摘要:
To provide a method of forming a planar lipid-bilayer membrane for membrane protein analysis, by which downsizing, simplifying, and multichanneling of a device therefor are achieved. A planar lipid-bilayer membrane 24 is formed by filling a microchannel 12 with a buffer solution 18, the microchannel 12 disposed under a horizontal partition wall 13 having an aperture 14; applying a small amount of a lipid solution 20 as a droplet on the aperture 14 filled with the buffer solution 18 to thereby form a thin layer 21 of the lipid solution in a chamber, the chamber 17 being formed at a position corresponding to the aperture 14 and provided with a liquid trap 15 inside the chamber; and applying a buffer solution 23 as a droplet to the chamber 17 from the upper side of the chamber.
摘要:
The present invention provides simple and an accurate apparatuses for forming bilayer membranes by the contact of amphipathic monolayers. In one apparatus, amphipathic monolayers are brought into contact and fused by controlling the pressure of liquids introduced from microchannels forming an intersection containing a chamber. In another apparatus, the chamber includes a number of compartments and at least one construction portion. In this apparatus, a droplet is formed within each compartment and contact of amphipatic monolayers is accomplished by adjusting the size of the droplets.
摘要:
An ice-candy forming container is provided which produces ice-candies having a complicated shape copying the face of a cartoon character or the like with higher quality and without a loss in shape. A forming container includes a first mold having a pattern portion formed in one face thereof, and a second mold configured to slide over and along the one face of the first mold, in a close contact relation, in directions designated by arrows A1-A2, so as to contain the first mold therein. In such a containing position, the second mold contacts externally and closely substantially an entire surface of the outer periphery of the pattern portion.
摘要:
A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.
摘要:
There is provided a method of preparing organic-solvent-free artificial lipid membranes formed over microapertures of a substrate and a substrate for holding the artificial lipid membranes. The method of preparing artificial lipid membranes over microapertures of a substrate includes forming a lipid pattern 5 on the perimeter of microapertures 4 formed in a substrate 1, swelling the lipid pattern 5 by an electroformation method, fusing the swelled lipid pattern, and further swelling the fused lipid pattern for each microaperture to prepare dome-shaped organic-solvent-free lipid membranes 7.
摘要:
Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die-bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.
摘要:
The present invention provides a wiring board capable of realizing electrical connectivity even with connection leads having a fine pitch of 100 μm or less. The present invention relates to a wiring board with adhesive film comprising: a wiring board, in which the surface of a connection terminal portion on the end of a connection lead on the wiring board has a non-flat shape formed by a plating method; and, an adhesive film that covers the surface of the connection terminal portion and contains either a thermoplastic resin or a thermoplastic, thermosetting resin.
摘要:
The present invention generally relates to systems and methods of forming particles and, in certain aspects, to systems and methods of forming particles that are substantially monodisperse. Microfluidic systems and techniques for forming such particles are provided, for instance, particles may be formed using gellation, solidification, and/or chemical reactions such as cross-linking, polymerization, and/or interfacial polymerization reactions. In one aspect, the present invention is directed to a plurality of particles having an average dimension of less than about 500 micrometers and a distribution of dimensions such that no more than about 5% of the particles have a dimension greater than about 10% of the average dimension, which can be made via microfluidic systems. In one set of embodiments, at least some of the particles may comprise a metal, and in certain embodiments, at least some of the particles may comprise a magnetizable material. In another set of embodiments, at least some of the particles may be porous. In some embodiments, the invention includes non-spherical particles. Non-spherical particles may be formed, for example, by urging a fluidic droplet into a channel having a smallest dimension that is smaller than the diameter of a perfect mathematical sphere having a volume of the droplet, and solidifying the droplet, and/or by exposing at least a portion of a plurality of particles to an agent able to remove at least a portion of the particles.
摘要:
A structure for locking a display case door including a door handle, a pair of support members supporting the end portions of the handle, a lower support member of which has a through hole, and a locking piece extendably and retractably below the lower support member and having a through hole capable of facing the though hole of the lower support member so that an arm of a lock can be inserted through the both through holes. Since the locking piece can be positioned below and within the lower support member, it does not become any obstruction to the customers. A structure for treating dew drops dropped from a door of a display case including a tray for catching the dropped dew drops, a dew drops scattering inhibitor plate on the front portion of the tray, and a guide path on the rear portion of the tray and sloped down toward a machine room. The dropped dew drops are prevented from being scattered by the inhibitor plate and the collected water quickly and efficiently guided into the machine room by the sloped guide path. A structure for easily attaching without screws a packing support plate to a display case frame at a door position wherein the display case frame has grooves at least on its both inner side surfaces and the packing support plate has flange portions to be inserted into the grooves.
摘要:
An aluminum alloy sheet as a fin material for tubes of a heat exchanger, excellent in high-temperature sagging resistance and sacrificial anode property and having a high room-temperature strength, which consists essentially of:Manganese: from 0.95 to 1.50 wt. %,silicon: from 0.5 to 1.2 wt. %,zinc: from 0.1 to 2.0 wt. %,at least one element selected from the group consisting of:copper: from 0.05 to 0.60 wt. %, andmagnesium: from 0.05 to 0.60 wt. %, where, the total amount of said copper and said magnesium being up to 1.0 wt. %, andthe balance being aluminum and incidental impurities.the above-mentioned aluminum alloy sheet may further additionally contain at least one element selected from the group consisting of:chromium: from 0.03 to 0.30 wt. %, andzirconium: from 0.03 to 0.15 wt. % where, the total amount of said chromium and said zirconium being up to 0.4 wt. %.