公开(公告)号：US20230207151A1

公开(公告)日：2023-06-29

申请号：US17927350

申请日：2020-05-26

申请人： LG ELECTRONICS INC.

发明人： Soongil KIM ,  Hongjung KIM ,  Jongdeok KIM

IPC分类号： H01B1/22 ,  H01B13/00 ,  H01B5/14

CPC分类号： H01B1/22 ,  H01B5/14 ,  H01B13/0016

摘要： The present invention comprises the steps of: applying, on a substrate, a conductive paste including metal particles that are dispersed in an organic material and have a first particle diameter, and a magnetic heating element that has a second particle diameter; and selectively sintering the applied conductive paste by induction heating to form a conductive film, wherein the magnetic heating element may be contained in an amount of 10-50 wt% with respect to the metal particles. Therefore, a conductive adhesive layer can be selectively formed by performing the sintering through induction heating. In addition, by adding a small amount of the magnetic heating element to conductive metal powder having a low melting point, low-temperature bonding and electric conductivity can be simultaneously attained.

公开(公告)号：US20190185684A1

公开(公告)日：2019-06-20

申请号：US16284659

申请日：2019-02-25

申请人： Yazaki Corporation

发明人： Maki YAMADA ,  Rie Katsumata ,  Yukito Aoyama

IPC分类号： C09D5/24 ,  H05K1/09 ,  H01B1/22 ,  H05K3/12 ,  C09D7/40 ,  C09D7/62 ,  C09D7/20 ,  C09D101/02

CPC分类号： C09C1/62 ,  C09C3/08 ,  C09D5/24 ,  C09D7/40 ,  C09D201/00 ,  H01B1/00 ,  H01B1/22 ,  H05K1/09

摘要： An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 μm to 5 μm; an organic solvent; and a resin component consisting of a cellulose derivative. A conductor obtained by firing the electrically conductive paste has a film thickness of 30 μm or more and a specific resistance of 5.0×10−6 Ω·cm or less. In this way, the electrically conductive paste can reduce the resistance of the obtained conductor and to increase the amount of current flowing. A wiring board includes a conductor obtained from the electrically conductive paste.

公开(公告)号：US20180376593A1

公开(公告)日：2018-12-27

申请号：US16118212

申请日：2018-08-30

申请人： Korea Electronics Technology Institute

发明人： Yoonjin Kim ,  Jinwoo Cho ,  Kwonwoo Shin ,  Yonggon Seo ,  Yeonwon Kim ,  Sanghyeon Jang ,  Namje Jo

IPC分类号： H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  H05K3/12 ,  H05K3/02 ,  C09D11/037 ,  H01B1/20 ,  C09D11/52 ,  B22F9/24 ,  H01B1/22 ,  H05K3/22

CPC分类号： H05K1/095 ,  B22F1/0022 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/24 ,  B22F2301/10 ,  B22F2302/25 ,  C09D11/037 ,  C09D11/52 ,  H01B1/20 ,  H01B1/22 ,  H05K1/097 ,  H05K3/027 ,  H05K3/1216 ,  H05K3/227 ,  H05K2201/032

摘要： The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

公开(公告)号：US20180362548A1

公开(公告)日：2018-12-20

申请号：US15622172

申请日：2017-06-14

申请人： Eastman Kodak Company

发明人： Deepak Shukla ,  Kevin M. Donovan ,  Dianne Marie Meyer

IPC分类号： C07F1/10 ,  H01B1/22 ,  C08L1/28 ,  C08F220/06 ,  C23C18/42

CPC分类号： C23C18/42 ,  C08L1/284 ,  C23C18/06 ,  C23C18/08 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/2053 ,  C23C18/30 ,  H01B1/22

摘要： Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by: wherein L represents an α-oxy carboxylate; P represents a primary alkylamine compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.

公开(公告)号：US20180362547A1

公开(公告)日：2018-12-20

申请号：US15622145

申请日：2017-06-14

申请人： Eastman Kodak Company

发明人： Deepak Shukla ,  Kevin M. Donovan ,  Dianne Marie Meyer

IPC分类号： C07F1/10 ,  H01B1/22 ,  C08L1/28 ,  C08F220/06 ,  C23C18/42

CPC分类号： C23C18/42 ,  C08L1/284 ,  C23C18/06 ,  C23C18/08 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/2053 ,  C23C18/30 ,  H01B1/22

摘要： Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by: (Ag+)a(L)b(P)c   (I) wherein L represents an α-oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.

公开(公告)号：US20180358486A1

公开(公告)日：2018-12-13

申请号：US15920940

申请日：2018-03-14

申请人： GIGA SOLAR MATERIALS CORP.

发明人： PO-YANG SHIH ,  YU-SHUO YANG ,  PI-YU HSIN

IPC分类号： H01L31/0224 ,  H01B1/22 ,  H01L31/0216 ,  C09D5/24 ,  C09D101/28 ,  C09D7/61

CPC分类号： H01L31/022425 ,  C08K3/08 ,  C08K3/22 ,  C08K3/40 ,  C08K2003/0806 ,  C08K2003/2203 ,  C08K2003/2227 ,  C08K2201/001 ,  C09D5/006 ,  C09D5/24 ,  C09D7/61 ,  C09D101/28 ,  H01B1/22 ,  H01L31/02168

摘要： The present invention relates to a conductive paste, which imparts an electrode formed therefrom with enhanced adhesion strength to a semiconductor substrate by incorporation of LiAlO2 (lithium aluminate) therein. The present invention further relates to an electrode formed from the conductive paste and a semiconductor and in particular, a solar cell comprising the electrode produced therefrom.

公开(公告)号：US20180358145A1

公开(公告)日：2018-12-13

申请号：US15969144

申请日：2018-05-02

申请人： E I DU PONT DE NEMOURS AND COMPANY

发明人： Daniel Aneurin Inns ,  Jeffrey J. G. Dee

IPC分类号： H01B1/22 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H01B5/14

CPC分类号： H01B1/22 ,  H01B3/302 ,  H01B3/427 ,  H01B5/14 ,  H05K1/028 ,  H05K1/095 ,  H05K3/12 ,  H05K2201/0129 ,  H05K2201/0314 ,  H05K2201/0338

摘要： This invention is related to a thermoformed article containing a bendable region traversed by an electrical conductor, the electrical conductor comprising a substrate and a two-layer electrical conductor. The two-layer conductor comprises (a) a layer of polymer thick film silver conductor comprising a polymer selected from the group consisting of (i) a mixture of thermoplastic polyurethane and thermoplastic polyhydroxyether and (ii) a thermoplastic polyurethane having a percent elongation of at least 200% and a tensile stress necessary to achieve 100% elongation of less than 1000 pounds per square inch and (b) a layer of polymer thick film silver conductor comprising thermoplastic polyhydroxyether.

公开(公告)号：US20180355191A1

公开(公告)日：2018-12-13

申请号：US15780306

申请日：2015-12-03

申请人： HARIMA CHEMICALS, INC.

发明人： Masayuki UEDA

IPC分类号： C09D5/24 ,  B22F1/00 ,  B22F1/02 ,  B22F9/30 ,  B22F9/20 ,  C09D7/40 ,  C09D7/62 ,  H01B1/22 ,  H01B13/00

CPC分类号： C09D5/24 ,  B22F1/00 ,  B22F1/0022 ,  B22F1/02 ,  B22F9/20 ,  B22F9/30 ,  B22F2301/255 ,  B22F2304/054 ,  B82Y40/00 ,  C09D7/62 ,  C09D7/67 ,  H01B1/22 ,  H01B13/00 ,  H01B13/0036

摘要： Provided is an electro-conductive paste suitable to yield a sintered metal fine particulate layer having excellent adhesion to an ITO substrate. Powdery silver oxide is dispersed in a non-polar solvent. An excess amount of formic acid is added to allow the formic acid to react with the powdery silver oxide to thereby convert the powdery silver oxide into powdery silver formate (HCOOAg). A primary amine is allowed to react with the powdery silver formate to provide a primary amine addition salt of the silver formate, and the primary amine addition salt of the silver formate is subjected to a decompositional reduction reaction at a liquid temperature of around 70° C. to generate silver nanoparticles having a coating layer including the primary amine. To the resulting silver nanoparticle dispersion liquid, more than 0 parts by mass and 2.0 parts by mass or less of a titanium compound or manganese compound is added per 100 parts by mass of silver.

公开(公告)号：US20180346371A1

公开(公告)日：2018-12-06

申请号：US15780505

申请日：2016-12-09

申请人： SUN CHEMICAL CORPORATION

发明人： Jerome MOYER

IPC分类号： C03C8/18 ,  C03C8/02 ,  C03C4/14 ,  H01L31/0224 ,  H01B1/22 ,  H01L29/45

CPC分类号： C01B19/004 ,  C03C8/18 ,  H01B1/16 ,  H01B1/22

摘要： Described herein is a conductive composition that includes a silver powder, an organic medium, an optional inorganic additive, elemental thallium and/or a thallium containing compound, elemental tellurium and/or a tellurium containing compound, and optionally, a glass frit. The composition may be a paste. Other inorganic additives and glass may be present in the composition. Further described are devices such as semiconductors, photovoltaic devices, and solar cells in which the substrates thereof are coated with the conductive compositions. Such devices exhibit improved efficiency.

公开(公告)号：US20180327530A1

公开(公告)日：2018-11-15

申请号：US15774936

申请日：2016-11-21

申请人： TORAY INDUSTRIES, INC.

发明人： Junji WAKITA ,  Hiroji SHIMIZU ,  Shota KAWAI ,  Seiichiro MURASE

IPC分类号： C08F220/14 ,  H01L51/00 ,  C08F220/32 ,  C08G18/71 ,  C08G18/34 ,  C08F212/08 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L27/28 ,  H01L51/05 ,  G06K19/077

CPC分类号： C08F220/14 ,  C08F212/08 ,  C08F220/32 ,  C08F2220/1841 ,  C08F2220/325 ,  C08F2800/20 ,  C08G18/34 ,  C08G18/71 ,  G03F7/004 ,  G03F7/038 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  G06K19/07773 ,  H01B1/22 ,  H01B5/16 ,  H01L21/288 ,  H01L27/105 ,  H01L27/11507 ,  H01L27/1159 ,  H01L27/28 ,  H01L27/283 ,  H01L29/786 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/0048 ,  H01L51/05 ,  H01L51/0558

摘要： An object of the present invention is to provide a ferroelectric memory element which has a low driving voltage and which can be formed by coating. The present invention provides a ferroelectric memory element including at least: a first conductive film; a second conductive film; and a ferroelectric layer provided between the first conductive film and the second conductive film; wherein the ferroelectric layer contains ferroelectric particles and an organic component, and wherein the ferroelectric particles have an average particle size of from 30 to 500 nm.