摘要:
The present invention relates to a method of fabricating planar semiconductor wafers. The method comprises forming a dielectric layer on a semiconductor wafer surface, the semiconductor wafer surface having vias, trenches and planar regions. A barrier and seed metal layer is then formed on the dielectric layer. The wafer is next place in a plating bath that includes an accelerator, which tends to collect in the vias and trenches to accelerate the rate of plating in these areas relative to the planar regions of the wafer. After the gapfill point is reached, the plating is stopped by removing the plating bias on wafer. An equilibrium period is then introduced into the process, allowing higher concentrations of accelerator additives and other components of the bath)] above the via and trench regions to equilibrate in the plating bath. The bulk plating on the wafer is resumed after equilibration. Over-plating on the wafer in the areas of the vias and trenches is therefore avoided, resulting in a more planar metallization layer on the wafer, without the use of a leveler additive which adversely affects the gapfill capability.
摘要:
A copper interconnect with a Sn coating is formed in a damascene structure by forming a trench in a dielectric layer. The trench is formed by electroplating copper simultaneously with a metal dopant to form a doped copper layer. The top level of the doped copper layer is reduced to form a planarized surface level with the surface of the first dielectric layer. The doped copper is annealed to drive the metal dopants to form a metal dopant capping coating at the planarized top surface of the doped copper layer.
摘要:
Disclosed is a method for preparing serinol (2-amino-1,3-proanediol). From nitromethane, para-formaldehyde and sodium hydroxide, 1-nitro-1,3-propanediol sodium salt is prepared as a medical intermediate. In a fixed bed, this intermediate is allowed to undergo the continuous hydrogenation of 2-nitro-1,3-propanediol sodium salt and methanol as shown in reaction (1). In addition to being simple, the method is economically favorable and affords the high yield and high purity of serinol.
摘要:
Disclosed is a method for preparing DL-&agr;-tocopherol through the condensation of isophytol or phytol derivatives and trimethylhydroquinone (TMHQ) using a catalyst system comprising a divalent metal halogen compound, silica gel and/or silica-alumina, and a Brönsted acid. Isophytol or phytol derivatives are slowly added to trimethylhydroquinone for the condensation thereof at 80 to 135° C. over 30 to 60 min in the presence of the metal halogen and the silica gel and/or silica-alumina. In the presence of the Brönsted acid, the intermediates are converted into the product. The silica gel and/or silica-alumina is washed with a polar solvent for recovery. The catalyst system can remarkably reduce side-reactions upon the condensation of isophytol or phytol derivatives and TMHQ, thus producing DL-&agr;-tocopherol with a high purity at a high yield. Also, the catalyst system can be regenerated in succession because of its being able to avoid the decrease of catalytic activity attributed to the adsorption of organic materials; thus reducing the production cost of DL-&agr;-tocopherol and the quantity of industrial wastes generated. With these advantages, the catalyst system can be effectively used in preparing highly pure DL-&agr;-tocopherol at a high yield on a commercial scale.
摘要:
Disclosed is an adhesive resin composition for bonding semiconductor chips comprising an epoxy resin component, a curing agent, a diluent, a curing promoter, a thixotropic agent, and an inorganic filler component. The resin component is approximately 10-50% by weight, and the inorganic filler component is approximately 50-90% by weight and comprises a copper ingredient and a silver ingredient. The copper ingredient is selected from the group consisting of CuO, Cu2O, with the mixtures thereof being approximately 0.1-50% by weight based on the total weight of said inorganic filler component. The silver ingredient is approximately 50-99.0% by weight based on the total weight of the inorganic filler ingredient.
摘要:
Thin-film battery methods for complexity reduction are described. Processing equipment arrangements suitable to support thin-film battery methods for complexity reduction are also described. Cluster tools to support thin-film battery methods for complexity reduction are also described.
摘要:
Thin-film battery methods for complexity reduction are described. Processing equipment arrangements suitable to support thin-film battery methods for complexity reduction are also described. Cluster tools to support thin-film battery methods for complexity reduction are also described.
摘要:
A method of fabricating a layer of a thin film battery comprises providing a sputtering target and depositing the layer on a substrate using a physical vapor deposition process enhanced by a combination of plasma processes. The deposition process may include: (1) generation of a plasma between the target and the substrate; (2) sputtering the target; (3) supplying microwave energy to the plasma; and (4) applying radio frequency power to the substrate. A sputtering target for a thin film battery cathode layer has an average composition of LiMaNbZc, wherein 0.20>{b/(a+b)}>0 and the ratio of a to c is approximately equal to the stoichiometric ratio of a desired crystalline structure of the cathode layer, N is an alkaline earth element, M is selected from the group consisting of Co, Mn, Al, Ni and V, and Z is selected from the group consisting of (PO4), O, F and N.
摘要:
Concepts and methods are provided to reduce the cost and complexity of thin film battery (TFB) high volume manufacturing by eliminating and/or minimizing the use of conventional physical (shadow) masks. Laser scribing and other alternative physical maskless patterning techniques meet certain or all of the patterning requirements. In one embodiment, a method of manufacturing thin film batteries comprises providing a substrate, depositing layers corresponding to a thin film battery structure on the substrate, the layers including, in order of deposition, a cathode, an electrolyte and an anode, wherein at least one of the deposited layers is unpatterned by a physical mask during deposition, depositing a protective coating, and scribing the layers and the protective coating. Further, the edges of the layers may be covered by an encapsulation layer. Furthermore, the layers may be deposited on two substrates and then laminated to form the thin film battery.
摘要:
The present invention relates to a nickel-based catalyst using hydrotalcite-like precursor and a steam reforming reaction by using the catalyst, and particularly to a nickel-based catalyst prepared by dispersing nickel uniformly onto the inner part and the surface of the support through a substitution between the magnesium and the active nickel metal and optimizing the molar ratios of nickel, magnesium and aluminum in order to utilize nickel as an active metal and a hydrotalcite-like precursor consisting of aluminum and magnesium, which shows an increased specific surface area of the catalyst and surface area of the active nickel, and thus enables the production of hydrogen-rich gas in high yield during the steam reforming reaction of LPG with superior maintenance of catalytic activity for a long period of time due to the inhibition of carbon deposition.