Abstract:
The present invention claims that a carbon black with unique morphological properties provides improved carbon black dispersion and improved rubber compound properties, such as improved fatigue life and abrasion resistance. The carbon black of current invention has a ratio of aggregate size HI and particle size HI greater than 1.70, the surface area STSA of 100-180 M2/g and the structure OAN less than 140 cc/100 g.
Abstract:
A tyre includes at least one structural element obtained by crosslinking a crosslinkable elastomeric composition including: (a) a crosslinkable elastomeric base comprising at least 10 phr, preferably from 30 phr to 100 phr, of (a1) at least one epoxidized elastomeric polymer including less than 10 mol %, preferably from 0.1 mol % to 5 mol %, of epoxy groups relative to the total number of moles of monomers present in the elastomeric polymer; and (b) from 2 phr to 50 phr, preferably from 5 phr to 30 phr, of at least one layered material. Preferably, the at least one structural element is selected from bead filler, sidewall insert, tread underlayer, and tread base.
Abstract:
There are provided a rubber composition for coating a steel cord, containing 100 parts by mass of diene-based rubber; 0.5 to 5 parts by mass of a metal salt of an organic acid; and 30 to 100 parts by mass of a filler, wherein the filler contains 3 to 30 parts by mass of glass beads having a particle diameter of 10 to 100 μm, relative to 100 parts by mass of the diene-based rubber, and a tire reinforcement belt and a pneumatic tire using the rubber composition. The rubber composition reduces heat generation and improves adhesiveness with a steel cord. A pneumatic tire having a tire reinforcement belt using the rubber composition has excellent steering stability and rolling resistance.
Abstract:
The present invention provides a plain bearing having improved bearing properties, especially anti-seizure property, initial conformability and cavitation resistance. According to the present invention, a sliding layer is provided on a surface of a bearing alloy layer comprising of a copper-based or aluminum-based alloy, thereby the sliding layer is so structured that, to a polyamide-imide resin of a main constituent, a polyamide resin is added and mixed under a high shear force to form a polymer-alloyed resin binder, in which 1 to 75% by mass of a solid lubricant is dispersed. The sliding layer can have high toughness and strength, as well as improved anti-seizure property, initial conformability and cavitation resistance.
Abstract:
The present disclosure provides lubricious antimicrobial coating vehicles for medical devices capable of reducing the coefficient of friction of such devices upon exposure thereof to moisture and imparting antimicrobial properties to said devices. The coating vehicle allows the introduction of a pharmacological additive having a release rate that is within acceptable pharmacokinetic criteria.
Abstract:
Certain non-limiting embodiments of the present disclosure comprise a family of composite materials targeting specific applications through a materials design approach involving; 1) a hard particulate; 2) a carrier or binder phase; and 3) one or more additives for property enhancement and/or hardness adjustment. According to certain embodiments, the composite material may be one of flexible conformal sheet; a rigid machinable molded preform; and an extrudable putty. Methods of manufacture of the composite materials are also disclosed.
Abstract:
A polishing composition suitable for polishing semiconductor substrates comprises 0.001 to 2 wt % of a thermoplastic polymer; and 0.001 to 1 wt % of polyvinylpyrrolidone; wherein varying the weight ratio of thermoplastic polymer to the polyvinylpyrrolidone controls the removal rate of the non-ferrous interconnect.
Abstract:
The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.
Abstract:
A polishing sheet which can improve waviness at a face of a material to be polished and which has a long life is provided. The polishing pad 1 has a polyurethane sheet 2 made of polyurethane resin. The polyurethane sheet 2 has a polishing layer which is disposed inside a surface layer and which is allowed to wear away by polishing and whose thickness is larger than a thickness of the surface layer. The polishing layer has an approximately uniform foam structure in a direction of the thickness of the polishing sheet 2 by being formed foams whose space volume is larger than that of foams formed at the surface layer and which are communicated so as to form a network by continuous holes whose diameter is smaller than that of the space volume of the foams formed at the polishing layer.
Abstract:
The present invention relates to a friction material having a fibrous base material as a primary layer and a secondary layer comprising a mixture of carbonaceous material and friction modifying particles on at least one surface of the primary layer for use as an anti-shudder friction material.