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公开(公告)号:US20190080754A1
公开(公告)日:2019-03-14
申请号:US16119416
申请日:2018-08-31
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Stanley Hong , Feng Zhou , Xian Liu , Nhan Do
Abstract: Numerous embodiments of methods for writing to a resistive random access memory (RRAM) cell are disclosed. In one embodiment, the system verifies if a current through the RRAM cell exceeds a threshold value, and if it does not, the system executes a concurrent write-while-verify operation. In another embodiment, the system verifies if current through the RRAM cell has reached a target value, and if it has not, the system executes a write operation and then verifies the write operation using a current comparison.
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公开(公告)号:US20190066805A1
公开(公告)日:2019-02-28
申请号:US15687092
申请日:2017-08-25
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Stanley Hong
Abstract: Numerous embodiments for an improved sense amplifier circuit for reading data in a flash memory cell are disclosed. The embodiments each compare current or voltage measurements from a data block with a reference block to determine the value stored in the selected memory cell in the data block. The use of one or more localized boost circuits allow the embodiments to utilize lower operating voltages than prior art sense amplifier circuits, resulting in reduced power consumption.
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公开(公告)号:US10186322B2
公开(公告)日:2019-01-22
申请号:US15361473
申请日:2016-11-27
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Hung Quoc Nguyen
IPC: G11C16/30 , G11C16/14 , G11C16/04 , G11C16/08 , G11C5/14 , G11C8/08 , G11C16/10 , G11C16/16 , G11C16/26 , H01L27/11521
Abstract: A non-volatile memory device comprises a semiconductor substrate of a first conductivity type. An array of non-volatile memory cells is located in the semiconductor substrate and arranged in a plurality of rows and columns. Each memory cell comprises a first region on a surface of the semiconductor substrate of a second conductivity type, and a second region on the surface of the semiconductor substrate of the second conductivity type. A channel region is between the first region and the second region. A word line overlies a first portion of the channel region and is insulated therefrom, and adjacent to the first region and having little or no overlap with the first region. A floating gate overlies a second portion of the channel region, is adjacent to the first portion, and is insulated therefrom and is adjacent to the second region. A coupling gate overlies the floating gate. A bit line is connected to the first region. During the operations of program, read, or erase, a negative voltage can be applied to the word lines and/or coupling gates of the selected or unselected memory cells.
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公开(公告)号:US20180286836A1
公开(公告)日:2018-10-04
申请号:US15921563
申请日:2018-03-14
Applicant: Silicon Storage Technology, Inc.
Inventor: Justin Hiroki Sato , Bomy Chen , Walter Lundy
IPC: H01L25/065 , H01L25/00 , H01L23/00
CPC classification number: H01L25/0657 , H01L24/05 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/0217 , H01L2224/0219 , H01L2224/04042 , H01L2224/05091 , H01L2224/05124 , H01L2224/05624 , H01L2224/16502 , H01L2224/48091 , H01L2224/81143 , H01L2224/81805 , H01L2225/06513 , H01L2225/06555 , H01L2225/06593 , H01L2924/00014 , H01L2924/01029 , H01L2924/0105 , H01L2924/07025 , H01L2224/45099
Abstract: A method of bonding a first substrate to a second substrate, wherein the first substrate includes first electrical contacts on a top surface of the first substrate, and wherein the second substrate includes second electrical contacts on a bottom surface of the second substrate. The method includes forming a block of polyimide on the top surface of the first substrate, wherein the block of polyimide has a rounded upper corner, and vertically moving the top surface of the first substrate and the bottom surface of the second substrate toward each other until the first electrical contacts abut the second electrical contacts, wherein during the moving, the second substrate makes contact with the rounded upper corner of the polyimide causing the first and second substrates to move laterally relative to each other.
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公开(公告)号:US10079061B2
公开(公告)日:2018-09-18
申请号:US15084955
申请日:2016-03-30
Applicant: Silicon Storage Technology, Inc.
Inventor: Xiaozhou Qian , Viktor Markov , Jong-Won Yoo , Xiao Yan Pi , Alexander Kotov
CPC classification number: G11C16/12 , G11C16/0425 , G11C16/10
Abstract: The disclosed embodiments comprise a flash memory device and a method of programming the device in a way that reduces degradation of the device compared to prior art methods.
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446.
公开(公告)号:US20180233203A1
公开(公告)日:2018-08-16
申请号:US15952155
申请日:2018-04-12
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Hung Quoc Nguyen
CPC classification number: G11C16/14 , G11C7/065 , G11C8/08 , G11C16/08 , G11C16/10 , G11C16/26 , G11C16/28 , G11C2216/04 , H01L27/112 , H01L27/11582 , H01L28/00
Abstract: The present invention relates to a flash memory system comprising one or more sense amplifiers for reading data stored in flash memory cells. The sense amplifiers utilize fully depleted silicon-on-insulator transistors to minimize leakage. The fully depleted silicon-on-insulator transistors comprise one or more fully depleted silicon-on-insulator NMOS transistors and/or one or more fully depleted silicon-on-insulator PMOS transistors.
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公开(公告)号:US20180226421A1
公开(公告)日:2018-08-09
申请号:US15945659
申请日:2018-04-04
Applicant: Silicon Storage Technology, Inc.
Inventor: Chunming Wang , Nhan Do
IPC: H01L27/11521 , G11C16/04 , H01L29/423 , G11C16/10 , G11C16/16
CPC classification number: H01L27/11521 , G11C16/0433 , G11C16/10 , G11C16/16 , H01L21/28273 , H01L27/11524 , H01L29/42328
Abstract: A memory device that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a continuous channel region in the substrate extending between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region adjacent to the first region. A second floating gate is disposed over and insulated from a second portion of the channel region adjacent to the second region. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. A first erase gate disposed over and insulated from the first region. A second erase gate disposed is over and insulated from the second region.
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448.
公开(公告)号:US09972395B2
公开(公告)日:2018-05-15
申请号:US14875533
申请日:2015-10-05
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Hung Quoc Nguyen
IPC: G11C16/04 , G11C16/14 , G11C16/08 , G11C16/26 , G11C7/06 , G11C8/08 , G11C16/10 , G11C16/28 , H01L27/112
CPC classification number: G11C16/14 , G11C7/065 , G11C8/08 , G11C16/08 , G11C16/10 , G11C16/26 , G11C16/28 , G11C2216/04 , H01L27/112 , H01L27/11582 , H01L28/00
Abstract: The present invention relates to a flash memory system wherein one or more circuit blocks utilize fully depleted silicon-on-insulator transistor design to minimize leakage.
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公开(公告)号:US09953719B2
公开(公告)日:2018-04-24
申请号:US15158460
申请日:2016-05-18
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu
CPC classification number: G11C16/3431 , G11C16/0425 , G11C16/08 , G11C16/10 , G11C16/16 , G11C16/28
Abstract: The present invention relates to a flash memory cell with only four terminals and decoder circuitry for operating an array of such flash memory cells. The invention allows for fewer terminals for each flash memory cell compared to the prior art, which results in a simplification of the decoder circuitry and overall die space required per flash memory cells. The invention also provides for the use of high voltages on one or more of the four terminals to allow for read, erase, and programming operations despite the lower number of terminals compared to prior art flash memory cells.
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450.
公开(公告)号:US20180053560A1
公开(公告)日:2018-02-22
申请号:US15479235
申请日:2017-04-04
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Vipin Tiwari , Nhan Do
CPC classification number: G11C16/08 , G11C16/0425 , G11C16/10 , G11C16/14 , G11C16/24 , G11C16/26 , G11C16/28 , G11C16/32 , G11C16/3418 , G11C16/3427 , G11C2216/04 , G11C2216/22
Abstract: In one embodiment of the present invention, one row is selected and two columns are selected for a read or programming operation, such that twice as many flash memory cells can be read from or programmed in a single operation compared to the prior art. In another embodiment of the present invention, two rows in different sectors are selected and one column is selected for a read operation, such that twice as many flash memory cells can be read in a single operation compared to the prior art.
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