公开(公告)号：US20180182938A1

公开(公告)日：2018-06-28

申请号：US15932184

申请日：2018-02-16

Applicant: Nichia Corporation

Inventor： Tomohide Miki

IPC: H01L33/56 ,  H01L33/50 ,  H01L33/46 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00012

Abstract: There is provided a light emitting device including a light emitting element, a covering member for covering a side surface of the light emitting element, and a light-transmissive member disposed on upper surfaces in a light emitting direction of the light emitting element and the covering member and having an end face on substantially the same plane as an end face of the covering member, wherein the covering member has a recess portion or a convex portion on the upper surface, a light emitting surface of the light emitting element and an upper surface other than the recess portion or the convex portion of the covering member are arranged on substantially the same plane, and the light-transmissive member is provided in contact with the recess portion or the convex portion.

公开(公告)号：US09808970B2

公开(公告)日：2017-11-07

申请号：US13893924

申请日：2013-05-14

Applicant: NICHIA CORPORATION

Inventor： Masaki Hayashi ,  Hiroto Tamaki ,  Masafumi Kuramoto ,  Tomohide Miki ,  Takayuki Sano ,  Tomohisa Kishimoto

IPC: B29C45/02 ,  B29C45/28 ,  B29D11/00 ,  H01L33/26 ,  B29K63/00

CPC classification number: B29C45/02 ,  B29C45/2806 ,  B29D11/0074 ,  B29K2063/00 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00012

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

公开(公告)号：US09773959B2

公开(公告)日：2017-09-26

申请号：US14603148

申请日：2015-01-22

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US09490411B2

公开(公告)日：2016-11-08

申请号：US14928570

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi Ichikawa ,  Masaki Hayashi ,  Shimpei Sasaoka ,  Tomohide Miki

IPC: H01L21/00 ,  H01L21/283 ,  H01L29/66 ,  H01L33/62 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/48 ,  H01L23/00 ,  H01L33/64

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20160204321A1

公开(公告)日：2016-07-14

申请号：US14757843

申请日：2015-12-24

Applicant: NICHIA CORPORATION

Inventor： Ryoji Naka ,  Naofumi Sumitani ,  Yasuo Kato ,  Tomohide Miki

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/56 ,  H01L33/44 ,  H01L33/60 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device includes a base having a first lead electrode and a second lead electrode. Each of the first lead electrode and the second lead electrode includes a reflecting layer which includes silver or silver alloy plating containing a sulfur-based gloss agent. A light emitting element is provided on one side of the base and is electrically connected to the first lead electrode and the second lead electrode. The reflecting layer is on the one side of the base. A sealer includes resin and is provided on the one side of the base to seal the light emitting element and at least a part of the first lead electrode and the second lead electrode. A light-transmissive protective film includes an inorganic matter and is provided between the reflecting layer and the sealer.

Abstract translation: 发光器件包括具有第一引线电极和第二引线电极的基极。 第一引线电极和第二引线电极中的每一个包括包含含有硫基光泽剂的银或银合金电镀的反射层。 发光元件设置在基座的一侧，并与第一引线电极和第二引线电极电连接。 反射层位于基底的一侧。 密封件包括树脂，并且设置在基座的一侧上，以密封发光元件和第一引线电极和第二引线电极的至少一部分。 透光保护膜包括无机物质，并且设置在反射层和密封剂之间。