公开(公告)号：US4491562A

公开(公告)日：1985-01-01

申请号：US501995

申请日：1983-06-07

申请人： Tasao Soga ,  Takaya Suzuki ,  Masahiro Okamura ,  Masahiro Gooda ,  Fumiyuki Kobayashi

发明人： Tasao Soga ,  Takaya Suzuki ,  Masahiro Okamura ,  Masahiro Gooda ,  Fumiyuki Kobayashi

IPC分类号： C22C13/00 ,  B23K35/26 ,  C22C30/04

CPC分类号： B23K35/268 ,  C22C30/04

摘要： This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.

摘要翻译： 本发明提供耐热疲劳低熔点焊料合金，由13〜20重量％的Bi，42〜50重量％的Pb，余量为Sn组成。 该焊料合金适用于印刷基板或混合基板上或印刷电路板上的搭接接头。

公开(公告)号：US20080224303A1

公开(公告)日：2008-09-18

申请号：US11873454

申请日：2007-10-17

申请人： Sunao Funakoshi ,  Katsumi Ishikawa ,  Tasao Soga

发明人： Sunao Funakoshi ,  Katsumi Ishikawa ,  Tasao Soga

IPC分类号： H01L23/12

CPC分类号： H01L23/473 ,  H01L23/051 ,  H01L23/427 ,  H01L23/4334 ,  H01L24/33 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/351 ,  H02M7/003 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering. Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing. Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders. The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader.

摘要翻译： 功率半导体模块的热阻和总体尺寸减小。 通过使用例如焊接，将配置有电极金属层的绝缘基板接合到功率半导体芯片的两个表面。 金属层也设置在绝缘基板的背面，金属层通过钎焊与散热器接合。 散热翅片设置在至少一个散热器的散热表面上。 每个散热器的散热侧被壳体覆盖以形成制冷剂室，制冷剂流过该制冷剂室，以将从半导体芯片传递的热量除去到散热器。

公开(公告)号：US4649990A

公开(公告)日：1987-03-17

申请号：US730642

申请日：1985-05-06

申请人： Yasutoshi Kurihara ,  Tasao Soga ,  Hiroaki Hachino ,  Kenji Miyata ,  Masahiro Okamura ,  Fumiyuki Kobayashi ,  Takahiro Daikoku

发明人： Yasutoshi Kurihara ,  Tasao Soga ,  Hiroaki Hachino ,  Kenji Miyata ,  Masahiro Okamura ,  Fumiyuki Kobayashi ,  Takahiro Daikoku

IPC分类号： H01L23/373 ,  H01L23/433 ,  F28F7/00

CPC分类号： H01L23/3731 ,  H01L23/4338 ,  H01L2224/16225

摘要： A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided between the semiconductor substrate and a housing so as to be pressed onto the semiconductor substrate. At least either one of the housing or the heat-conducting relay member is made of a sintered product which includes silicon carbide as a chief component.

摘要翻译： 一种用于冷却集成电路封装组件中的半导体衬底的导热冷却模块，其中通过小的焊料颗粒将半导体衬底安装在基板上，并且其包含单个衬底或层压衬底。 导热继电器件设置在半导体衬底和壳体之间，以便被压在半导体衬底上。 壳体或导热继电器构件中的至少一个由包括碳化硅作为主要成分的烧结产品制成。

公开(公告)号：US4562637A

公开(公告)日：1986-01-07

申请号：US622584

申请日：1984-06-20

申请人： Tadao Kushima ,  Tasao Soga ,  Takaya Suzuki

发明人： Tadao Kushima ,  Tasao Soga ,  Takaya Suzuki

IPC分类号： H01L31/042 ,  H01L31/05 ,  H05K3/36 ,  H01L31/18

CPC分类号： H01L31/1876 ,  H01L31/0512 ,  H05K3/363 ,  Y02E10/50 ,  Y02P70/521 ,  Y10T29/49169 ,  Y10T29/49179 ,  Y10T29/49181

摘要： A method of manufacturing a solar battery by serially connecting a plurality of solar battery elements arranged spaced from each other. A pair of flexible films are used to sandwich the arrangement of the solar battery elements, and each of the flexible films has a plurality of conductive members formed thereon at positions respectively corresponding to the solar battery elements. However, each conductive member has one end portion extended beyond the surface of the corresponding solar battery element in the direction of the alignment of the solar battery elements. Thus, when the pair of flexible films are disposed to sandwich the solar battery elements, the extended end portion of the conductive member on the side of the light receiving surface of one solar battery element is positioned in the space between adjacent solar battery elements opposite the end portion of the conductive member on the side of the back surface of the next solar battery element. By welding both end portions of the conductive members by, for example, a laser beam, the adjacent solar battery elements are successively connected in series.

摘要翻译： 通过串联连接彼此间隔布置的多个太阳能电池元件来制造太阳能电池的方法。 使用一对柔性膜来夹持太阳能电池元件的布置，并且每个柔性膜在分别对应于太阳能电池元件的位置处形成有多个导电构件。 然而，每个导电构件具有在太阳能电池元件的对准方向上延伸超过相应的太阳能电池元件的表面的一个端部。 因此，当一对柔性膜被设置成夹持太阳能电池元件时，导电构件的一个太阳能电池元件的光接收表面侧的延伸端部位于相邻的太阳能电池元件之间的空间中 导电构件的下一个太阳能电池元件的背面侧的端部。 通过例如通过激光束焊接导电部件的两端部，相邻的太阳能电池元件依次连续地连接。

公开(公告)号：US08004075B2

公开(公告)日：2011-08-23

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US07671465B2

公开(公告)日：2010-03-02

申请号：US11657458

申请日：2007-01-25

申请人： Sunao Funakoshi ,  Katsumi Ishikawa ,  Tasao Soga

发明人： Sunao Funakoshi ,  Katsumi Ishikawa ,  Tasao Soga

IPC分类号： H01L23/10

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L25/071 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor module having an increased reliability against thermal fatigue includes a power semiconductor element, a lower-side electrode connected to the lower side of the element, a first insulating substrate connected to the upper side of the lower-side electrode and having metallic foils bonded on both surfaces thereof, an upper-side electrode connected to the upper side of the power semiconductor element, a second insulating substrate connected to the upper side of the upper-side electrode and having metallic foils bonded on both surfaces thereof, a first heat spreader connected to the lower side of the first insulating substrate, and a second heat spreader connected to the upper side of the second insulating substrate. The power semiconductor element and the first and second insulating substrates are sealed with a resin.

摘要翻译： 具有增加的耐热疲劳可靠性的功率半导体模块包括功率半导体元件，连接到元件下侧的下侧电极，连接到下侧电极的上侧并具有金属箔的第一绝缘基板 连接到功率半导体元件的上侧的上侧电极，与上侧电极的上侧连接并且具有接合在其两面的金属箔的第二绝缘基板，第一热量 连接到第一绝缘基板的下侧的扩展器和连接到第二绝缘基板的上侧的第二散热器。 功率半导体元件和第一绝缘基板和第二绝缘基板用树脂密封。

公开(公告)号：US20070246833A1

公开(公告)日：2007-10-25

申请号：US11739122

申请日：2007-04-24

申请人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

发明人： Tasao Soga ,  Daisuke Kawase ,  Kazuhiro Suzuki ,  Eiichi Morisaki ,  Katsuaki Saito ,  Hanae Shimokawa

IPC分类号： H01L23/48

CPC分类号： H01L23/24 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0603 ,  H01L2224/26145 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48491 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3651 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2924/3512

摘要： Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significantly shortened with respect to the temperature cycle test, and the conventional module structure is in the situation having difficulty in securing high reliability. Thus, the present invention has an object to select compositions from which increase in life can be expected at a low strain rate. In Sn solder, by doping In by 3 to 7% and Ag by 2 to 4.5%, the effect of delaying crack development at a low strain rate is found out, and as a representative composition stable at a high temperature, Sn-3Ag-0.5Cu-5In is selected. Further, for enhancement of reliability, a method for partially coating a solder end portion with a resin is shown.

摘要翻译： 由于环境问题，使用无铅焊料变得至关重要。 电源模块通过焊接大面积的基板形成。 已知在Sn-3Ag-0.5Cu中，相对于基板的翘曲变形很大而难以蠕变变形，相对于温度循环试验，寿命显着缩短，现有的模块结构在 难以确保高可靠性。 因此，本发明的目的是选择可以在低应变率下预期寿命增加的组合物。 在Sn焊料中，通过将In掺杂3〜7％，Ag增加2〜4.5％，发现在低应变速率下延迟裂纹扩展的效果，作为代表性组合物在高温下稳定，Sn-3Ag- 选择0.5Cu-5In。 此外，为了提高可靠性，示出了用树脂部分地涂覆焊料端部的方法。

公开(公告)号：US20070216013A1

公开(公告)日：2007-09-20

申请号：US11657458

申请日：2007-01-25

申请人： Sunao Funakoshi ,  Katsumi Ishikawa ,  Tasao Soga

发明人： Sunao Funakoshi ,  Katsumi Ishikawa ,  Tasao Soga

IPC分类号： H01L23/52

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L25/071 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor module having an increased reliability against thermal fatigue includes a power semiconductor element, a lower-side electrode connected to the lower side of the element, a first insulating substrate connected to the upper side of the lower-side electrode and having metallic foils bonded on both surfaces thereof, an upper-side electrode connected to the upper side of the power semiconductor element, a second insulating substrate connected to the upper side of the upper-side electrode and having metallic foils bonded on both surfaces thereof, a first heat spreader connected to the lower side of the first insulating substrate, and a second heat spreader connected to the upper side of the second insulating substrate. The power semiconductor element and the first and second insulating substrates are sealed with a resin.

摘要翻译： 具有增加的耐热疲劳可靠性的功率半导体模块包括功率半导体元件，连接到元件下侧的下侧电极，连接到下侧电极的上侧并具有金属箔的第一绝缘基板 连接到功率半导体元件的上侧的上侧电极，与上侧电极的上侧连接并且具有接合在其两面的金属箔的第二绝缘基板，第一热量 连接到第一绝缘基板的下侧的扩展器和连接到第二绝缘基板的上侧的第二散热器。 功率半导体元件和第一绝缘基板和第二绝缘基板用树脂密封。

公开(公告)号：US5867809A

公开(公告)日：1999-02-02

申请号：US438477

申请日：1995-05-10

申请人： Tasao Soga ,  Hanae Shimokawa ,  Masahide Harada ,  Tatsuya Suzuki ,  Yuji Ochiai ,  Asao Nakano ,  Hiroyoshi Matsumura ,  Tsuneaki Kamei

发明人： Tasao Soga ,  Hanae Shimokawa ,  Masahide Harada ,  Tatsuya Suzuki ,  Yuji Ochiai ,  Asao Nakano ,  Hiroyoshi Matsumura ,  Tsuneaki Kamei

IPC分类号： G01R31/00 ,  B29B17/02 ,  G06F11/00 ,  G06F11/30 ,  G06F11/34 ,  G07C3/00 ,  G05D23/00

CPC分类号： G07C3/00 ,  G06F11/3031 ,  G06F11/3055 ,  G06F11/3058 ,  G06F11/3093 ,  G06F11/008 ,  G06F11/3096 ,  G06F11/3419 ,  G06F11/3476 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  Y02B60/165

摘要： The present invention relates to an electric appliance and a remaining life estimation system wherein the electric appliance having a printed circuit board on which at least LSI components are mounted includes an IC with sensor. The IC includes a time monitor for calculating the operation status which is a use condition affecting the life of a reusable component of the appliance, a temperature and humidity sensor for detecting at least temperature and humidity environmental conditions affecting the life of the reusable component, and a memory for storing the history of temperature and humidity in correspondence with the history of operation status. A control unit controls storage of the history of temperature and humidity which is detected by the temperature and humidity sensor so as to be stored in the memory in correspondence with the history of operation status which is calculated by the time monitor, and allows, when the remaining life of the component is evaluated so as to decide whether or not to reuse it, external reading of the history of temperature and humidity corresponding to the history of operation status from the memory.

摘要翻译： 本发明涉及一种电器和剩余寿命估计系统，其中具有至少LSI组件的印刷电路板的电器包括具有传感器的IC。 IC包括用于计算作为影响器具的可重复使用部件的寿命的使用条件的操作状态的时间监视器，用于检测影响可重用组件的寿命的至少温度和湿度环境条件的温度和湿度传感器，以及 用于存储与操作状态的历史相对应的温度和湿度历史的存储器。 控制单元控制由温度和湿度传感器检测的温度和湿度的历史记录，以便与由时间监视器计算的操作状态的历史相对应地存储在存储器中，并且当 评估组件的剩余寿命，以决定是否重用它，从存储器读取对应于操作状态的历史的温度和湿度的历史。

公开(公告)号：US4908695A

公开(公告)日：1990-03-13

申请号：US178650

申请日：1988-04-07

申请人： Atsushi Morihara ,  Yoshio Naganuma ,  Shuntaro Koyama ,  Kazuji Yamada ,  Tasao Soga ,  Hideo Arakawa ,  Shunsuke Nogita ,  Yukio Hishinuma

发明人： Atsushi Morihara ,  Yoshio Naganuma ,  Shuntaro Koyama ,  Kazuji Yamada ,  Tasao Soga ,  Hideo Arakawa ,  Shunsuke Nogita ,  Yukio Hishinuma

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.