公开(公告)号：US20050212405A1

公开(公告)日：2005-09-29

申请号：US10811598

申请日：2004-03-29

申请人： Gerald Negley

发明人： Gerald Negley

IPC分类号： H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor light emitting devices include a substrate having a face, a flexible film that includes therein an optical element, on the face, and a semiconductor light emitting element between the substrate and the flexible film and configured to emit light through the optical element. The face can include a cavity therein, and the semiconductor light emitting element may be in the cavity. The flexible film extends onto the face beyond the cavity, and the optical element overlies the cavity.

摘要翻译： 半导体发光器件包括具有面的衬底，在其上包括光学元件的柔性膜，以及在衬底和柔性膜之间的半导体发光元件，并且被配置为通过光学元件发光。 该面可以包括其中的腔，并且半导体发光元件可以在空腔中。 柔性膜延伸到超过腔的表面上，并且光学元件覆盖在空腔上。

公开(公告)号：US09273830B2

公开(公告)日：2016-03-01

申请号：US12475261

申请日：2009-05-29

申请人： Gerald Negley ,  Bernd Keller

发明人： Gerald Negley ,  Bernd Keller

IPC分类号： H01L29/18 ,  F21K99/00 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

CPC分类号： F21K9/00 ,  F21K9/69 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) component comprising a submount with an array of LED chips and a lens over the array of LED chips. A diffuser is arranged so that at least some light from the LEDs passes through the diffuser to mix the LED light in the near field. The light passing through the diffuser appears as a mixture of LED chip light when directly viewed. A lighting device is also disclosed comprising an LED component comprising an array of LED chips and a near field diffuser to mix at least some of the light from the LED chips in the near field. A remote reflector is included to reflect at least some the light from the LED component so that is emits from the lighting device in the desired direction.

摘要翻译： 一种发光二极管（LED）组件，包括具有LED芯片阵列的底座和LED芯片阵列上的透镜。 扩散器被布置成使得来自LED的至少一些光通过漫射器以混合近场中的LED光。 当直接观察时，通过扩散器的光作为LED芯片的混合物出现。 还公开了一种照明装置，其包括LED组件，该LED组件包括LED芯片阵列和近场扩散器，用于混合来自近场中的LED芯片的至少一些光。 包括远程反射器以反射来自LED部件的至少一些光，从而在所需方向上从照明装置发射。

公开(公告)号：US08217412B2

公开(公告)日：2012-07-10

申请号：US12883979

申请日：2010-09-16

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20110148327A1

公开(公告)日：2011-06-23

申请号：US12643705

申请日：2009-12-21

申请人： Antony P. Van de Ven ,  Gerald Negley

发明人： Antony P. Van de Ven ,  Gerald Negley

IPC分类号： H05B37/00

CPC分类号： H05B33/0863 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： Solid state luminaires and light engines comprising a first group of solid state emitters comprising a first emitter emitting above the black body locus (BBL) in a CIE diagram, and a second emitter emitting below the BBL. The combination of light from the first and second emitters generates an emission color point within a standard deviation of the BBL. A second group of solid state emitters is included, the combination of light from the first and second groups of emitters causes emission within a standard deviation of the black body locus (BBL), wherein varying the intensity of the second group of emitters causes emission from the first and second groups of emitters to vary within a range of color temperatures while still emitting within the standard deviation of the BBL.

摘要翻译： 包括第一组固态发射器的固态照明器和光引擎，包括在CIE图中的黑色本体轨迹（BBL）上方发射的第一发射体，以及在BBL下方发射的第二发光体。 来自第一和第二发射体的光的组合在BBL的标准偏差内产生发射色点。 包括第二组固态发射体，来自第一和第二组发射体的光的组合导致在黑体轨迹（BBL）的标准偏差内的发射，其中改变第二组发射体的强度导致发射 第一组和第二组发射器在色温范围内变化，同时仍然在BBL的标准偏差内发射。

公开(公告)号：US20100127283A1

公开(公告)日：2010-05-27

申请号：US12629735

申请日：2009-12-02

申请人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Ted Lowes

发明人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Ted Lowes

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.

摘要翻译： 公开了具有多个分立光源的固态照明组件，其光组合以提供期望的发射特性。 根据本发明的LED部件的一个实施例包括矩形基座。 第一组蓝移LED（BSY）LED芯片，第二组BSY LED芯片和一组红色LED芯片安装在底座上。 多个触点沿着副安装座的边缘之一布置，并且可从组件的一侧接近以将电信号施加到LED芯片组。

公开(公告)号：US20070290218A1

公开(公告)日：2007-12-20

申请号：US11849530

申请日：2007-09-04

申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

公开(公告)号：US20070241360A1

公开(公告)日：2007-10-18

申请号：US11772419

申请日：2007-07-02

申请人： David Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter Andrews ,  Gerald Negley

发明人： David Slater, Jr. ,  Jayesh Bharathan ,  John Edmond ,  Mark Raffetto ,  Anwar Mohammed ,  Peter Andrews ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/38 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.

摘要翻译： 通过在电极和底座中的至少一个上形成预定图案的导电芯片附着材料，并将其安装在基板上，并将底板上的电极和底板上的电极的底板配置在倒装芯片结构的底座上， 发光器件死到底座。 选择导电芯片附着材料的预定图案，以便当发光器件裸片安装到底座时，防止导电芯片附着材料接触具有相反导电类型的区域。 导电芯片附接材料的预定图案可以提供小于由电极区域限定的体积以及电极和底座之间的距离的管芯附着材料的体积。 还提供具有预定图案的导电芯片附着材料的发光器件裸片。 在碳化硅基板等基板上具有氮化镓系发光区域的发光元件也可以通过将氮化镓系发光区域的电极安装在利用B的基板的倒装芯片配置中 级环氧树脂。 还提供了具有B级可固化模具环氧树脂的发光器件模具。

公开(公告)号：US20070224716A1

公开(公告)日：2007-09-27

申请号：US11799702

申请日：2007-05-01

申请人： Gerald Negley ,  Michael Leung

发明人： Gerald Negley ,  Michael Leung

IPC分类号： H01L29/22 ,  H01L21/00

CPC分类号： H01L33/501 ,  H01L2933/0041

摘要： Semiconductor light emitting devices are fabricated by placing a suspension including phosphor particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element, and evaporating at least some of the solvent to cause the phosphor particles to deposit on at least a portion of the light emitting surface. A coating including phosphor particles is thereby formed on at least a portion of the light emitting surface. Particles other than phosphor also may be coated and solutions wherein particles are dissolved in solvent also may be used.

摘要翻译： 半导体发光器件通过将包含悬浮在溶剂中的荧光体颗粒的悬浮液放置在半导体发光元件的发光表面的至少一部分上而蒸发至少一些溶剂以使荧光体颗粒沉积在 光发射表面的至少一部分。 由此，在发光面的至少一部分上形成包含荧光体粒子的涂层。 可以使用除荧光体之外的颗粒，也可以使用其中颗粒溶解在溶剂中的溶液。

公开(公告)号：US20070019129A1

公开(公告)日：2007-01-25

申请号：US11185397

申请日：2005-07-20

申请人： Gerald Negley

发明人： Gerald Negley

IPC分类号： G02F1/1335

CPC分类号： G09G3/3426 ,  G02F1/133603 ,  G09G3/32 ,  G09G2320/0233

摘要： Backlighting systems for color display screens include clusters of LED devices of different colors that are configured to radiate the different colors in a light path that impinges on the color display screen, to provide backlighting on the color display screen. LED device controllers are provided, a respective one of which is configured to control operating parameters of a subset of the clusters of LED devices, a single cluster of LED devices and/or individual LED devices in the individual clusters. The LED device controllers may use a common data line.

摘要翻译： 用于彩色显示屏幕的背光系统包括不同颜色的LED装置的集群，其被配置为在照射在彩色显示屏上的光路中辐射不同的颜色，以在彩色显示屏幕上提供背光。 LED器件控制器被提供，其相应的一个被配置为控制LED器件簇的子集的操作参数，单个簇中的单个LED器件群集和/或单独的LED器件。 LED设备控制器可以使用公共数据线。

公开(公告)号：US20050215000A1

公开(公告)日：2005-09-29

申请号：US10811350

申请日：2004-03-26

申请人： Gerald Negley

发明人： Gerald Negley

IPC分类号： H01L21/04 ,  H01L33/00 ,  H01L33/20 ,  H01L47/00

CPC分类号： H01L33/20 ,  H01L33/0095 ,  Y10S438/931

摘要： Fabrication of a light emitting device includes etching of a substrate of the light emitting device. The etch may be an aqueous etch sufficient to increase an amount of light extracted through the substrate. The etch may be a direct aqueous etch of a silicon carbide substrate. The etch may remove damage from the substrate that results from other processing of the substrate, such as damage from sawing the substrate. The etch may remove an amorphous region of silicon carbide in the substrate.

摘要翻译： 发光器件的制造包括蚀刻发光器件的衬底。 蚀刻可以是足以增加通过基底提取的光量的水性蚀刻。 蚀刻可以是碳化硅衬底的直接水性蚀刻。 蚀刻可以消除由衬底的其他处理导致的衬底的损伤，例如锯切衬底的损伤。 蚀刻可以去除衬底中的碳化硅的非晶区域。