公开(公告)号：US06960390B2

公开(公告)日：2005-11-01

申请号：US10635501

申请日：2003-08-07

申请人： Kazuhiro Kosugi ,  Takeshi Miyakawa ,  Masanori Higano ,  Mikio Shimizu

发明人： Kazuhiro Kosugi ,  Takeshi Miyakawa ,  Masanori Higano ,  Mikio Shimizu

IPC分类号： B65D73/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B42D1/08 ,  B65D65/40 ,  B65D85/86 ,  C08K3/04 ,  C08L69/00 ,  B32B27/32

CPC分类号： B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/36 ,  B32B27/365 ,  B32B2307/202 ,  B32B2307/538 ,  B32B2313/04 ,  B32B2325/00 ,  B32B2355/02 ,  B32B2369/00 ,  B32B2439/06 ,  B42D1/08 ,  Y10S428/902 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31938

摘要： An electroconductive sheet comprising a substrate layer of a thermoplastic resin comprising an acrylonitrile-butadiene-styrene copolymer type resin and/or a polystyrene type resin and having laminated on at least one side of the substrate layer, a surface layer of an electroconductive resin composition comprising a polycarbonate type resin and from 5 to 50 wt % of carbon black.

摘要翻译： 一种导电片，其包含由包含丙烯腈 - 丁二烯 - 苯乙烯共聚物型树脂和/或聚苯乙烯类树脂的热塑性树脂的基材层，并且层压在基材层的至少一侧上，导电树脂组合物的表面层包含 聚碳酸酯型树脂和5〜50重量％的炭黑。

公开(公告)号：US08148456B2

公开(公告)日：2012-04-03

申请号：US12304785

申请日：2007-08-10

申请人： Yutaka Aoki ,  Takeshi Miyakawa

发明人： Yutaka Aoki ,  Takeshi Miyakawa

IPC分类号： C08K3/04

CPC分类号： B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/302 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B2264/108 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/554 ,  B32B2307/5825 ,  B32B2307/734 ,  B32B2439/00 ,  B32B2553/00 ,  C08K3/04 ,  C08L23/02 ,  C08L25/04 ,  C08L55/02 ,  C08L67/02 ,  C08L69/00 ,  H01B1/24 ,  Y10T428/1334 ,  Y10T428/1352 ,  Y10T428/24612 ,  Y10T428/31507 ,  C08L2666/02 ,  C08L2666/06 ,  C08L2666/24

摘要： To provide an electrically conductive resin composition with which contamination of an electronic component resulting from abrasion of an electrically conductive sheet by friction with the electronic component is small, and which is excellent in sealing properties with a cover tape.An electrically conductive resin composition comprising 100 parts by mass of a thermoplastic resin containing from 60 to 97 mass % of a polycarbonate resin and from 3 to 40 mass % of at least one hydrocarbon copolymer selected from the group consisting of an olefin copolymer and a styrene copolymer, and from 5 to 50 parts by mass of carbon black, and an electrically conductive sheet comprising the electrically conductive resin composition. Further, an electrically conductive sheet, comprising a substrate layer containing at least one thermoplastic resin selected from the group consisting of an acrylonitrile/butadiene/styrene copolymer (ABS) resin, a polycarbonate resin and a polyalkylene terephthalate resin, and a layer of the above electrically conductive resin composition formed on one side or both sides of the substrate layer.

摘要翻译： 为了提供导电性树脂组合物，通过与电子部件的摩擦而导致的导电性片材的磨损而导致的电子部件的污染小，并且与盖带的密封性优异。 一种导电性树脂组合物，其包含100质量份含有60〜97质量％的聚碳酸酯树脂的热塑性树脂和3〜40质量％的选自烯烃共聚物和苯乙烯的至少一种烃共聚物 共聚物和5〜50质量份炭黑，以及包含该导电性树脂组合物的导电片。 此外，导电片包括含有选自丙烯腈/丁二烯/苯乙烯共聚物（ABS）树脂，聚碳酸酯树脂和聚对苯二甲酸亚烷基二醇酯树脂中的至少一种热塑性树脂的基材层和上述层 导电树脂组合物形成在基底层的一侧或两侧。

公开(公告)号：US20100164362A1

公开(公告)日：2010-07-01

申请号：US12600377

申请日：2008-05-14

申请人： Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

发明人： Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

IPC分类号： H01J1/66 ,  H05K1/03

CPC分类号： H05K1/0274 ,  H01L33/60 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

摘要： Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.

摘要翻译： 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。

公开(公告)号：US07455896B2

公开(公告)日：2008-11-25

申请号：US10296937

申请日：2002-05-27

申请人： Tetsuo Fujimura ,  Takeshi Miyakawa ,  Mikio Shimizu ,  Satoshi Yokoyama ,  Masanori Higano ,  Masanori Ishii ,  Kazuhiro Kosugi ,  Takashi Tomizawa

发明人： Tetsuo Fujimura ,  Takeshi Miyakawa ,  Mikio Shimizu ,  Satoshi Yokoyama ,  Masanori Higano ,  Masanori Ishii ,  Kazuhiro Kosugi ,  Takashi Tomizawa

IPC分类号： B65D85/00 ,  B65D1/34

CPC分类号： H05K13/0084 ,  H01L2221/68313 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/1397 ,  Y10T428/239

摘要： A carrier tape body having an embossed tape continuously having pockets which contain an electronic component sealed with a cover tape, where the cover tape has a peeling static electrification amount of from −9 to +9 nC when the cover tape has a surface resistivity of at least 1011 Ω, and where the cover tape has a peeling static electrification amount of from −3 to +3 nC when the cover tape has a surface resistivity of less than 1011 Ω.

摘要翻译： 一种载带体，其具有连续具有包含用盖带密封的电子部件的凹坑的压花带，其中当胶带具有表面电阻率为at时，该胶带具有从-9至+9nC的剥离静电量 至少10±11Ω，当覆盖带的表面电阻率小于10-11时，覆盖带的剥离静电充电量为-3至+ 3nC >欧米茄。

公开(公告)号：USD580668S1

公开(公告)日：2008-11-18

申请号：US29292253

申请日：2007-10-04

申请人： Takeshi Miyakawa

设计人： Takeshi Miyakawa

公开(公告)号：USD575081S1

公开(公告)日：2008-08-19

申请号：US29292254

申请日：2007-10-04

申请人： Takeshi Miyakawa

设计人： Takeshi Miyakawa

公开(公告)号：USD555370S1

公开(公告)日：2007-11-20

申请号：US29273522

申请日：2007-03-07

申请人： Takeshi Miyakawa

设计人： Takeshi Miyakawa

公开(公告)号：US07291866B2

公开(公告)日：2007-11-06

申请号：US11149461

申请日：2005-06-10

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Takeshi Miyakawa ,  Hatsuo Takezawa

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Takeshi Miyakawa ,  Hatsuo Takezawa

IPC分类号： H01L29/22

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.

摘要翻译： 一种半导体发光器件包括：嵌入树脂; 第一引线，其具有嵌入在嵌入树脂中的第一内部引线部分和从嵌入树脂的一个侧面突出的第一外部引线部分; 第二引线，其具有嵌入在嵌入树脂中的第二内引线部分和从与嵌入树脂的一个侧面相对的侧面突出的第二外引线部分; 半导体发光芯片，安装在所述第一内引线部分的暴露于设置在所述嵌入树脂的上表面上的凹部中的部分上; 以及将半导体发光芯片与第二引线连接的线。 第一和第二内部引线部分以及第一和第二外部引线部分各自具有基本共面的后表面。 第一内引线部分的后表面的至少一部分和第二内引线部分的后表面的至少一部分未被嵌入树脂覆盖，但是露出。

公开(公告)号：US20070231549A1

公开(公告)日：2007-10-04

申请号：US11574729

申请日：2005-09-05

申请人： Takeshi Miyakawa ,  Yasushi Hirokawa ,  Masahiro Kuramoto

发明人： Takeshi Miyakawa ,  Yasushi Hirokawa ,  Masahiro Kuramoto

IPC分类号： B32B27/30

CPC分类号： B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/302 ,  B32B2264/108 ,  B32B2355/02 ,  B32B2439/00 ,  B32B2553/00 ,  Y10T428/1352 ,  Y10T428/24612 ,  Y10T428/31504

摘要： To provide a conductive composite sheet which has a small difference in physical properties between the machine and transverse directions and has high rigidity and folding endurance and which can easily be thermally formed into a tray or an embossed carrier tape. A composite sheet comprising at least one layer each of a substrate layer (layer A) made of a polystyrene resin and an ABS resin as the main components, a reinforcing layer (layer B) made of an ABS resin as the main component, and a surface layer (layer C) made of, as the main component, a polystyrene resin which contains a conductive filler, wherein the surface on at least one side is the above surface layer (layer C). Further, the surface layer (layer C) is preferably made of a composition containing from 2 to 100 parts by mass of carbon black per 100 parts by mass of the polystyrene resin. On the other hand, the substrate layer (layer A) and the reinforcing layer (layer B) preferably contain a specific amount of a styrene/butadiene/butylene/styrene block copolymer resin or the like.

摘要翻译： 为了提供在机器和横向之间的物理性质差异小的导电性复合片材，并且具有高刚性和耐折性，并且可以容易地热成型为托盘或压纹载带。 1.一种复合片材，其特征在于，包括由聚苯乙烯树脂制成的基材层（A层）和ABS树脂作为主要成分的至少一层，以ABS树脂为主要成分的增强层（B层）和 作为主要成分的含有导电性填料的聚苯乙烯树脂构成的表面层（C层），其中，至少一面的表面为上述表面层（C层）。 此外，表层（C层）优选由相对于100质量份聚苯乙烯树脂含有2〜100质量份炭黑的组合物构成。 另一方面，基材层（A层）和增强层（B层）优选含有特定量的苯乙烯/丁二烯/丁烯/苯乙烯嵌段共聚物树脂等。

公开(公告)号：US20060157722A1

公开(公告)日：2006-07-20

申请号：US11293358

申请日：2005-12-05

申请人： Hatsuo Takezawa ,  Shinichi Inagaki ,  Tetsuro Komatsu ,  Takeshi Miyakawa ,  Atsuo Inoue ,  Tsubasa Kusaka ,  Fujio Takahashi

发明人： Hatsuo Takezawa ,  Shinichi Inagaki ,  Tetsuro Komatsu ,  Takeshi Miyakawa ,  Atsuo Inoue ,  Tsubasa Kusaka ,  Fujio Takahashi

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： Various semiconductor light emitting devices are described. In one aspect, the semiconductor light emitting device may include, an insulating substrate having an electrode pattern; a metal body provided on the insulating substrate, the metal body having a through-hole; an adhesive layer provided between the insulating substrate and the metal body; a semiconductor light emitting element provided in the through-hole of the metal body, provided on the insulating substrate and electrically connected to the electrode pattern; and a resin configured to seal the semiconductor light emitting, wherein an inner surface of the through-hole faces the semiconductor light emitting element. The inner surface may have a slanted surface and at least a part of the light emitted from the semiconductor light emitting element reflected by the inner surface.

摘要翻译： 描述各种半导体发光器件。 一方面，半导体发光器件可以包括具有电极图案的绝缘基板; 设置在所述绝缘基板上的金属体，所述金属体具有通孔; 设置在所述绝缘基板和所述金属体之间的粘合层; 设置在所述金属体的通孔中的半导体发光元件，设置在所述绝缘基板上并与所述电极图案电连接; 以及被配置为密封半导体发光的树脂，其中，所述通孔的内表面面对所述半导体发光元件。 内表面可以具有从内表面反射的从半导体发光元件发射的光的倾斜表面和至少一部分光。