公开(公告)号：US20240032201A1

公开(公告)日：2024-01-25

申请号：US18102285

申请日：2023-01-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Yong Gil Namgung ,  Jong Hoon Shin ,  Won Ju Jang ,  Yun Hwan Kim

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/05 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/185 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/0296 ,  H05K3/10 ,  H05K2203/013 ,  H05K2201/0206

Abstract: A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

公开(公告)号：US20240023248A1

公开(公告)日：2024-01-18

申请号：US18036628

申请日：2021-11-02

Applicant: KYOCERA Corporation

Inventor： Nobuyuki HASEGAWA ,  Fumiaki HARAGUCHI

IPC: H05K3/10 ,  H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K3/103 ,  H05K1/183 ,  H05K1/028 ,  H05K1/0306 ,  H05K3/381 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A wiring board includes a substrate including a first main surface, a second main surface, a side surface, and an inclined surface connecting the first main surface and the side surface, and side wiring on the first main surface, the inclined surface, and the side surface. The side wiring has a content of conductive particles greater than a content of an insulating component, and the wiring has a thickness equal to a thickness of at least one of the conductive particles in a first corner between the first main surface and the inclined surface and in a second corner between the inclined surface and the side surface.

公开(公告)号：US11871524B2

公开(公告)日：2024-01-09

申请号：US16328646

申请日：2017-08-21

Applicant: FUJIKURA LTD.

Inventor： Masahiro Okamoto

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/10 ,  H05K1/00 ,  H01L23/12 ,  H05K1/02 ,  H01L23/498

CPC classification number: H05K3/46 ,  H01L23/12 ,  H05K1/00 ,  H05K1/03 ,  H05K1/112 ,  H05K1/183 ,  H05K3/0008 ,  H05K3/103 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/0251

Abstract: A component-incorporated substrate of multi-layer structure includes: a plurality of printed wiring base members that are batch-laminated via an adhesive layer, with the plurality of printed wiring base members including a resin base member that includes a wiring pattern on at least one surface thereof and a via connected to the wiring pattern; an opening disposed in at least one printed wiring base member that is sandwiched on both sides by other printed wiring base members of the plurality of printed wiring base members; and an electronic component disposed in the opening. At least part of the wiring pattern of the printed wiring base member where the opening is formed is disposed in a frame shape surrounding the opening, in a periphery of the opening.

公开(公告)号：US11871510B2

公开(公告)日：2024-01-09

申请号：US17050848

申请日：2020-09-14

Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.

Inventor： Hou-Yuan Chou ,  Yi-Chih Wu ,  Feng-Hua Deng ,  Ming-Fang Chen

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0251 ,  H05K3/10 ,  H05K2201/09236

Abstract: A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.

公开(公告)号：US20230413453A1

公开(公告)日：2023-12-21

申请号：US18459624

申请日：2023-09-01

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Kang Dong KIM ,  Chang Hoon HAN ,  Chul Ho YOON ,  Ho Byung KIM ,  Hyun Woo KIM ,  Gun Woo SHIN

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/103 ,  H05K3/3405 ,  H05K1/181 ,  H05K2203/0502 ,  H05K2201/08

Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

公开(公告)号：US20230413429A1

公开(公告)日：2023-12-21

申请号：US18325149

申请日：2023-05-30

Applicant: IBIDEN CO., LTD.

Inventor： Atsushi DEGUCHI

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K3/108 ,  H05K2203/0723 ,  H05K2203/072 ,  H05K2201/0379

Abstract: A wiring substrate includes a resin insulating layer, and a conductor layer formed on the resin insulating layer and including a seed layer and a metal film formed on the seed layer such that the conductor layer has wiring patterns including wirings. The conductor layer is formed such that each of the wirings in the wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the wirings in the conductor layer include outer wirings formed such that each of the outer wirings has the undercut part on the side surface facing an adjacent one of the wirings is smaller than the undercut part on the side surface farther from the adjacent one of the wirings.

公开(公告)号：US20230398793A1

公开(公告)日：2023-12-14

申请号：US18250074

申请日：2021-10-15

Applicant: INSTITUT POLYTECHNIQUE DE GRENOBLE ,  UNIVERSITE GRENOBLE ALPES ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： Philippe MARIN ,  Gioia FURIA ,  Didier CHAUSSY ,  Davide BENEVENTI

IPC: B41J3/407 ,  B05B13/04 ,  B25J11/00 ,  H05K3/10

CPC classification number: B41J3/4073 ,  B05B13/0431 ,  B25J11/0075 ,  H05K3/102

Abstract: A method for printing at least one conductive track on the surface of an object, using at least one arm robot and at least one conductive ink print head. The object being arranged in a working area of the robot including taking a 3D scan of the object using a scanner mounted on the arm of the robot which controls the movement relative to the object. A digital model of the scanned portion of the surface of the object is constructed. A conductive track 10 is drawn digitally on the previously constructed digital model. Depending on the drawing of the conductive track, a path for the print head is generated. The conductive track is printed using the print head mounted on the arm of the robot which controls the movement relative to the object, by following the previously generated path.

公开(公告)号：US20230369751A1

公开(公告)日：2023-11-16

申请号：US18200712

申请日：2023-05-23

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Koichi SUZUKI ,  Seiji TAKE ,  Daisuke MATSUURA

IPC: H01Q1/36 ,  H05K1/02 ,  H05K3/10 ,  H05K3/18

CPC classification number: H01Q1/36 ,  H05K1/0274 ,  H05K3/108 ,  H05K3/18 ,  H05K2201/10098 ,  H05K2203/0723

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

公开(公告)号：US20230343675A1

公开(公告)日：2023-10-26

申请号：US18343885

申请日：2023-06-29

Applicant: Solaredge Technologies Ltd.

Inventor： Tomer Kugman

IPC: H01L23/40 ,  H05K7/20 ,  H05K3/10

CPC classification number: H01L23/4006 ,  H05K7/209 ,  H05K3/107 ,  H01L2023/4062 ,  H01L2023/4087

Abstract: Systems, apparatuses, and methods are described for clamping a heat generating device such as a thyristor in place. The use of spring washers in various configurations is described. A spring washing washer may be used to apply force to a pad which in turn applies the force to a plate above a heat generating device. The plate above the heat generating device may apply downward pressure, which may force the heat generating device against a lower surface. Related systems, apparatuses, and methods are also described.

公开(公告)号：US20230340226A1

公开(公告)日：2023-10-26

申请号：US17800610

申请日：2021-02-16

Applicant: SHPP GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Yun ZHENG

IPC: C08K3/22 ,  C08K7/28 ,  H05K3/18 ,  H05K3/10 ,  H05K1/16

CPC classification number: C08K3/22 ,  C08K7/28 ,  H05K3/182 ,  H05K3/105 ,  H05K1/165 ,  C08K2003/2231 ,  C08K3/2279 ,  H05K2203/107 ,  H05K2201/10098 ,  H05K2203/1136 ,  H05K2201/0129

Abstract: Disclosed is a composition comprising: from about 10 wt. % to about 90 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide resin; from about 0.01 to 10 wt. % of a laser direct structuring additive; from about 0.01 wt. % to about 50 wt. % of laser breakable filler, wherein the composition exhibits a dissipation factor of less than 0.01 at frequencies of 1 GHz to 20 GHz frequencies when measured using a dielectric resonator, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.