摘要:
A memory module includes a memory hub that monitors utilization of the memory module and directs devices of the memory module to a reduced power state when the module is not being used at a desired level. System utilization of the memory module is monitored by tracking system usage, manifested by read and write commands issued to the memory module, or by measuring temperature changes indicating a level of device activity beyond normal refresh activity. Alternatively, measured activity levels can be transmitted over a system bus to a centralized power management controller which, responsive to the activity level packets transmitted by remote memory modules, direct devices of those remote memory modules to a reduced power state. The centralized power management controller could be disposed on a master memory module or in a memory or system controller.
摘要:
A memory module includes a memory hub that monitors utilization of the memory module and directs devices of the memory module to a reduced power state when the module is not being used at a desired level. System utilization of the memory module is monitored by tracking system usage, manifested by read and write commands issued to the memory module, or by measuring temperature changes indicating a level of device activity beyond normal refresh activity. Alternatively, measured activity levels can be transmitted over a system bus to a centralized power management controller which, responsive to the activity level packets transmitted by remote memory modules, direct devices of those remote memory modules to a reduced power state. The centralized power management controller could be disposed on a master memory module or in a memory or system controller.
摘要:
A MEMS device with an overhanging ‘polymer’ capillary provides vital and significant improvements in interfacing a MEMS electrospray nozzle to an MS inlet or other macroscopic instrumentation. The fabrication methodology associated therewith is easily expanded to include built-in micro particle filters and centimeter long serpentine micro channels provided on-chip and fabricated using a low temperature process.
摘要:
Embodiments of the present invention present an apparatus coupled to an internal bus for monitoring environmental factors in a computer system including: an embedded controller having a processor; an environmental sensor that provides data related to environmental conditions; a reset generator; and a power source. A LAN interface may be configured to remotely access and control the embedded controller. Further, the internal bus may be selected from any of the following: a PCI bus, an ISA bus, a DIMM slot, a SIMM slot, a PCMCIA slot, or a server blade slot. Still further, the environmental sensor may be selected from any of the following: a DC electrical sensor; an AC electrical sensor; a temperature sensor; a humidity sensor; a force monitor sensor; a signal monitor sensor; an electrostatic discharge sensor; an activity sensor; an optical particulate sensor; a Hall Effect sensor; a global positioning sensor; or a whisker detection sensor.
摘要:
An escape device (10) including a cable (18), a rotatable cable dispensing assembly (22) from which the cable (18) is dispensed under load, a braking mechanism (28) operatively connected to the rotatable cable dispensing assembly (22), whereby a braking response of the braking mechanism (18) is proportional to the rate at which cable (18) is dispensed from the rotatable cable dispensing assembly (22).
摘要:
Described is a portable electronic device which may include a body accommodating electrical components of the device. The body defines a battery chamber and a battery receiving element movably mounted within the battery chamber. The battery receiving element includes a first set of contacts configured for a first battery type and a second contact configured for a second battery type and is movable between a first position in which the first set of contacts is exposed in the battery chamber and a second position in which the second contact is exposed in the battery chamber.
摘要:
Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of “free space” optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals. In another embodiment, the optical transmitter/receiver unit projects outwardly from the module substrate to provide an unobstructed path for optical signals.
摘要:
Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates. Each conductive member can have a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated conductive section connecting the bond-site to the external connector. The conductive members are generally arranged so that at least some of the bond-sites are arranged in a first row in which the bond-sites and a portion of the elongated sections are spaced apart from one other by a first gap width. The support structure can more specifically include a first conductive member having a first bond-site coupled to the Vref bond-pad by a first wire-bond line and a second conductive member having a second bond-site coupled to the signal bond-pad by a second wire-bond line. The first bond-site of the first conductive member can be spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width.
摘要:
An apparatus for MEMS electrospray nozzle for mass spectroscopy formed with top and bottom of SiN, and a between layer of material. The material between the top and bottom forms a filter and also reduces the amount of dead space in the nozzle.