公开(公告)号：US07709951B2

公开(公告)日：2010-05-04

申请号：US11687037

申请日：2007-03-16

申请人： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin, IV ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

发明人： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin, IV ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

IPC分类号： H01L23/34 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2224/0401

摘要： Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

摘要翻译： 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。

公开(公告)号：US07464462B2

公开(公告)日：2008-12-16

申请号：US11872095

申请日：2007-10-15

申请人： David L. Edwards ,  Thomas Fleischman ,  Paul A. Zucco

发明人： David L. Edwards ,  Thomas Fleischman ,  Paul A. Zucco

IPC分类号： H05K7/20 ,  B21D51/16 ,  B28B1/00

CPC分类号： H01L23/3733 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49808 ,  Y10T428/13 ,  Y10T428/234 ,  Y10T428/236 ,  H01L2924/00

摘要： A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings within the frame material; filling a first group of the individual cells with one or more high thermal conductivity materials; filling at least a second group of the individual cells with one or more materials of lower thermal conductivity than in the first group of the individual cells; and implementing a reflowing process following filling the multiple individual cells so as to infiltrate the materials within the individual cells, wherein defined walls of the frame material remain following the reflowing.

摘要翻译： 公开了一种用于形成用于半导体器件的散热装置的方法。 该方法包括挤压框架材料以形成多个单个单元，包括框架材料内的可填充开口; 用一种或多种高导热性材料填充第一组单体电池; 用至少第二组个体细胞填充一种或多种导热性低于第一组单独细胞的材料; 并且在填充多个单个电池之后实施回流过程，以便渗透各个电池内的材料，其中框架材料的限定壁在回流之后保持。

公开(公告)号：US20080029910A1

公开(公告)日：2008-02-07

申请号：US11461869

申请日：2006-08-02

申请人： David L. Edwards ,  Thomas J. Fleischman

发明人： David L. Edwards ,  Thomas J. Fleischman

IPC分类号： H01L23/48

CPC分类号： H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment of the present invention discloses a hexagonally structured electrical interconnect connector and a layout arrangement for a plurality of the same on a chip carrier or a multi-chip module (MCM) in a hexagonal array to increase the input output (I/O) density. The hexagonal electrical interconnect connector may take the form of a pad, ball or pin; and is adjacent to another hexagonal electrical interconnect connector at angle, θ.

摘要翻译： 本发明的一个实施例公开了六边形阵列中的六边形结构的电互连连接器和用于其上的多个芯片载体或多芯片模块（MCM）的多个布置布置，以增加输入输出（I / O） 密度。 六边形电气互连连接器可以采取垫，球或销的形式; 并且以角度θ与另一个六边形电互连连接器相邻。

公开(公告)号：US06365977B1

公开(公告)日：2002-04-02

申请号：US09387061

申请日：1999-08-31

申请人： David L. Edwards ,  Norman J. Dauerer ,  Glenn G. Daves

发明人： David L. Edwards ,  Norman J. Dauerer ,  Glenn G. Daves

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  G01R1/0408 ,  G01R1/0466 ,  G01R1/0483 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： The present invention relates generally to a new structure and a method for reducing the cost of producing known good die (KGD). More particularly, the invention encompasses a structure and a method that uses a substrate having solder wettable pads, a chip with attached solder balls, and a thin non-conductive interposer that is assembled between the chip and the substrate. The interposer reduces the cross section of the solder connections from the chip to the substrate where the solder passes through (the holes in) the interposer. This reduced cross-sectional area of the solder connection creates a weak point which allows the chip to be easily sheared off of the substrate after a burn-in and test process. The preferred chips for this invention are flip chips.

摘要翻译： 本发明一般涉及用于降低生产已知好模具（KGD）的成本的新结构和方法。 更具体地，本发明包括使用具有焊料可湿性焊盘的衬底，带有焊球的芯片和组装在芯片和衬底之间的薄的非导电插入器的结构和方法。 插入器将焊料从芯片到衬底的横截面减小到焊料穿过插入件的孔（孔）。 焊接连接的这种减小的横截面面积产生弱点，这使得芯片在老化和测试过程之后容易地从衬底上剪切掉。 本发明的优选芯片是倒装芯片。

公开(公告)号：US6091603A

公开(公告)日：2000-07-18

申请号：US409241

申请日：1999-09-30

申请人： Glenn G. Daves ,  David L. Edwards

发明人： Glenn G. Daves ,  David L. Edwards

IPC分类号： H01L23/04 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L24/32 ,  H01L23/04 ,  H01L23/433 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/19041 ,  H01L2924/19043

摘要： Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.

摘要翻译： 具有改善的散热性能的集成电路芯片封装模块和盖结构的特征在于定制的盖子下部结构，其能够减少主散热路径中的柔性导热材料的量。 盖结构和模块通过以下方法制成：其中盖子下部结构被定制成要被容纳的芯片。 定制是通过使用垫片和可变形的盖子结构来实现的。

公开(公告)号：US5981310A

公开(公告)日：1999-11-09

申请号：US12071

申请日：1998-01-22

申请人： Giulio DiGiacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Larry D. Gross ,  Sushumna Iruvanti ,  Raed A. Sherif ,  Subhash L. Shinde ,  David J. Womac ,  David B. Goland ,  Lester W. Herron

发明人： Giulio DiGiacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Larry D. Gross ,  Sushumna Iruvanti ,  Raed A. Sherif ,  Subhash L. Shinde ,  David J. Womac ,  David B. Goland ,  Lester W. Herron

IPC分类号： H01L23/433 ,  H01L25/065 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/433 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251

摘要： A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

摘要翻译： 一种多芯片模块和散热帽组件及其制造方法，为更高功率密度的芯片提供足够的冷却。 散热器盖具有设置在基板上的每个芯片上的散热柱。 散热柱通过柔性构件相互连接，以提供整体盖。 衬底，芯片和散热柱的配合表面的至少一部分的薄膜金属化允许将帽焊接到芯片和衬底以形成封装，其是机械稳定的结构，而不会降低互连疲劳寿命 在使用时对组件进行热循环。

公开(公告)号：US5881944A

公开(公告)日：1999-03-16

申请号：US846929

申请日：1997-04-30

申请人： David L. Edwards ,  Armando S. Cammarano ,  Jeffrey T. Coffin ,  Mark G. Courtney ,  Stephen S. Drofitz, Jr. ,  Michael J. Ellsworth, Jr. ,  Lewis S. Goldmann ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  William E. Sablinski ,  Raed A. Sherif ,  Hilton T. Toy

发明人： David L. Edwards ,  Armando S. Cammarano ,  Jeffrey T. Coffin ,  Mark G. Courtney ,  Stephen S. Drofitz, Jr. ,  Michael J. Ellsworth, Jr. ,  Lewis S. Goldmann ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  William E. Sablinski ,  Raed A. Sherif ,  Hilton T. Toy

IPC分类号： B23K35/02 ,  B23K35/26 ,  H01L23/10 ,  B23K31/02 ,  B23K35/22

CPC分类号： H01L23/10 ,  B23K35/0238 ,  B23K35/26 ,  B23K2201/40 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/163 ,  Y10T428/12361

摘要： The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

摘要翻译： 本发明一般涉及为半导体衬底和芯片载体提供密封带的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封带是用于为模块产生低成本，高可靠性气密密封的三层焊料夹层结构。 该焊料夹层具有较高的熔化温度较厚的焊料内芯和较低熔点的薄互连焊料层，其中薄的互连焊料层可具有相似或不同的熔点。

公开(公告)号：US5093120A

公开(公告)日：1992-03-03

申请号：US528305

申请日：1990-05-24

申请人： David L. Edwards ,  Jewel Payne ,  George G. Soares

发明人： David L. Edwards ,  Jewel Payne ,  George G. Soares

IPC分类号： A01N63/00 ,  C07K14/325

CPC分类号： C12R1/075 ,  A01N63/00 ,  C07K14/325 ,  Y10S435/832

摘要： The invention concerns novel isolates of Bacillus thuringiensis (B.t.) which contains a toxin(s) which is active against adult nematode worms and larvae. This B.t. toxin(s) can be used to treat animals and plants hosting susceptible nematodes.

摘要翻译： 本发明涉及苏云金芽孢杆菌（B.t.）的新型分离物，其含有对成虫线虫和幼虫具有活性的毒素。 这个B.t. 毒素可用于治疗寄主易感线虫的动物和植物。

公开(公告)号：US4629456A

公开(公告)日：1986-12-16

申请号：US303421

申请日：1981-09-18

申请人： David L. Edwards

发明人： David L. Edwards

IPC分类号： A61F9/00

CPC分类号： A61F9/0008

摘要： A target ring for a conventional eye dropper bottle having an upper conical nozzle received in a neck portion of the bottle and having an central orifice extending through the nozzle to be in communication with the interior of the bottle; comprising a contrasting target ring applied to a portion of the nozzle wherein the contrasting ring is outwardly concentric to the orifice thereby positioning the orifice in the center of the target.

摘要翻译： 用于常规滴眼瓶的目标环，其具有容纳在瓶的颈部中的上锥形喷嘴，并具有延伸穿过喷嘴的中心孔，以与瓶的内部连通; 包括施加到喷嘴的一部分的对比目标环，其中对比环与孔口向外同心，从而将孔定位在靶的中心。

公开(公告)号：US08582297B2

公开(公告)日：2013-11-12

申请号：US13020102

申请日：2011-02-03

申请人： David L. Edwards ,  Randall G. Kemink ,  David C. Olson ,  Katie L. Pizzolato ,  John G. Torok

发明人： David L. Edwards ,  Randall G. Kemink ,  David C. Olson ,  Katie L. Pizzolato ,  John G. Torok

IPC分类号： H05K7/20

CPC分类号： F28F13/00 ,  B23P2700/10 ,  F28F2013/006 ,  H01L23/433 ,  H01L2924/0002 ,  H05K7/20509 ,  Y10T29/49826 ,  H01L2924/00

摘要： A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.

摘要翻译： 一种通过冷却板冷却一个或多个设备的方法，系统和装置。 示例性系统包括耦合到冷却板的多个热产生装置，每个通过单独的热接口单元。 热接口单元包括具有至少一个表面的可压缩固体垫，该表面具有承载可流动材料的多个突起。 热接口单元在发热装置和冷却板之间被按压，使得可流动的材料被完全封闭。