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公开(公告)号：US6001901A
公开(公告)日：1999-12-14
申请号：US993867
申请日：1997-12-18
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.
摘要翻译： 包含环氧树脂，固化剂和无机填料的环氧树脂组合物在175℃下的熔融粘度至多为150泊。无机填料的BET比表面积为1.5-6m 2 / g，为 当以0.6 /秒的剪切速率测量无机填料和双酚F型液体环氧树脂的75/25混合物的粘度时。 和10 /秒。 通过E型粘度计在25 +/- 0.05℃的温度下，粘度在0.6 /秒的比例。 以10 /秒的粘度。 至少为3.5 / 1。 无机填料的加入量为组合物重量的80-90％。 该组合物适用于矩阵框架的封装。
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公开(公告)号：US5935314A
公开(公告)日：1999-08-10
申请号：US919344
申请日：1997-08-28
IPC分类号： C08K3/00 , C08K7/16 , C08K7/18 , C08L63/00 , C09C1/30 , C09C3/04 , H01L23/29 , H01L23/31 , C04B14/00
CPC分类号： H01L23/295 , C08K7/18 , C09C1/3009 , C09C3/04 , C01P2004/32 , C01P2004/61 , C01P2006/12 , C01P2006/22 , C01P2006/80 , H01L2924/0002 , Y10T428/12528
摘要： By removing a fraction of fine particles having a particle size of less than 2 .mu.m from starting inorganic filler particles having a mean particle size of 10-50 .mu.m and adding thereto particles having a mean particle size of 0.1-2 .mu.m and a specific surface area of 3-10 m.sup.2 /g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 .mu.m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.
摘要翻译： 通过从平均粒径为10-50μm的起始无机填料颗粒中除去一小部分粒径小于2μm的细颗粒，并加入平均粒度为0.1-2μm的颗粒和 比表面积为3-10m2 / g（BET），得到平均粒径为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。
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33.发明授权Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith 失效萘酚酚醛环氧树脂组合物和用其封装的半导体器件
公开(公告)号：US5358980A
公开(公告)日：1994-10-25
申请号：US181540
申请日：1994-01-14
IPC分类号： C08G59/14 , C08G59/32 , C08L63/00 , H01B3/40 , C08L61/06 , C08K3/22 , C08K3/28 , C08L61/08 , C08L61/12
CPC分类号： H01B3/40 , C08G59/145 , C08G59/3218 , C08L63/00
摘要： A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.
摘要翻译： 一种热固性树脂组合物，其包含（A）含有1-10重量％的缩水甘油基萘酚衍生物的含萘环的环氧树脂，（B）含有1至10重量％的萘酚衍生物的含萘环的酚醛树脂， 和（C）无机填料，其中萘酚衍生物的含量相对于总树脂成分为1〜5重量％适合于包封半导体器件，因为该组合物具有良好的成型性，并且固化成具有低系数 膨胀，耐热性和低吸湿性。
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公开(公告)号：US4902732A
公开(公告)日：1990-02-20
申请号：US928654
申请日：1986-11-05
摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.
摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。
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公开(公告)号：US06569532B2
公开(公告)日：2003-05-27
申请号：US09988752
申请日：2001-11-20
申请人： Kazutoshi Tomiyoshi , Kazuhiro Arai , Toshio Shiobara , Koki Oitori , Hironori Sakamoto , Yuji Kishigami , Koji Tsuchiya , Masato Kanari
发明人： Kazutoshi Tomiyoshi , Kazuhiro Arai , Toshio Shiobara , Koki Oitori , Hironori Sakamoto , Yuji Kishigami , Koji Tsuchiya , Masato Kanari
IPC分类号： B32B2738
CPC分类号： H01L23/295 , C08K3/36 , H01L23/08 , H01L24/48 , H01L2224/05599 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01067 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31511 , C08L63/00 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
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36.发明授权Semiconductor encapsulating epoxy resin compositions and semiconductor devices 失效半导体封装环氧树脂组合物和半导体器件
公开(公告)号：US5250637A
公开(公告)日：1993-10-05
申请号：US981209
申请日：1992-11-25
IPC分类号： C08L63/00 , C07D303/22 , C07F7/18 , C08G59/00 , C08G59/14 , C08G59/40 , C08K5/5419 , H01L23/29 , H01L23/31 , C08F283/10
CPC分类号： C07D303/22 , C07F7/182 , C07F7/1836 , C07F7/184 , C08G59/145 , C08G59/4085 , H01L23/293 , H01L2924/0002 , H01L2924/12044
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler is adapted for semiconductor encapsulation. A fluorinated organic silicon compound is blended in the composition as a coupling agent whereby the composition is improved in adhesion and moisture resistance.
摘要翻译： 包含环氧树脂，固化剂和无机填料的环氧树脂组合物适用于半导体封装。 氟化有机硅化合物作为偶联剂混合在组合物中，由此组合物的粘合性和耐湿性得到改善。
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37.发明授权Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith 失效包含环氧树脂组合物的萘环和其中包含的半导体器件
公开(公告)号：US5190995A
公开(公告)日：1993-03-02
申请号：US645498
申请日：1991-01-24
CPC分类号： H01L23/293 , C08G59/08 , C08G59/3218 , C08G59/621 , C08L63/04 , H01B3/40 , H01L2924/0002
摘要： Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.
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公开(公告)号：US5173544A
公开(公告)日：1992-12-22
申请号：US523814
申请日：1990-05-16
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.
摘要翻译： 包含环氧树脂，固化剂和包含长链有机聚硅氧烷共聚物[I]和短链有机聚硅氧烷共聚物[II]的共聚物混合物的环氧树脂组合物，其各自通过含链烯基的 公开了具有含有重量比[II]至[I]为0.3至0.6的侧基苯基的长链或短链有机聚硅氧烷的环氧树脂。 环氧树脂组合物表现出优异的可印刷性，抗龟裂性和成型性。
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39.发明授权
公开(公告)号：US4701479A
公开(公告)日：1987-10-20
申请号：US865390
申请日：1986-05-21
摘要： The inorganic filler in the inventive epoxy resin-based composition is a combination of two kinds of quartz powder of which one is a quartz powder having a spherical particle form and the other is a pulverized quartz powder in a specified proportion. The resin composition is highly flowable and capable of giving encapsulation of semiconductor devices with little fins having outstandingly small thermal expansion coefficient and highly resistant against crack formation.
摘要翻译： 本发明环氧树脂基组合物中的无机填料是两种石英粉末的组合，其中一种是具有球形颗粒形式的石英粉末，另一种是规定比例的粉碎石英粉末。 该树脂组合物是高度流动的并且能够使具有极小的热膨胀系数的小翅片的半导体器件封装，并且高度抗裂纹形成。
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40.发明授权公开(公告)号：US06518332B2
公开(公告)日：2003-02-11
申请号：US09841046
申请日：2001-04-25
IPC分类号： C08K310
CPC分类号： H01L23/293 , C08G59/3218 , C08K9/12 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L61/04 , H01L2924/00
摘要： Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
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