公开(公告)号：US20240347336A1

公开(公告)日：2024-10-17

申请号：US18135434

申请日：2023-04-17

申请人： Applied Materials, Inc.

发明人： Nitin Deepak ,  Ryan Sheil ,  Jennifer Y. Sun ,  Zhijun Jiang ,  Katherine Woo

IPC分类号： H01L21/02 ,  C23C16/08 ,  H01J37/32

CPC分类号： H01L21/02178 ,  C23C16/08 ,  H01J37/32091 ,  H01J37/321 ,  H01L21/0214 ,  H01L21/02186 ,  H01L21/02189 ,  H01L21/02192 ,  H01J2237/332

摘要： Exemplary processing methods may include providing a component for semiconductor processing to a processing region of a processing chamber. The methods may include providing one or more deposition precursors to the processing region. The one or more deposition precursors may include a metal-containing precursor and a fluorine-containing precursor. The methods may include depositing a layer of material on the component for semiconductor processing in the processing region. The layer of material comprises a metal-and-fluorine-containing material.

公开(公告)号：US20240339347A1

公开(公告)日：2024-10-10

申请号：US18747417

申请日：2024-06-18

申请人： Applied Materials, Inc.

发明人： Patricia Schulze ,  Gregory John Freeman ,  Michael Kutney ,  Arunkumar Ramachandraiah ,  Chih Chung Chou ,  Zhaozhao Zhu ,  Ozkan Celik

IPC分类号： H01L21/68 ,  G01B11/24 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/681 ,  G01B11/24 ,  H01L21/6831 ,  H01L21/68721 ,  G01B2210/56

摘要： An optical measurement device comprises a substrate holder to secure a substrate, a plurality of actuators to move the substrate holder relative to a plurality of axes, a first sensor to generate one or more first measurements or images of a first plurality of target positions on the substrate, and a second sensor to generate one or more second measurements of a second plurality of target positions on the substrate. The optical measurement device further comprises a plate, wherein the substrate holder, the plurality of actuators, the first sensor and the second sensor are each mounted to the plate, and wherein the plate provides vibration isolation from a factory interface to which the optical measurement device mounts. The optical measurement device further comprises a processing device that executes instructions to control the plurality of actuators and process the first measurements or images and the second measurements.

公开(公告)号：US12114083B2

公开(公告)日：2024-10-08

申请号：US18214417

申请日：2023-06-26

申请人： Applied Materials, Inc.

发明人： Upendra Ummethala ,  Philip Kraus ,  Keith Berding ,  Blake Erickson ,  Patrick Tae ,  Devendra Channappa Holeyannavar ,  Shivaraj Manjunath Nara ,  Anandakumar Parameshwarappa ,  Sivasankar Nagarajan ,  Dhirendra Kumar

IPC分类号： H04N23/90 ,  H01L21/67 ,  H04N23/50 ,  H04N23/56

CPC分类号： H04N23/90 ,  H01L21/67276 ,  H04N23/56 ,  H04N23/555

摘要： Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

公开(公告)号：US12112971B2

公开(公告)日：2024-10-08

申请号：US17200080

申请日：2021-03-12

申请人： Applied Materials, Inc.

发明人： Ian Bensco

IPC分类号： H01L21/687

CPC分类号： H01L21/68785 ,  H01L21/68735

摘要： Exemplary support assemblies may include a top puck characterized by a first surface and a second surface opposite the first surface. The top puck may define a recessed ledge at an outer edge of the first surface of the top puck. The assemblies may include a cooling plate coupled with the top puck adjacent the second surface of the top puck. The assemblies may include a back plate coupled with the top puck about an exterior of the top puck. The back plate may at least partially define a volume with the top puck. The cooling plate may be housed within the volume. The assemblies may include a heater disposed on the recessed ledge of the top puck. The assemblies may include an edge ring seated on the heater and extending about the top puck. The edge ring may be maintained free of contact with the top puck.

公开(公告)号：US12112969B2

公开(公告)日：2024-10-08

申请号：US17403756

申请日：2021-08-16

申请人： Applied Materials, Inc.

发明人： Joseph Yudovsky ,  Kaushal Gangakhedkar

IPC分类号： H01L21/683 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  H01L21/687

CPC分类号： H01L21/6838 ,  C23C16/45544 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  H01L21/68735

摘要： Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.

公开(公告)号：US12112890B2

公开(公告)日：2024-10-08

申请号：US17478047

申请日：2021-09-17

申请人： Applied Materials, Inc.

发明人： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC分类号： C23C14/35 ,  H01F7/18

CPC分类号： H01F7/18 ,  C23C14/358

摘要： Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：US12111572B2

公开(公告)日：2024-10-08

申请号：US18333290

申请日：2023-06-12

申请人： Applied Materials, Inc.

发明人： Hao Tang ,  Kang Luo ,  Erica Chen ,  Yongan Xu

IPC分类号： G03F7/00 ,  G02B5/18

CPC分类号： G03F7/0005 ,  G02B5/1857 ,  G03F7/0002

摘要： A method of imprinting a pattern on a substrate is provided. The method includes forming a first pattern on a plurality of masters using a method other than imprinting, the first pattern including a plurality of patterned features of varying sizes; measuring the patterned features at a plurality of locations on each of the masters; selecting a first master of the plurality of masters based on the measurements of the patterned features on each of the masters; using the first master to form a second pattern on an imprint template; and imprinting the first pattern on a first device with the imprint template.

公开(公告)号：US12111341B2

公开(公告)日：2024-10-08

申请号：US17960666

申请日：2022-10-05

申请人： Applied Materials, Inc.

发明人： Yue Guo ,  Yang Yang ,  Kartik Ramaswamy ,  Fernando Silveira ,  A N M Wasekul Azad

IPC分类号： G01R29/08

CPC分类号： G01R29/0885

摘要： Embodiments of the disclosure include an electric field measurement system that includes a first light source, a first light sensor configured to receive electromagnetic energy transmitted from the first light source, an electro-optic sensor, and a controller. The electro-optic sensor may include a package comprising a first electro-optic crystal disposed within a body; and at least one optical fiber. The optical fiber is configured to transmit electromagnetic energy transmitted from the first light source to a surface of the first electro-optic crystal, and transmit at least a portion of the electromagnetic energy transmitted to the surface of the first electro-optic crystal and subsequently passed through at least a portion of the first electro-optic crystal to the first light sensor that is configured to generate a signal based on an attribute of the electromagnetic energy received by the first light sensor from the at least one optical fiber. The controller is configured to generate a command signal based on a signal received from the first light sensor.

公开(公告)号：US20240334683A1

公开(公告)日：2024-10-03

申请号：US18613525

申请日：2024-03-22

申请人： Applied Materials, Inc.

发明人： Tong Liu ,  Sony Varghese ,  Zhijun Chen ,  Balasubramanian Pranatharthiharan ,  Anand N. Iyer

IPC分类号： H10B12/00

CPC分类号： H10B12/482 ,  H10B12/02

摘要： Memory devices and methods of manufacturing memory devices are described herein. The memory devices include a bitline metal stack on a surface comprising a matrix of conductive bitline contacts (e.g., polysilicon) and insulating dielectric islands (e.g., silicon nitride (SiN)). The bitline metal stack comprises one or more of titanium (Ti), tungsten (W), tungsten nitride (WN), tungsten silicide (WS), or tungsten silicon nitride (WSiN). The memory devices include a bitline metal layer (e.g., tungsten (W)) on a top surface of the insulating dielectric islands and on the bitline metal stack.

公开(公告)号：US20240332388A1

公开(公告)日：2024-10-03

申请号：US18609650

申请日：2024-03-19

申请人： Applied Materials, Inc.

发明人： Byeong Chan Lee ,  Benjamin Colombeau ,  Nicolas Breil ,  Ashish Pal ,  El Mehdi Bazizi ,  Veeraraghavan S. Basker ,  Balasubramanian Pranatharthiharan ,  Pratik B. Vyas ,  Gregory Costrini

IPC分类号： H01L29/423 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/08 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC分类号： H01L29/42392 ,  H01L21/823807 ,  H01L21/823871 ,  H01L27/092 ,  H01L29/0665 ,  H01L29/0847 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/78696

摘要： One or more embodiments of the disclosure are directed to methods of forming semiconductor devices, e.g., gate-all-around (GAA) transistors that are used in FEOL and/or BEOL processes. The processes described herein may be integrated and performed in any suitable cluster tool. Some embodiments of the disclosure are directed to cavity shaping processes. Further embodiments of the disclosure are directed to logic transistors with wrap-around backside source/drain contact.