公开(公告)号：US20140117396A1

公开(公告)日：2014-05-01

申请号：US14118475

申请日：2012-05-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Eisert ,  Torsten Baade ,  Michael Zitzlsperger

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/52

CPC classification number: H01L33/502 ,  H01L33/06 ,  H01L33/28 ,  H01L33/32 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/505 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaves free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is designed to be absorbent and/or reflective and/or scattering for the primary radiation.

Abstract translation: 光电子半导体芯片包括发射初级光的半导体本体和通过至少部分初级光的波长转换而发射二次光的发光转换元件，其中发光转换元件具有固定到第一部分区域的第一部分区域 所述半导体本体的外表面，所述外表面发射初级光，并且释放所述外表面的第二部分区域，所述发光转换元件具有固定到所述第一层的背离半导体主体的表面的第二层， 与半导体本体间隔开，第一薄片至少部分地透射到主辐射，第二薄片的一部分至少覆盖第二部分区域，并且至少第二薄片的部分被设计成吸收和/ 或用于初级辐射的反射和/或散射。

公开(公告)号：US10020434B2

公开(公告)日：2018-07-10

申请号：US14958740

申请日：2015-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Harald Jaeger

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54 ,  H01L33/64 ,  H01L23/00 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face.

公开(公告)号：US09978918B2

公开(公告)日：2018-05-22

申请号：US14902834

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provided. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

公开(公告)号：US09780271B2

公开(公告)日：2017-10-03

申请号：US14346673

申请日：2012-12-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Michael Zitzlsperger

IPC: H01L21/56 ,  H01L27/15 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L21/66 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L22/32 ,  H01L24/97 ,  H01L27/15 ,  H01L33/005 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.

公开(公告)号：US20170263830A1

公开(公告)日：2017-09-14

申请号：US15509507

申请日：2015-09-08

Applicant: OSRAM OPTO Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Günter Spath

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/62 ,  H01L33/48

CPC classification number: E05F15/73 ,  E05F15/40 ,  E05F2015/765 ,  E05Y2400/54 ,  E05Y2800/352 ,  E05Y2900/10 ,  E06B9/11 ,  E06B9/171 ,  E06B2009/6836 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/44 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

公开(公告)号：US20170222092A1

公开(公告)日：2017-08-03

申请号：US15487277

申请日：2017-04-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knoerr ,  Klaus Mueller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L23/498 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

公开(公告)号：US09515015B2

公开(公告)日：2016-12-06

申请号：US14423835

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Thomas Schwarz ,  Michael Zitzlsperger

IPC: H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L21/48 ,  H01L51/52 ,  H01L33/64

CPC classification number: H01L23/49586 ,  H01L21/4839 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/647 ,  H01L51/5212 ,  H01L51/5228 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0033 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A housing includes a lead frame formed from electrically conductive material having first and second sides, a contact section contacting an electronic component at the first side, and at least one receiving section arranging the electronic component at the first side, wherein the contact and receiving sections are separated and the contact section is formed thinner than the receiving section in a direction perpendicular, a molding material having an opening, the receiving and contact regions exposed in the opening, and into which the leadframe is embedded such that part of the molding material is formed between the contact and receiving sections and the second side is covered by the molding material in the contact section, and the second side is free of molding material in the receiving section, wherein the molding material at the second side has at least one opening filled with the electrically insulating material.

Abstract translation: 壳体包括由导电材料形成的引线框架，该引线框架具有第一和第二侧面，接触部分与第一侧面处的电子部件接触，以及至少一个接收部分，其在第一侧布置电子部件，其中接触部分和接收部分 被分离，并且接触部分在垂直方向上比接收部分形成得更薄，具有开口的成型材料，接触和接触区域暴露在开口中，并且引线框架被嵌入其中，使得部分成型材料为 形成在接触部分和接收部分之间的第二面被接触部分中的成型材料覆盖，并且第二侧在接收部分中没有成型材料，其中第二侧的成型材料具有至少一个开口 与电绝缘材料。

公开(公告)号：US20160172559A1

公开(公告)日：2016-06-16

申请号：US14902834

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provide. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

Abstract translation: 可以使用一种方法来制造光电器件。 提供了具有组件的第一个引线框架部分。 该部件被设计成在发射侧发射电磁辐射。 发射侧背离载体。 提供了第二引线框部分。 在第一方法步骤中，组件和两个引线框架部分以第一封装材料封装，使得部件和引线框架部分嵌入灌封体中，但是其中部件的至少部分的发射区域保持 没有第一灌封材料，并且至少在组件的发射区域上方在灌封体中形成切口。 在第二方法步骤中，将第二灌封材料模制到灌封体的切口中，使得部件的出射侧被第二灌封材料覆盖。

公开(公告)号：US20160064634A1

公开(公告)日：2016-03-03

申请号：US14784414

申请日：2014-04-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Boris Eichenberg ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component includes a carrier substrate; at least one light emitting semiconductor chip arranged on a surface of the carrier substrate; and a frame part at least laterally partly surrounding the light emitting semiconductor chip; and comprising an injection-molded body, and wherein the frame part includes an injection-molded body and a diaphragm part, the diaphragm part including a protuberance enclosed by the injection-molded body.

Abstract translation: 光电子部件包括载体基板; 布置在所述载体基板的表面上的至少一个发光半导体芯片; 以及至少横向部分地围绕所述发光半导体芯片的框架部分; 并且包括注射成型体，并且其中所述框架部分包括注射成型体和隔膜部，所述隔膜部包括由所述注射成型体包围的突起。

公开(公告)号：US10040230B2

公开(公告)日：2018-08-07

申请号：US15126071

申请日：2015-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger

IPC: B29C45/14 ,  B29C45/02 ,  B29C43/18 ,  H01L21/56 ,  H01L23/043 ,  B29K705/04 ,  B29L31/34

Abstract: A method of producing a housing for an electronic device including: in a three-dimensional molding process, a housing part assembly consisting of a plurality of contiguous plastics housing parts is produced using a plastics material; and the housing part assembly is split up into a plurality of individual plastics housing parts by a separation procedure, each one of the parts forming at least a part of a housing, wherein the molding process is transfer molding or compression molding, a mold is used for the molding process including mold pins by which first side faces molded on during the molding process are produced on each of the plastics housing parts, the separation procedure results in second side faces being produced on each of the plastics housing parts, and the first and second side faces form outer faces of the plastics housing parts.