisocyanate compound and an amino resin as a curing agent. The urethane prepolymer containing a hydroxyl group comprises: (a) at least one of polyether polyol, polyester polyol and polyether-polyester polyol, (b) an isocyanate compound, and (c) dihydric alcohol. The solid internal lubricant comprises a polyethylene resin, and the content ratio thereof is within a range of from 1 to 30 weight parts relative to 100 weight parts of a solid component in the solvent-base thermosetting resin. The rust-preventive pigment comprises at least one of a chromate compound or silica, and the content ratio thereof is within a range of from 3 to 30 weight parts relative to 100 weight parts of the solid component in the solvent-base thermosetting resin.

Abstract translation: PCT No.PCT / JP92 / 01618 Sec。 371日期：1993年7月22日 102（e）日期1993年7月22日PCT提交1992年12月10日PCT公布。 公开号WO93 / 11880 PCT 日期：1993年6月24日。一种压制成型性和耐腐蚀性优异的镀锌钢板，其特征在于，包括：钢板，形成在钢板的至少一个表面上的镀锌层，形成在镀锌层上的铬酸盐膜 镀层和形成在铬酸盐膜上的树脂膜。 树脂膜包括溶剂基热固性树脂，固体内部润滑剂和防锈颜料。 溶剂型热固性树脂包括：（A）含有羟基的氨基甲酸酯预聚物，和（B）至少一种嵌段多异氰酸酯化合物和氨基树脂作为固化剂。 含有羟基的氨基甲酸酯预聚物包括：（a）聚醚多元醇，聚酯多元醇和聚醚 - 聚酯多元醇中的至少一种，（b）异氰酸酯化合物和（c）二元醇。 固体内部润滑剂包含聚乙烯树脂，其含量比在溶剂型热固性树脂中相对于100重量份的固体成分为1〜30重量份。 防锈颜料包括铬酸盐化合物或二氧化硅中的至少一种，并且其含量比相对于溶剂型热固性树脂中固体成分的100重量份为3〜30重量份。