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105 条记录 (耗时 0.028 秒)

    Copper alloy sliding material
    31.
    发明授权
    Copper alloy sliding material 有权

    公开(公告)号：US06334914B1

    公开(公告)日：2002-01-01

    申请号：US09749442

    申请日：2000-12-28

    申请人： Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

    发明人： Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

    IPC分类号： C22C902

    摘要： Disclosed is a copper alloy sliding material comprising 0.5 to 15 mass % Sn and 0.1 to 10 vol % of hard particles consisting of one or more selected from WC, W2C and Mo2C. The hard particles have preferably an average particle size of 0.1 to 10 &mgr;m, whereby they are dispersed in the copper alloy matrix so as to make the sliding-contact surface uneven, from which the hard particles protrude partially. The sliding material comprises an amount or a total amount of not more than 40 mass % of one or more selected from Ni, Ag, Fe, Al, Zn, Mn, Co, Si and P, an amount or a total amount of not more than 10 mass % of Bi and/or Pb, and/or an amount or a total amount of not more than 10 vol % of a solid lubricant comprising BN, graphite, MoS2 and/or WS2.

    Semiconductor wafer polishing machine
    33.
    发明授权
    Semiconductor wafer polishing machine 失效
    半导体晶圆抛光机

    公开(公告)号：US5876272A

    公开(公告)日：1999-03-02

    申请号：US885870

    申请日：1997-06-30

    申请人： Takao Inaba ,  Masaaki Oguri ,  Kenji Sakai

    发明人： Takao Inaba ,  Masaaki Oguri ,  Kenji Sakai

    IPC分类号： B24B1/00 ,  B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

    CPC分类号： H01L21/02024 ,  B24B37/30

    摘要： A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.

    摘要翻译： 晶片安装板松散地插入壳体中，并且晶片安装板以相对于抛光垫可摆动和垂直和水平移动的方式被支撑。 在晶片安装板和壳体之间形成空气室。 通过控制空气室的内部压力，可以控制施加在晶片安装板上的抛光压力。 由于晶片安装板的整个顶侧能够被均匀地加压，所以可以在半导体晶片的整个表面上施加均匀的抛光压力。 此外，晶片安装板根据抛光垫的倾斜度的变化而倾斜，使得半导体晶片和抛光垫可以保持在平行位置。

    Heterodyne interferometric optical fiber displacement sensor for measuring displacement of an object
    35.
    发明授权
    Heterodyne interferometric optical fiber displacement sensor for measuring displacement of an object 失效
    用于测量物体位移的异步干涉光纤位移传感器

    公开(公告)号：US5402230A

    公开(公告)日：1995-03-28

    申请号：US989640

    申请日：1992-12-11

    申请人： Qian Tian ,  Enyao Zhang ,  Donglei Tang ,  Akira Shimokohbe ,  Masahiro Akahane ,  Kenji Sakai

    发明人： Qian Tian ,  Enyao Zhang ,  Donglei Tang ,  Akira Shimokohbe ,  Masahiro Akahane ,  Kenji Sakai

    IPC分类号： G01B9/02 ,  G01D5/26

    CPC分类号： G01D5/268 ,  G01B9/02002 ,  G01B9/02045 ,  G01B9/02067 ,  G01S17/325 ,  G01S7/4818 ,  G01S7/4911 ,  G01S7/4917

    摘要： A heterodyne interferometric optical fiber displacement sensor using a laser diode. The frequency and the intensity of the laser diode beam are periodically modulated by an injection current. The laser diode beam is routed to a rod lens via a first optical fiber, an optical fiber coupler, and a second optical fiber. The interference light resulting from the interference between the light reflected from the exit surface of the rod lens and the light reflected from an object surface is routed to a third optical fiber via the optical fiber coupler, which is then detected by a photodiode attached to the end of the third optical fiber. From the output of the photodiode, a given frequency component is extracted using a bandpass-filter. The extracted signal is converted into a pulse signal. The frequency change of the pulse signal (equivalent to a doppler frequency shift caused by the movement of the object surface) is accumulated using an electronic circuit. Then, the accumulated value is used to calculate the displacement of the object surface.

    摘要翻译： 使用激光二极管的外差干涉光纤位移传感器。 激光二极管光束的频率和强度由注入电流周期性地调制。 激光二极管光束通过第一光纤，光纤耦合器和第二光纤被路由到棒状透镜。 由从棒状透镜的出射面反射的光与从物体表面反射的光之间的干涉产生的干涉光通过光纤耦合器被路由到第三光纤，然后光纤耦合器被附接到 第三根光纤的端部。 从光电二极管的输出，使用带通滤波器提取给定的频率分量。 提取的信号被转换成脉冲信号。 使用电子电路累积脉冲信号的频率变化（相当于由物体表面的移动引起的多普勒频移）。 然后，累加值用于计算物体表面的位移。

    Copper based alloy for wear resistant sliding layer and sliding member
    36.
    发明授权
    Copper based alloy for wear resistant sliding layer and sliding member 失效
    用于耐磨滑动层和滑动构件的铜基合金

    公开(公告)号：US5346668A

    公开(公告)日：1994-09-13

    申请号：US40028

    申请日：1993-03-30

    申请人： Tadashi Tanaka ,  Masaaki Sakamoto ,  Koichi Yamamoto ,  Kenji Sakai

    发明人： Tadashi Tanaka ,  Masaaki Sakamoto ,  Koichi Yamamoto ,  Kenji Sakai

    IPC分类号： B22F5/00 ,  B22F7/04 ,  C22C1/04 ,  C22C9/04 ,  C22C9/08 ,  F16C33/12 ,  C22C30/00 ,  C22C9/00

    CPC分类号： C22C9/08 ,  C22C9/04 ,  F16C33/121 ,  F16C17/04 ,  F16C17/18 ,  F16C2204/14 ,  F16C2360/24

    摘要： A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with reduced risk of seizure and corrosion. The alloy can be produced by mixing Pb powder and Ni--B alloy powder with Cu--Zn powder or Cu--Zn--Sn alloy powder, or mixing Ni--B alloy powder with Cu--Zn--Pb alloy powder or Cu--Zn--Sn--Pb alloy powder. The alloy can be compacted and sintered to form a sliding member or a composite sliding member is obtained by sintering and integrating the alloy on a steel backing plate optionally having a surface plated with copper.

    摘要翻译： 滑动材料的Cu基耐磨合金基本上由10-35％的Zn，2-20％的Pb，1-10％的Ni，0.1-1％B的重量组成，并且根据需要，含有0.5-10 Sn的％。 该合金可以在恶劣的使用条件下在高速和高温下使用，降低了发生和腐蚀的风险。 该合金可以通过将Pb粉末和Ni-B合金粉末与Cu-Zn粉末或Cu-Zn-Sn合金粉末混合，或者将Ni-B合金粉末与Cu-Zn-Pb合金粉末或Cu-Zn-Sn -Pb合金粉末。 可以将合金压实并烧结以形成滑动部件，或者通过将合金烧结并整合到可任选具有镀铜表面的钢背衬板上来获得复合滑动部件。

    Cap for writing equipment
    38.
    发明授权
    Cap for writing equipment 失效
    书写设备

    公开(公告)号：US4844642A

    公开(公告)日：1989-07-04

    申请号：US168637

    申请日：1988-03-04

    申请人： Takao Inaba ,  Kenji Sakai ,  Tadao Iida ,  Masahisa Maki

    发明人： Takao Inaba ,  Kenji Sakai ,  Tadao Iida ,  Masahisa Maki

    IPC分类号： B43K23/08 ,  B43K23/12

    CPC分类号： B43K23/128 ,  B43K23/124 ,  B43K23/126

    摘要： The cap for writing equipment comprises an air vent in the top portion, means installed on the inner peripheral surface for providing airtightness, a miniature cap movably enclosed in the axial direction in a space formed with the top face, the inner peripheral face and an annular boss for providing airtightness, a resilient seal positioned on the outside of the top of the miniature cap for blocking the ventilation between the air vent and the inside of the cap when the tip of the pen body is fitted into the cap and rebounders for pressing the miniature cap against the pen body. The annular boss for providing airtightness is so positioned as to block the ventilation in the longitudinal direction by forcing itself to contact the trunk of the pen when the tip of the pen body is fitted into the cap.

    摘要翻译： 用于书写设备的盖子包括顶部的通风口，安装在内周面上的用于提供气密性的装置，在轴向上可移动地封闭在由顶面，内周面和环形的空间形成的空间中的微型盖 用于提供气密的凸起，位于微型盖顶部的外侧的弹性密封件，用于当笔体的顶端装配到盖中时阻止通气孔和盖内部之间的通风，并且用于按压 针对笔体的微型帽。 用于提供气密性的环形凸台被定位成当笔体的尖端装配到盖中时通过强制自身接触笔的躯干来阻止纵向的通风。

    Automatic examination system for motor vehicles
    39.
    发明授权
    Automatic examination system for motor vehicles 失效
    汽车自动检测系统

    公开(公告)号：US4587838A

    公开(公告)日：1986-05-13

    申请号：US610816

    申请日：1984-05-15

    申请人： Kenji Sakai ,  Takeshi Wakabayashi ,  Kakumasa Fukuzawa ,  Teruzo Hiraoka

    发明人： Kenji Sakai ,  Takeshi Wakabayashi ,  Kakumasa Fukuzawa ,  Teruzo Hiraoka

    IPC分类号： G01M15/12 ,  G01M15/00

    CPC分类号： G01M15/12

    摘要： An automatic examination system for motor vehicles can quickly and automatically examine whether an engine of an automobile or the like is good or bad without making contact with the body of the automobile or the like includes a receiver section disposed apart from the engine of the automobile or the like for receiving via a space either electrical signals or sonic signals transmitted from the engine, a period measurement section for measuring the respective periods between the respective signals received by the receiver section, a period difference calculator section for calculating the respective period differences between the respective periods measured by the period measurement section, and a good/bad decision section for deciding whether the engine is good or bad by comparing the respective period differences calculated by the period difference calculator section with a given reference value.

    摘要翻译： 机动车辆的自动检查系统可以快速自动地检查汽车等的发动机是否良好，而不与汽车的主体等接触，包括与汽车的发动机分开设置的接收部，或者 用于经由空间接收从发动机发送的电信号或声音信号，用于测量由接收器部分接收的各个信号之间的各个周期的周期测量部分，用于计算由接收器部分接收的各个信号之间的各个周期差的周期差计算部分， 由周期测量部分测量的各个周期，以及通过将由周期差计算部分计算的各个周期差与给定参考值进行比较来判定发动机是否良好的良好/不良判定部分。

    Printed wiring board and method for manufacturing printed wiring board
    40.
    发明授权
    Printed wiring board and method for manufacturing printed wiring board 有权
    印刷电路板及制造印刷线路板的方法

    公开(公告)号：US09117730B2

    公开(公告)日：2015-08-25

    申请号：US13665473

    申请日：2012-10-31

    申请人： Ryojiro Tominaga ,  Kenji Sakai ,  Naoaki Fujii

    发明人： Ryojiro Tominaga ,  Kenji Sakai ,  Naoaki Fujii

    IPC分类号： H05K1/16 ,  H01L23/15 ,  H01L23/498 ,  H05K3/46

    CPC分类号： H01L23/15 ,  H01L23/49827 ,  H01L2224/16 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T29/49155

    摘要： A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.

    摘要翻译： 印刷布线板包括芯基板，形成在基板上的第一导电图案，具有第一绝缘层并形成在基板上的绝缘结构，使得第一绝缘层覆盖第一图案，形成在该结构上的第二导电图案 以及形成在所述结构上的第二绝缘层，使得所述第二绝缘层覆盖所述第二图案。 该结构具有通过第一绝缘层连接第一和第二图案的通孔导体，第一绝缘层包括含有增强纤维材料的第一层和形成在第一层上的第二层，使得第一层位于衬底侧 并且第二层位于第二绝缘层侧，第二层由与形成第二绝缘层的绝缘材料相同的材料的绝缘材料制成。