公开(公告)号：US20090200987A1

公开(公告)日：2009-08-13

申请号：US12282826

申请日：2007-03-09

申请人： Takashi Saito ,  Kazuaki Utsumi

发明人： Takashi Saito ,  Kazuaki Utsumi

IPC分类号： H02J7/00 ,  H02J7/04

CPC分类号： H02J7/0054 ,  B60L3/0046 ,  B60L11/1811 ,  B60L11/1816 ,  B60L11/185 ,  B60L11/1872 ,  B60L11/1874 ,  B60L2210/10 ,  H01M6/5033 ,  H01M10/44 ,  H01M10/613 ,  H01M10/615 ,  H01M10/625 ,  H01M10/647 ,  H01M10/655 ,  H01M10/6563 ,  H01M10/6571 ,  H01M10/6572 ,  H02J7/0014 ,  H02J7/027 ,  Y02T10/7005 ,  Y02T10/705 ,  Y02T10/7055 ,  Y02T10/7072 ,  Y02T10/7094 ,  Y02T10/7216 ,  Y02T10/92 ,  Y02T90/121 ,  Y02T90/127 ,  Y02T90/128 ,  Y02T90/14

摘要： Charging apparatus 10 includes secondary battery 13 used for buffering, rectifier 11 that supplies direct current power to secondary battery 13 used for buffering, DC-DC converter 14 connected to driving battery 3 in electric vehicle 2 via charging cable 4, switching control circuit 12, and isothermal wind generator 16 that adjusts the temperature of secondary battery 13 used for buffering from outside of secondary battery 13 used for buffering. Switching control circuit 12 switches charging apparatus 10 between a first mode in which power supplied by rectifier 11 is accumulated in secondary battery 13 used for buffering and a second mode in which driving battery 3 is charged with the power supplied by secondary battery 13 used for buffering. Secondary battery 13 used for buffering includes at least one cell in which a battery element with a positive electrode plate and a negative electrode plate that are laminated therein is sealed with an outer cover film.

摘要翻译： 充电装置10包括用于缓冲的二次电池13，向用于缓冲的二次电池13提供直流电的整流器11，经由充电电缆4连接到电动汽车2中的驱动电池3的DC-DC转换器14，开关控制电路12， 等温风力发电机16，其用于从用于缓冲的二次电池13的外部调节用于缓冲的二次电池13的温度。 开关控制电路12在由用于缓冲的二次电池13中积蓄由整流器11供给的电力的第一模式和第二模式之间切换充电装置10，其中驱动电池3由用于缓冲的二次电池13提供的电力充电 。 用于缓冲的二次电池13包括至少一个电池，其中具有正电极板的电池元件和负极板被层压在其中的电池元件用外覆盖膜密封。

公开(公告)号：US06188127B1

公开(公告)日：2001-02-13

申请号：US08604115

申请日：1996-02-20

申请人： Naoji Senba ,  Yuzo Shimada ,  Kazuaki Utsumi ,  Kenichi Tokuno ,  Ikushi Morizaki ,  Akihiro Dohya ,  Manabu Bonkohara

发明人： Naoji Senba ,  Yuzo Shimada ,  Kazuaki Utsumi ,  Kenichi Tokuno ,  Ikushi Morizaki ,  Akihiro Dohya ,  Manabu Bonkohara

IPC分类号： H01L2302

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012

摘要： In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of such carrier substrates or carrier films are connected to each other by bumps via through holes which are electrically connected to the wiring conductors, thereby completing a tridimensional stack module. The module achieves a miniature, thin, dense, low cost, and reliable structure without resorting to a wire bonding system or a TAB (Tape Automated Bonding) system. In addition, the module has a minimum of wiring length and a desirable electric characteristic.

摘要翻译： 在半导体封装堆叠模块中，通过微小的凸块将LSI（大规模集成电路）安装在陶瓷载体基板或形成布线导体的柔性载体膜上。 在注入密封树脂之后，通过例如研磨使芯片变薄。 多个这样的载体基板或载体膜通过与导线导电连接的通孔而由凸块彼此连接，从而完成三维叠层模块。 该模块实现了微型，薄型，致密，低成本和可靠的结构，而不需要使用引线接合系统或TAB（磁带自动接合）系统。 此外，该模块具有最小的布线长度和期望的电特性。

公开(公告)号：US5545281A

公开(公告)日：1996-08-13

申请号：US217973

申请日：1994-03-25

申请人： Koji Matsui ,  Mitsuru Kimura ,  Kazuaki Utsumi ,  Eiichi Ogawa ,  Hiroshi Komano ,  Toshimi Aoyama

发明人： Koji Matsui ,  Mitsuru Kimura ,  Kazuaki Utsumi ,  Eiichi Ogawa ,  Hiroshi Komano ,  Toshimi Aoyama

IPC分类号： H01L21/60 ,  H01L21/603 ,  H01L21/98 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46 ,  B32B31/12 ,  B32B31/20 ,  B32B31/28 ,  H05K3/30

CPC分类号： H05K3/4617 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2203/0278 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/328 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An integrated circuit connecting method that includes connecting electrode pads on an integrated circuit device to electrode terminals on a base with metal bumps interposed, the electrode terminals being formed in registry with the electrode pads. The method includes the steps of forming metal bumps on a surface of at least one of the electrode pads and the electrode terminals; covering the surface on at least one of the integrated circuit device side and the base side with a resin that cures upon exposure to active energy rays; patterning the resin to strip selectively the coating of the resin over one of the electrode pads and the electrode terminals; bringing the electrode pads and the electrode terminals into a face-to-face relationship, allowing the metal bumps to contact one of the opposing electrode pads and electrode terminals, performing thermocompressing so that the resin coating will adhere closely to one of the integrated circuit device and the base while, at the same time, the electrode pads are connected to the electrode terminals with the metal bumps interposed; and performing at least one of heat treatment and exposure to active energy rays.

摘要翻译： 一种集成电路连接方法，其包括将集成电路器件上的电极焊盘连接到基底上的电极端子，并插入金属凸块，所述电极端子与电极焊盘对准形成。 该方法包括在至少一个电极焊盘和电极端子的表面上形成金属凸块的步骤; 在集成电路器件侧和基底侧的至少一个上覆盖表面，该树脂在暴露于活性能量射线时固化; 图案化树脂以在电极焊盘和电极端子之一上选择性地剥离树脂涂层; 使电极焊盘和电极端子成为面对面的关系，允许金属凸块接触相对的电极焊盘和电极端子之一，进行热压缩，使得树脂涂层将紧密地粘附到集成电路器件 并且同时将电极焊盘连接到电极端子，同时插入金属凸块; 并进行热处理和暴露于活性能量射线中的至少一种。

公开(公告)号：US5262369A

公开(公告)日：1993-11-16

申请号：US807879

申请日：1992-01-21

申请人： Toru Mori ,  Atsushi Ochi ,  Kazuaki Utsumi ,  Tetsuo Yoshimoto ,  Souichiro Sugano ,  Shinji Abe

发明人： Toru Mori ,  Atsushi Ochi ,  Kazuaki Utsumi ,  Tetsuo Yoshimoto ,  Souichiro Sugano ,  Shinji Abe

IPC分类号： C04B35/00 ,  C04B35/499 ,  H01B3/12 ,  H01G4/12 ,  C04B35/46

CPC分类号： C04B35/499 ,  H01G4/1254

摘要： The improved dielectric ceramic composition has sufficiently high dielectric constant, high insulation resistance and small dielectric loss to be suitable for use as a material for ceramic capacitors. The composition comprises as a main component a three-component ceramic composition in solid solution having the formula Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3 -Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3 -PbTiO.sub.3 which, when expressed by xPb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3 -yPb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3 -zPbTiO.sub.3, is defined by the area surrounded by the following points of (x, y, z), i.e., (0.70, 0.20, 0.10), (0.70, 0.15, 0.15), (0.83, 0.02, 0.15), (0.96, 0.02, 0.02) and (0.78, 0.20, 0.02), and this ceramic composition further contains a Mn oxide or a Mn-containing complex oxide as an additive.

公开(公告)号：US4650777A

公开(公告)日：1987-03-17

申请号：US693105

申请日：1985-01-22

申请人： Yasuhiro Kurokawa ,  Kazuaki Utsumi ,  Hideo Takamizawa

发明人： Yasuhiro Kurokawa ,  Kazuaki Utsumi ,  Hideo Takamizawa

IPC分类号： C04B35/581 ,  C04B35/58

CPC分类号： C04B35/581

摘要： Aluminum nitride ceramics is prepared by mixing acetylide of calcium, strontium, barium or other material with raw aluminum nitride powder with a content between 0.02 and 10 wt %, forming the mixture into a predetermined shape and sintering the formed body in a non-oxidizing atmosphere such as nitrogen gas by pressureless and/or pressure sintering technique.

摘要翻译： 通过将钙，锶，钡或其他材料的乙炔化物与含量为0.02至10重量％的原料氮化铝粉末混合制备氮化铝陶瓷，将混合物形成预定形状，并在非氧化性气氛中烧结成形体 例如通过无压和/或加压烧结技术的氮气。

公开(公告)号：US4030937A

公开(公告)日：1977-06-21

申请号：US673120

申请日：1976-04-02

申请人： Tomotoshi Nakai ,  Kazuaki Utsumi ,  Tomeji Ohno

发明人： Tomotoshi Nakai ,  Kazuaki Utsumi ,  Tomeji Ohno

IPC分类号： H01G4/12 ,  C04B35/46 ,  C04B35/462 ,  C04B35/465 ,  H01B3/12 ,  H01G7/06 ,  C04B35/50

CPC分类号： C04B35/465 ,  C04B35/462 ,  H01G7/06

摘要： A ceramic dielectric material according to the present invention has a composition consisting essentially of La.sub.2 Ti.sub.2 O.sub.7, Sr.sub.2 Nb.sub.2 O.sub.7, and 1/2Mg.sub.2x --Ti.sub.2.sub.-2x O.sub.4.sub.-2x, where x lies in a range of 0 to 1.0. This material has a relatively large dielectric constant, a very stable temperature coefficient of the dielectric constant over a wide temperature range, a widely controllable value of the temperature coefficient of the dielectric constant, and a small dielectric loss. The temperature coefficient of the dielectric constant can be determined optionally in a wide range of value by simply changing the ratios among the three constituents of the composition.

摘要翻译： 根据本发明的陶瓷电介质材料具有基本上由La 2 Ti 2 O 7，Sr 2 Nb 2 O 7和1 / 2Mg 2 x -Ti 2 -2 x O 4 -2 x组成的组成，其中x在0至1.0的范围内。 该材料具有相对较大的介电常数，在宽的温度范围内介电常数的非常稳定的温度系数，介电常数的温度系数的广泛可控的值和小的介电损耗。 介电常数的温度系数可以通过简单地改变组合物的三种成分之间的比率来任意地在宽范围的值范围内确定。