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    Conductive composite sheeting
    2.
    发明授权
    Conductive composite sheeting 有权
    导电复合板材

    公开(公告)号：US07794807B2

    公开(公告)日：2010-09-14

    申请号：US11574729

    申请日：2005-09-05

    申请人： Takeshi Miyakawa ,  Yasushi Hirokawa ,  Masahiro Kuramoto

    发明人： Takeshi Miyakawa ,  Yasushi Hirokawa ,  Masahiro Kuramoto

    IPC分类号： B29D22/00 ,  B32B3/00 ,  B32B9/04 ,  H01B1/06 ,  C08L9/00

    CPC分类号： B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/302 ,  B32B2264/108 ,  B32B2355/02 ,  B32B2439/00 ,  B32B2553/00 ,  Y10T428/1352 ,  Y10T428/24612 ,  Y10T428/31504

    摘要： A composite sheet comprising at least one layer each of a substrate layer (layer A) made of a polystyrene resin and an ABS resin as the main components, a reinforcing layer (layer B) made of an ABS resin as the main component, and a surface layer (layer C) made of, as the main component, a polystyrene resin which contains a conductive filler, wherein the surface on at least one side is the above surface layer (layer C) is useful for a conductive composite sheet which has a small difference in physical properties between the machine and transverse directions and has high rigidity and folding endurance and which can easily be thermally formed into a tray or an embossed carrier tape.

    摘要翻译： 1.一种复合片材，其特征在于，包括由聚苯乙烯树脂制成的基材层（A层）和ABS树脂作为主要成分的至少一层，以ABS树脂为主要成分的增强层（B层）和 作为主要成分的由含有导电性填料的聚苯乙烯树脂构成的表面层（C层），其中，至少一面的表面为上述表面层（C层），可用于具有 机器与横向之间的物理性能差异小，具有高刚性和耐折性，并且可以容易地热成型为托盘或压纹载带。

    Packaging container for electronic part
    4.
    发明授权
    Packaging container for electronic part 失效
    电子部件包装容器

    公开(公告)号：US07014896B1

    公开(公告)日：2006-03-21

    申请号：US10030103

    申请日：2000-11-27

    申请人： Takeshi Miyakawa ,  Mikio Shimizu ,  Yuichi Kadoya ,  Masafumi Hiura ,  Minoru Oda

    发明人： Takeshi Miyakawa ,  Mikio Shimizu ,  Yuichi Kadoya ,  Masafumi Hiura ,  Minoru Oda

    IPC分类号： B29D22/00 ,  B29D23/00

    CPC分类号： C08L67/02 ,  B32B27/36 ,  Y10T428/1352 ,  Y10T428/2817 ,  Y10T428/31507 ,  C08L69/00

    摘要： An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.

    摘要翻译： 一种电子部件包装容器，其包括形成在所述基底层的至少一侧上的具有包含聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的基层和包含聚碳酸酯型树脂的表层的多层聚酯片，其中， 基于聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的总量，层包含70至97重量％的聚对苯二甲酸乙二醇酯型树脂和3至30重量％的聚碳酸酯树脂，并且表层的厚度 为总厚度的10〜30％。

    Metal base circuit board
    6.
    发明授权
    Metal base circuit board 有权
    金属底座电路板

    公开(公告)号：US08426740B2

    公开(公告)日：2013-04-23

    申请号：US12994507

    申请日：2009-05-21

    申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Kiyokazu Yamazaki ,  Takashi Saiki

    发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Kiyokazu Yamazaki ,  Takashi Saiki

    IPC分类号： H05K1/03

    CPC分类号： H05K1/056 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0274 ,  H05K3/0061 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  H01L2924/00

    摘要： A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, and a white film formed on top of the insulating layer, circuit portion, and non-circuit portion, the total sum of the areas of the non-circuit portion and the circuit portion on top of the insulating layer being 50% or higher and 95% or lower relative to the area of the metal foil and the relation between the linear expansion coefficients of each of the materials being: linear expansion coefficient of insulating layer>linear expansion coefficient of metal foil>linear expansion coefficient of circuit portion and non-circuit portion, such that Lifespan of LEDs can be lengthened, and the workability of the printed circuit board during circuit formation and during LED mounting can be improved.

    摘要翻译： 一种金属基底电路板，具有线性膨胀系数为60ppm /℃以上且120ppm /℃以下的绝缘层，设置在绝缘层一侧的金属箔，其包含金属材料 线性膨胀系数为10ppm /℃以上，35ppm /℃以下，具有线性膨胀系数为10ppm /℃以上且35ppm的电路部分和非电路部分 以及形成在绝缘层，电路部分和非电路部分之上的白色膜，绝缘层顶部的非电路部分和电路部分的面积的总和 相对于金属箔的面积为50％以上且95％以下，各材料的线膨胀系数之间的关系为：绝缘层的线膨胀系数>金属箔的线膨胀系数>线膨胀系数 的 电路部分和非电路部分，使得LED的寿命可以延长，并且可以提高电路形成期间和LED安装期间印刷电路板的可加工性。

    Electroconductive resin composition
    7.
    发明授权
    Electroconductive resin composition 有权
    导电树脂组合物

    公开(公告)号：US07261840B2

    公开(公告)日：2007-08-28

    申请号：US10495656

    申请日：2002-12-19

    申请人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

    发明人： Takeshi Miyakawa ,  Katsuhisa Ogita ,  Masafumi Hiura ,  Minoru Oda

    IPC分类号： H01B1/24

    CPC分类号： H01L23/293 ,  C08K3/04 ,  C08L23/04 ,  C08L25/06 ,  C08L53/02 ,  C08L55/02 ,  C08L71/123 ,  H01L2924/0002 ,  Y10S428/922 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/24 ,  H01L2924/00

    摘要： An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 102 to 1010 Ω. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.

    摘要翻译： 提供了一种用于封装电子器件的导电树脂组合物，其中炭黑很可能通过磨损从模制产品的表面脱落的缺点。 它是一种导电树脂组合物，其包含至少一种选自聚苯醚树脂，聚苯乙烯树脂和ABS树脂的热塑性树脂和炭黑，并含有苯乙烯/丁二烯/丁烯/苯乙烯嵌段共聚物或 这种共聚物与烯烃树脂的混合物，并且具有10 2至10 10Ω的表面电阻率。 可以显着地降低与IC等接触时通过磨损而脱落的炭黑等导致的IC等的污染。

    Sheet
    8.
    发明授权
    Sheet 有权
    片

    公开(公告)号：US07199187B2

    公开(公告)日：2007-04-03

    申请号：US10494375

    申请日：2002-11-15

    申请人： Takeshi Miyakawa ,  Minoru Oda ,  Masafumi Hiura

    发明人： Takeshi Miyakawa ,  Minoru Oda ,  Masafumi Hiura

    IPC分类号： B32B27/30

    CPC分类号： B32B27/18 ,  B32B1/02 ,  B32B25/00 ,  B32B25/02 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/302 ,  B32B27/306 ,  B32B27/32 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2331/04 ,  B32B2355/02 ,  B32B2439/00 ,  C08L9/00 ,  C08L25/06 ,  C08L2205/02 ,  C08L2205/03 ,  Y10T428/12347 ,  Y10T428/1317 ,  Y10T428/1359 ,  Y10T428/15 ,  Y10T428/19 ,  Y10T428/249939 ,  Y10T428/31909 ,  Y10T428/31938 ,  C08L2666/08

    摘要： A sheet excellent in mechanical performance such as folding endurance is provided. A sheet having a substrate layer using an impact-resistant styrene type resin containing 2 to 15 wt % of rubber particles having a peak at less than 2 μm and an impact-resistant styrene type resin containing 0.2 to 10 wt % of rubber particles having a peak at 2 μm or more in a distribution of volume-based particle diameters, or a sheet having a substrate layer comprising an impact-resistant styrene type resin (A) containing 10 to 15 wt % of rubber having a volume average particle diameter of from 0.5 μm to 1.5 μm and an impact-resistant styrene type resin (B) containing 5 to 10 wt % of rubber having a volume average particle diameter of from 2.0 μm to 3.0 μm wherein (A) is from 50 to 95 wt % and (B) is from 5 to 50 wt % on the basis of the total amount of both components, and a surface layer formed on at least its one surface, is provided.

    摘要翻译： 提供了诸如耐折性能的机械性能优异的片材。 使用含有2〜15重量％的具有小于2μm的峰的橡胶粒子的耐冲击苯乙烯类树脂的基材层和含有0.2〜10重量％的橡胶粒子的耐冲击苯乙烯类树脂， 以体积为基准的粒径分布为2μm以上的峰，或具有包含10〜15重量％体积平均粒径的橡胶的耐冲击苯乙烯类树脂（A）的基材层的片材， 0.5〜1.5μm的橡胶和5〜10重量％的体积平均粒径为2.0〜3.0μm的橡胶的耐冲击苯乙烯类树脂（B），其中（A）为50〜95重量％，（A）为50〜 B）基于两种组分的总量为5至50重量％，并且至少在其一个表面上形成表面层。