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    NOVEL HETEROCYCLIC AROMATIC COMPOUND AND POLYMER
    41.
    发明申请
    NOVEL HETEROCYCLIC AROMATIC COMPOUND AND POLYMER 审中-公开
    新型杂环芳族化合物和聚合物

    公开(公告)号：US20130225776A1

    公开(公告)日：2013-08-29

    申请号：US13860641

    申请日：2013-04-11

    Applicant: Nagase Chemtex Corporation

    Inventor： Yasuyuki KITA ,  Toshifumi DOHI ,  Koji MORIMOTO ,  Yoshiyuki MORITA ,  Tetsuya HOSOMI ,  Setsuko ISHIOKA

    IPC: C08F28/06

    CPC classification number: C08F28/06 ,  C07D495/04 ,  C08G61/123 ,  C08L65/00 ,  C09D5/24 ,  C09D201/00 ,  H01B1/127 ,  Y02P20/582

    Abstract: An electrically conductive polymer obtained by oxidative polymerization of a heterocycle-containing aromatic compound as a monomer, wherein the heterocycle-containing aromatic compound is represented by the formula: A-B. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant.

    Abstract translation: 通过含杂环芳香族化合物作为单体进行氧化聚合得到的导电性聚合物，其中所述含杂环芳香族化合物由下式表示：A-B。 在上式中，A表示取代或未取代的噻吩环基或取代或未取代的吡咯环基; B表示取代或未取代的烃芳族环基团，取代或未取代的噻吩环基团，或取代或未取代的吡咯环基团; 由A表示的环和由B表示的环直接连接; 然而，A和B表示彼此不同的结构。 该化合物可以通过使用高价碘反应物的偶联反应来制备。

    METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET
    43.
    发明公开
    METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET 审中-公开

    公开(公告)号：US20240071781A1

    公开(公告)日：2024-02-29

    申请号：US18263552

    申请日：2022-01-27

    Applicant: Nagase Chemtex Corporation

    Inventor： Yosuke OI ,  Masahiro ASAHARA ,  Daisuke MORI

    IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

    CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121

    Abstract: A method for sealing an electronic component mounting substrate including: preparing an electronic component mounting substrate including a substrate and electronic components mounted thereon and having a space between an electronic component and the substrate; placing a thermosetting sheet on the electronic component mounting substrate; and heat-molding the placed thermosetting sheet, to allow a melt of the thermosetting sheet to fill the space between the electronic component and the substrate and be cured. When a distance between the center of the substrate and an optional point P on a frame line that surrounds all the electronic components and minimizes the surrounded area is denoted by Lp, a distance Lq between the center of the substrate and a point Q at which a straight line passing through the point P and the center of the substrate intersects with an outer periphery of the thermosetting sheet is 0.9Lp or more.

    AMYLASE COMPOSITION
    48.
    发明申请
    AMYLASE COMPOSITION 有权

    公开(公告)号：US20220170002A1

    公开(公告)日：2022-06-02

    申请号：US17436945

    申请日：2020-03-11

    Applicant: NAGASE CHEMTEX CORPORATION

    Inventor： Manabu IIJIMA

    IPC: C12N9/26 ,  A23L29/00 ,  A23L29/30

    Abstract: The present invention provides an amylase composition which enables long-term stable storage of amylase without using chemicals that may affect the human body in food use. The present invention relates to an amylase composition containing a saccharide containing glucose as a constituent unit, a polyhydric alcohol, and an amylase.

    Manufacturing method of mounting structure
    49.
    发明授权
    Manufacturing method of mounting structure 有权

    公开(公告)号：US11315804B2

    公开(公告)日：2022-04-26

    申请号：US16772608

    申请日：2018-12-13

    Applicant: NAGASE CHEMTEX CORPORATION

    Inventor： Eiichi Nomura ,  Yutaka Miyamoto ,  Takayuki Hashimoto

    IPC: H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/14 ,  H05K3/46

    Abstract: A manufacturing method of a mounting structure, the method including a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a first cured layer; a removal step of removing the thermoplastic sheet from the first cured layer; and a coating film formation step of forming a coating film on the first cured layer, after the removal step. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

    PHOTOCURABLE RESIN COMPOSITION AND RESIN CURED PRODUCT
    50.
    发明申请
    PHOTOCURABLE RESIN COMPOSITION AND RESIN CURED PRODUCT 有权

    公开(公告)号：US20220002447A1

    公开(公告)日：2022-01-06

    申请号：US17291939

    申请日：2019-11-01

    Applicant: NAGASE CHEMTEX CORPORATION

    Inventor： Koji WATANABE ,  Yoshiyuki YAMAGUCHI ,  Hiroaki OZOE

    IPC: C08F2/48 ,  C08F299/06

    Abstract: A photocurable resin composition includes: a first reactive compound that forms a glass phase through curing; a second reactive compound that is compatible with the first reactive compound and forms a rubber phase through curing; and a photopolymerization initiator. The first reactive compound includes at least a reactive monomer, and the second reactive compound includes at least a reactive oligomer. A polar term dP1 of Hansen Solubility Parameter of the first reactive compound and a polar term dP2 of Hansen Solubility Parameter of the second reactive compound differ by 1.8 or more.

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