公开(公告)号：US5119240A

公开(公告)日：1992-06-02

申请号：US564732

申请日：1990-08-08

Applicant: Francois Marion ,  Michel Ravetto ,  Jean-Luc Tissot

Inventor： Francois Marion ,  Michel Ravetto ,  Jean-Luc Tissot

IPC: F16B5/08 ,  B23P21/00 ,  F16B11/00 ,  G02B7/00 ,  G02B7/182 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  G02B7/00 ,  G02B7/182 ,  H05K3/3436 ,  H01L2224/81801 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K2201/094 ,  H05K2201/10484 ,  H05K2203/0465 ,  H05K3/3484 ,  Y02P70/613 ,  Y10T403/479

Abstract: An assembly of parts forming an angle between facing surfaces of the parts and a process for producing an assembly is described. The parts (2, 4) are provided with contact elements or pads (6, 8, 10, 12) for connection to one another by means of a relatively low melting point metallic soldering material. The surface of each of the pads is wettable by the low melting point metallic material in the molten state, while areas surrounding the pads are not wettable. The contact pads of one of the parts are covered with flat coils or wafers (10, 12) of the low melting point metallic material. The wafers have the same thickness, but different volumes. The contact pads of the other part are placed on the corresponding wafers. The wafers' thickness, volumes, and spacing are chosen so that when the wafers are heated to the molten state and form truncated spherical drops due to surface tension, the parts form between them a predetermined angle. The invention has particular application to the manufacture of mirrors.

Abstract translation: 描述了在部件的相对表面之间形成角度的部件的组件和用于制造组件的工艺。 部分（2,4）设置有用于通过相对低熔点的金属焊接材料彼此连接的接触元件或焊盘（6,8,10,12）。 每个焊盘的表面在熔融状态下被低熔点金属材料润湿，而焊盘周围的区域不能被润湿。 其中一个部分的接触垫被低熔点金属材料的扁平线圈或晶片（10,12）覆盖。 晶片具有相同的厚度，但是具有不同的体积。 另一部分的接触垫放置在相应的晶片上。 选择晶片的厚度，体积和间距，使得当晶片被加热到熔融状态并由于表面张力而形成截头球形液滴时，它们之间形成预定角度。 本发明特别适用于制造镜子。

公开(公告)号：US4387413A

公开(公告)日：1983-06-07

申请号：US220127

申请日：1980-12-24

Applicant: Patrick D. Griffis

Inventor： Patrick D. Griffis

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/40 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K3/301

Abstract: A semiconductor package is provided in which the semiconductor element is bonded to a slab of metal and is encapsulated in a body of insulating epoxy. Lead terminals are connected to the semiconductor element within the body and extend out from one end of the body. The metal slab extends out from the body from the same end as the lead terminals and in a plane which is parallel to that of the terminals, thereby forming a heat sink tab for the device. The package may be rigidly mounted on a printed circuit board by inserting the lead terminals and the heat sink tab into respective holes in a printed circuit board and soldering the terminals and tab to copper foil on the board. The solder connection of the heat sink tab to the copper foil provides an excellent thermal contact between the tab and the foil, in addition to providing a rigid support for the device.

Abstract translation: 提供一种半导体封装，其中半导体元件被结合到金属板上，并被封装在绝缘环氧树脂体中。 引线端子连接到体内的半导体元件并从主体的一端延伸出来。 金属板从主体从与引线端子相同的端部延伸出并且在与端子的平面平行的平面中延伸，从而形成用于该装置的散热片。 通过将引线端子和散热片插入印刷电路板的相应孔中并将端子和突片焊接到电路板上的铜箔上，将封装刚性地安装在印刷电路板上。 除了为器件提供刚性支撑之外，散热片与铜箔的焊接连接提供了突片和箔之间的极好的热接触。

公开(公告)号：US10080289B2

公开(公告)日：2018-09-18

申请号：US15491921

申请日：2017-04-19

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Jessica Aldrich ,  Paul Hogan

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/11 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10227 ,  H05K2201/10265 ,  H05K2201/10484 ,  Y02P70/611

Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

公开(公告)号：US20170150614A1

公开(公告)日：2017-05-25

申请号：US15424360

申请日：2017-02-03

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masayuki Sakai ,  Takahiro Yoneyama ,  Fumiyuki Yamatsuka

IPC: H05K3/34 ,  B23K1/00 ,  G03G15/00

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K2101/36 ,  B23K2101/42 ,  G03G15/5054 ,  G03G15/80 ,  G03G2215/0132 ,  G03G2215/0164 ,  G03G2215/16 ,  H05K1/181 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2203/0465 ,  Y02P70/613

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

公开(公告)号：US09599944B2

公开(公告)日：2017-03-21

申请号：US14259547

申请日：2014-04-23

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masayuki Sakai ,  Takahiro Yoneyama ,  Fumiyuki Yamatsuka

IPC: G03G15/00 ,  H05K13/00 ,  H05K3/34

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K2101/36 ,  B23K2101/42 ,  G03G15/5054 ,  G03G15/80 ,  G03G2215/0132 ,  G03G2215/0164 ,  G03G2215/16 ,  H05K1/181 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2203/0465 ,  Y02P70/613

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

公开(公告)号：US09402306B2

公开(公告)日：2016-07-26

申请号：US13574630

申请日：2011-01-31

Applicant: Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

Inventor： Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

IPC: H05K1/00 ,  H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件。 瓦片（1）包括具有电物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 所述瓦片在所述瓦片的连接部分（1c）中机械地和电耦合到所述载体。

公开(公告)号：US20130213694A1

公开(公告)日：2013-08-22

申请号：US13852233

申请日：2013-03-28

Applicant: Ibiden Co., Ltd.

Inventor： Michimasa TAKAHASHI

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

Abstract translation: 一种印刷电路板，包括刚性多层板，具有多个导体的第一基板和具有与第一基板的导体电连接的多个导体的第二基板。 第二基板的导体具有设定为高于第一基板的导体的现有密度的现有密度，并且第一基板和/或第二基板嵌入刚性多层板中。

公开(公告)号：US08116098B2

公开(公告)日：2012-02-14

申请号：US12269481

申请日：2008-11-12

Applicant: Michael Hortig ,  Peter Kunert

Inventor： Michael Hortig ,  Peter Kunert

IPC: H05K1/11

CPC classification number: G01P1/023 ,  G01C25/00 ,  H05K3/301 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2201/10484 ,  Y10T29/49117 ,  Y10T29/49826 ,  Y10T29/4998

Abstract: A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface.

Abstract translation: 具有第一表面和第二表面的基体元件，所述第一表面被设计成容纳模块壳体，并且所述第二表面设计成安装在载体元件上，此外，在第一和第二表面之间设置有0度到90度之间的角度， 第一表面的法线和第二表面的第二面法线。

公开(公告)号：US20110206415A1

公开(公告)日：2011-08-25

申请号：US13098574

申请日：2011-05-02

Applicant: Keiichi SATOU ,  Yasuo YOSHIDA

Inventor： Keiichi SATOU ,  Yasuo YOSHIDA

IPC: G03G15/04 ,  F21V23/06 ,  F21V21/002

CPC classification number: H01R33/09 ,  B41J2/473 ,  G02B26/123 ,  H01R12/7082 ,  H01R12/716 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10651

Abstract: A connection member that connects an electric substrate and a light source that emits a light beam, the connection member comprising: a light source terminal insertion portion into which a light source terminal of the light source is inserted from one end portion side and having another end portion side that penetrates the electric substrate.

Abstract translation: 一种连接电气基板和发射光束的光源的连接构件，所述连接构件包括：光源端子插入部，光源端子从一端部插入该端子侧并具有另一端 部分侧穿透电气基板。

公开(公告)号：US07972143B2

公开(公告)日：2011-07-05

申请号：US12364333

申请日：2009-02-02

Applicant: Dalibor Smejtek

Inventor： Dalibor Smejtek

IPC: H01R12/00

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10484

Abstract: A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

Abstract translation: 印刷电路组件包括具有印刷电路接收区域的基本印刷电路和设置在印刷电路接收区域上的多个电触点。 印刷电路组件还包括二次印刷电路，其具有包括配合边缘的辅助基板和沿着配合边缘设置的多个辅助触点。 二次印刷电路安装在基板印刷电路上，使得二次印刷电路的配合边缘与印刷电路接收区域的基本印刷电路直接接合。 每个次级触点电连接到基本印刷电路的相应的一个电触点。