-
31.发明授权Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US06899829B2
公开(公告)日：2005-05-31
申请号：US09998117
申请日：2001-11-30
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
-
公开(公告)号：US06506979B1
公开(公告)日：2003-01-14
申请号：US09570215
申请日：2000-05-12
IPC分类号： H05K102
CPC分类号： H05K3/465 , H05K3/0023 , H05K3/0032 , H05K3/205 , H05K3/3473 , H05K3/423 , H05K3/4682 , H05K2201/09472 , H05K2203/0152 , H05K2203/0338 , H05K2203/0726 , H05K2203/0733
摘要： A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
摘要翻译： 一种用于制造电路板和通过该方法形成的板的方法。 该方法包括依次选择性地镀金属加强件，焊接垫，信号线和互连。 所得板最好不含玻璃纤维增强层。
-
公开(公告)号：US06455231B1
公开(公告)日：2002-09-24
申请号：US09433153
申请日：1999-11-03
申请人： James G. Shelnut
发明人： James G. Shelnut
IPC分类号： G03F7033
CPC分类号： G03F7/161 , G03F7/027 , Y10S430/128
摘要： Dry film resists of the invention in general comprise a photoactive component, a highly viscous or solid (at room temperature, ca. 25° C.) crosslinker component, and preferably a flexibilizing agent. Preferred dry film constructions of the invention do not require the use of a protective cover sheet due to the composition's very dry nature.
摘要翻译： 本发明的干膜抗蚀剂通常包含光活性组分，高粘度或固体（室温，约25℃）交联剂组分，优选柔韧剂。 本发明优选的干膜结构由于组合物非常干燥的性质而不需要使用保护性覆盖片。
-
公开(公告)号：US5528000A
公开(公告)日：1996-06-18
申请号：US395685
申请日：1995-02-28
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
-
公开(公告)号：US5320933A
公开(公告)日：1994-06-14
申请号：US979349
申请日：1992-11-20
CPC分类号： G03F7/085 , Y10S430/155
摘要： A photoimageable composition contains from 0.5 to 5 wt. percent of a compound of the formula: ##STR1## wherein R=alkyl, aryl, aralkyl, alkenyl, alkynyl, and substituted forms thereofX=OR', SR', NR'.sub.2, R'R'=H, R, CO--R,G=nothing or C.sub.1 -C.sub.8 alipathic hydrocarbon, andY=COOH, PO.sub.3 H, SO.sub.3 H, SO.sub.2 H and SOH. X'=R'to promote adhesion of the photoimageable composition to metal.
摘要翻译： 可光成像组合物含有0.5至5wt。 其中R =烷基，芳基，芳烷基，烯基，炔基及其取代形式X = OR'，SR'，NR'2，R'R'= H，R，CO -R，G =无或C 1 -C 8脂族烃，Y = COOH，PO 3 H，SO 3 H，SO 2 H和SOH。 X'= R'以促进可光成像组合物与金属的粘附。
-
公开(公告)号：US08207511B2
公开(公告)日：2012-06-26
申请号：US12479514
申请日：2009-06-05
CPC分类号： C09K11/02 , C09K11/08 , D01F1/04 , D01F8/00 , G01D5/268 , Y10T428/249921 , Y10T428/2964 , Y10T428/2969 , Y10T442/3976
摘要： Disclosed are photoluminescent fibers containing photoluminescent phosphorescent materials and photoluminescent fluorescent materials whose emission signature lies partly or fully in the infrared region of the electromagnetic spectrum. Also disclosed are the use of the inventive fibers, fabrics made therefrom, and objects containing the fiber.
摘要翻译： 公开了含有光致发光磷光材料和光致发光荧光材料的光致发光纤维，其发射特征部分或完全位于电磁光谱的红外区域。 还公开了使用本发明的纤维，由其制成的织物和含有纤维的物体。
-
公开(公告)号：US06887654B2
公开(公告)日：2005-05-03
申请号：US10431002
申请日：2003-05-07
CPC分类号： G03F7/322
摘要： A composition and method to reduce or to prevent residue and scum formation on a substrate or in a solution. The composition contains an aromatic alkoxylate in combination with a polyol or ether or ester of a polyol. The composition also reduces or prevents foam formation such as in developing processes in the manufacturing of printed wiring boards.
摘要翻译： 减少或防止底物或溶液中残留物和浮渣形成的组合物和方法。 该组合物含有多元醇或多元醇的醚或酯的芳族烷氧基化物。 组合物还可以减少或防止泡沫形成，例如印刷线路板的制造中的显影过程。
-
公开(公告)号：US06660154B2
公开(公告)日：2003-12-09
申请号：US09981851
申请日：2001-10-17
申请人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
发明人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
IPC分类号： C23C2800
CPC分类号： H01L21/76843 , C23C18/28 , C25D3/38 , C25D5/54 , C25D7/123 , H01L21/288 , H01L21/2885 , H01L21/76868 , H01L21/76873 , H01L21/76877 , H01L2221/1089
摘要： Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
-
公开(公告)号：US06123995A
公开(公告)日：2000-09-26
申请号：US36235
申请日：1998-03-06
CPC分类号： H05K3/424
摘要： A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the board but before drying the conductive polymer composition to remove liquids therefrom to form a conductive polymer film.
摘要翻译： 公开了一种在电镀之前在铜包覆电路板上提供导电聚合物涂层的方法。 该方法教导了将某些有机溶剂应用于已经施加到板上的导电聚合物组合物，但是在干燥导电聚合物组合物以从其中除去液体以形成导电聚合物膜之前。
-
公开(公告)号：US6057079A
公开(公告)日：2000-05-02
申请号：US936305
申请日：1997-09-24
申请人： James G. Shelnut
发明人： James G. Shelnut
CPC分类号： G03F7/092 , G03F7/161 , H05K3/0073
摘要： A dry film photoresist construction suitable for rolling up which includes a support layer having a top surface having thereon a thin layer of photoresist adhered thereto, and on the bottom surface a silicone release coating having greater adherence to said support layer than to said photoresist.
摘要翻译： 一种适用于卷起的干膜光致抗蚀剂结构，其包括具有其上附着有薄层光致抗蚀剂的顶表面的支撑层，并且在底表面上具有比所述光致抗蚀剂具有更大的粘附于所述支撑层的硅氧烷剥离涂层。
-
-
-
-
-
-
-
-
-
搜索结果
43 条记录 (耗时 0.023 秒)
