公开(公告)号：US20110255250A1

公开(公告)日：2011-10-20

申请号：US12794599

申请日：2010-06-04

Applicant: Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

Inventor： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

IPC: H05K1/14 ,  F16B37/00 ,  F16B39/02 ,  H05K1/00 ,  H05K1/11

CPC classification number: H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

Abstract translation: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 可以使用诸如整流罩的化妆结构来改善设备的美观性。 缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。 紧固件可以焊接到印刷电路板上的焊盘结构上。

公开(公告)号：US10231352B2

公开(公告)日：2019-03-12

申请号：US13610816

申请日：2012-09-11

Applicant: Charles B. Woodhull ,  Paul Choiniere ,  Michael Coleman ,  Bryan Patrick Kiple ,  David A. Pakula ,  Michael K. Pilliod ,  Tang Yew Tan

Inventor： Charles B. Woodhull ,  Paul Choiniere ,  Michael Coleman ,  Bryan Patrick Kiple ,  David A. Pakula ,  Michael K. Pilliod ,  Tang Yew Tan

IPC: C25D7/00 ,  H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  C25D11/34 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

公开(公告)号：US09019428B2

公开(公告)日：2015-04-28

申请号：US13605837

申请日：2012-09-06

Applicant: Ashutosh Y. Shukla ,  Kenta K. Williams ,  Shashikant G. Hegde ,  Tang Yew Tan ,  David A. Pakula

Inventor： Ashutosh Y. Shukla ,  Kenta K. Williams ,  Shashikant G. Hegde ,  Tang Yew Tan ,  David A. Pakula

IPC: G03B13/18 ,  H04N5/225 ,  H04N17/00

CPC classification number: G03B13/18 ,  G03B17/12 ,  G03B2217/002 ,  H04N5/225 ,  H04N5/2257 ,  H04N17/00

Abstract: An electronic device may include a camera module. Control circuitry within the electronic device may use an image sensor within the camera module to acquire digital images. The camera module may have lens structures that are supported by lens support structures such as a lens barrel and lens carrier. An actuator such as a voice coil motor may control the position of the lens support structures relative to internal support structures such as upper and lower spacer members. Springs may be used to couple the lens support structures to the internal support structures. Outer wall structures in the camera module such as a ferromagnetic shield structures may surround and enclose at least some of the internal support structures. The outer wall structures may have openings. The internal support structures may have pins or other alignment structures that protrude through the openings.

Abstract translation: 电子设备可以包括相机模块。 电子设备内的控制电路可以使用相机模块内的图像传感器来获取数字图像。 相机模块可以具有透镜支架结构支撑的透镜结构，例如透镜镜筒和透镜支架。 诸如音圈马达的致动器可以控制透镜支撑结构相对于诸如上部和下部间隔件的内部支撑结构的位置。 弹簧可用于将透镜支撑结构连接到内部支撑结构。 相机模块中的诸如铁磁屏蔽结构的外壁结构可围绕并包围至少一些内部支撑结构。 外壁结构可以具有开口。 内部支撑结构可以具有突出穿过开口的销或其它对准结构。

公开(公告)号：US20140071634A1

公开(公告)日：2014-03-13

申请号：US13607014

申请日：2012-09-07

Applicant: David A. Pakula ,  Emery A. Sanford ,  Tyson B. Manullang ,  Anthony S. Montevirgen ,  Nicholas G.L. Merz ,  Christopher M. Werner

Inventor： David A. Pakula ,  Emery A. Sanford ,  Tyson B. Manullang ,  Anthony S. Montevirgen ,  Nicholas G.L. Merz ,  Christopher M. Werner

IPC: H05K1/18 ,  H05K7/00 ,  H01M2/08 ,  H05K9/00

CPC classification number: H01M2/1022 ,  H01M2200/30 ,  H04M1/0277 ,  H05K1/0243 ,  H05K9/0032 ,  H05K2201/10371

Abstract: An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve.

Abstract translation: 电子设备可以包括诸如电池结构，电磁屏蔽结构和按钮结构的子组件。 电磁屏蔽结构可以包括导电栅栏和覆盖电子元件的柔性屏蔽层。 电磁屏蔽结构可以形成有容纳电池的突出部分的凹部。 凹部可以由包括刚性和柔性部分的多层屏蔽结构形成。 按钮结构可以安装到形成为装置壳体的整体部分的凸缘。 电子设备电池可以封装在保护电池套中。 电池套可以包括中心部分，其包围电池和外围部分，所述中心部分被插入在折叠周边部分的相对表面和电池套筒的中心部分之间的粘合材料折叠并联接到中心部分。

公开(公告)号：US20130319755A1

公开(公告)日：2013-12-05

申请号：US13610779

申请日：2012-09-11

Applicant: Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/02 ,  H05K13/00

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US08568184B2

公开(公告)日：2013-10-29

申请号：US12608928

申请日：2009-10-29

Applicant: Christopher D. Prest ,  Stephen P. Zadesky ,  David A. Pakula

Inventor： Christopher D. Prest ,  Stephen P. Zadesky ,  David A. Pakula

IPC: H01J9/26

CPC classification number: H01L51/5237 ,  H01L51/5243 ,  H01L51/5246

Abstract: An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.

Abstract translation: 电子设备可以具有显示器。 显示器可以具有诸如形成在显示基板层上的显示像素的有源部件。 显示基板层可以由玻璃基板层形成。 可以在玻璃基板上形成用于显示像素的薄膜晶体管和其它部件。 可以使用环形粘结结构将包封玻璃层结合到玻璃基板。 环形结合结构可以围绕封装玻璃层和基板玻璃层的周边延伸。 粘结结构可以由玻璃料，固体玻璃环，玻璃层的一体凸起玻璃部分，可熔融金属合金或其它粘结材料形成。 可以使用化学和物理加工操作来回火玻璃层，进行退火操作，以预热玻璃层并促进粘附。

公开(公告)号：US20130051785A1

公开(公告)日：2013-02-28

申请号：US13222999

申请日：2011-08-31

Applicant: Benjamin J. Pope ,  Richard Hung Minh Dinh ,  Tang Yew Tan ,  David A. Pakula

Inventor： Benjamin J. Pope ,  Richard Hung Minh Dinh ,  Tang Yew Tan ,  David A. Pakula

IPC: G03B17/02

CPC classification number: G03B17/02 ,  G03B2217/002

Abstract: An electronic device may have a housing. A camera window assembly may be mounted in a hole within the housing. The housing may be formed from a structure such as a planar glass member. The hole in which the camera window assembly is formed may be circular. A mating circular trim member in the camera window assembly may be mounted in the hole. A flange structure on the trim member may help retain the trim member within the housing. A shelf portion of the trim member may receive a ring of adhesive. The camera window assembly may have a clear disk-shaped lens with planar opposing front and rear surfaces that is mounted on the shelf portion using the adhesive. An elastomeric ring may be compressed between sidewall portions of the trim member and the lens to help retain the lens within the camera window assembly.

Abstract translation: 电子设备可以具有壳体。 相机窗组件可以安装在壳体内的孔中。 壳体可以由诸如平面玻璃构件的结构形成。 形成相机窗组件的孔可以是圆形的。 相机窗组件中的配合圆形装饰构件可以安装在孔中。 装饰构件上的凸缘结构可以帮助将装饰构件保持在壳体内。 装饰构件的搁架部分可以接收粘合剂环。 相机窗组件可以具有透明的盘形透镜，其具有平面相对的前表面和后表面，其使用粘合剂安装在搁板部分上。 弹性体环可以在装饰构件的侧壁部分和透镜之间被压缩，以帮助将镜片保持在相机窗口组件内。

公开(公告)号：US20120327324A1

公开(公告)日：2012-12-27

申请号：US13167663

申请日：2011-06-23

Applicant: Steven J. MARTISAUSKAS ,  Joshua G. Wurzel ,  David A. Pakula ,  Pinida J. Moolsintong

Inventor： Steven J. MARTISAUSKAS ,  Joshua G. Wurzel ,  David A. Pakula ,  Pinida J. Moolsintong

IPC: G02F1/13357 ,  C25D7/00 ,  B05D3/00 ,  C25D5/02 ,  H05K5/02 ,  B05D5/12

CPC classification number: G02F1/133308 ,  G02F2001/133334 ,  H04M1/0266

Abstract: A coated chassis is disclosed. The chassis can be made from a non-conductive material and can be operable to support a display. A conductive material can be applied to at least a portion of the chassis to form a continuous strip on the chassis frame. The conductive material can further form a closed-loop around the chassis frame. The chassis frame can be included within a device, such as a mobile phone, touchpad, portable computer, portable media player, and the like. The conductive material on the chassis can be coupled to the system ground of the device. Processes for making a coated chassis are also disclosed.

Abstract translation: 公开了涂覆的底盘。 底盘可以由非导电材料制成，并且可操作以支撑显示器。 导电材料可以施加到底盘的至少一部分，以在底架上形成连续条带。 导电材料可以进一步在底盘框架周围形成闭环。 底盘框架可以包括在诸如移动电话，触摸板，便携式计算机，便携式媒体播放器等的设备中。 底盘上的导电材料可以连接到设备的系统接地。 还公开了制造涂覆底盘的方法。

公开(公告)号：US09343716B2

公开(公告)日：2016-05-17

申请号：US13339733

申请日：2011-12-29

Applicant: Fletcher Rothkopf ,  David A. Pakula ,  Daniel W. Jarvis ,  John Raff ,  Jeremy C. Franklin

Inventor： Fletcher Rothkopf ,  David A. Pakula ,  Daniel W. Jarvis ,  John Raff ,  Jeremy C. Franklin

IPC: H01M2/10 ,  H01M2/02 ,  H01L31/048 ,  H01M10/04 ,  H01M10/42 ,  H01M10/657 ,  H01M10/647 ,  H01M10/623 ,  H01M10/613 ,  H01M6/46

CPC classification number: H01M2/1066 ,  H01L31/048 ,  H01M2/0207 ,  H01M6/46 ,  H01M10/0436 ,  H01M10/425 ,  H01M10/613 ,  H01M10/623 ,  H01M10/647 ,  H01M10/657 ,  H01M10/6572 ,  H01M2220/30 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T156/1082

Abstract: Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.

Abstract translation: 公开了用于电子设备的柔性电池组。 在本公开的一个实施例中，柔性电池组可以包括多个电池，例如电流或光伏电池。 电池组还可以包括耦合到电池的多个层压层，其包括顶层叠层和底层叠层。 可以使用粘合剂将顶部和底部层压层连接在一起，使得多个单元中的每一个彼此隔离。 这种布置可以允许电池成形为适合电子设备的外形尺寸。 这种布置还可以允许从多个单元中选择性地移除一个或多个单元，这从制造的角度来看是可取的。

公开(公告)号：US08988628B2

公开(公告)日：2015-03-24

申请号：US13167663

申请日：2011-06-23

Applicant: Steven J. Martisauskas ,  Joshua G. Wurzel ,  David A. Pakula ,  Pinida J. Moolsintong

Inventor： Steven J. Martisauskas ,  Joshua G. Wurzel ,  David A. Pakula ,  Pinida J. Moolsintong

IPC: G02F1/1333 ,  H04M1/02

CPC classification number: G02F1/133308 ,  G02F2001/133334 ,  H04M1/0266

Abstract: A coated chassis is disclosed. The chassis can be made from a non-conductive material and can be operable to support a display. A conductive material can be applied to at least a portion of the chassis to form a continuous strip on the chassis frame. The conductive material can further form a closed-loop around the chassis frame. The chassis frame can be included within a device, such as a mobile phone, touchpad, portable computer, portable media player, and the like. The conductive material on the chassis can be coupled to the system ground of the device. Processes for making a coated chassis are also disclosed.

Abstract translation: 公开了涂覆的底盘。 底盘可以由非导电材料制成，并且可操作以支撑显示器。 导电材料可以施加到底盘的至少一部分，以在底架上形成连续条带。 导电材料可以进一步在底盘框架周围形成闭环。 底盘框架可以包括在诸如移动电话，触摸板，便携式计算机，便携式媒体播放器等的设备中。 底盘上的导电材料可以连接到设备的系统接地。 还公开了制造涂覆底盘的方法。