公开(公告)号：US5122858A

公开(公告)日：1992-06-16

申请号：US580696

申请日：1990-09-10

Applicant: Deepak Mahulikar ,  Julius C. Fister ,  Gerald N. Violette

Inventor： Deepak Mahulikar ,  Julius C. Fister ,  Gerald N. Violette

IPC: H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49586 ,  H01L23/3142 ,  H01L23/49579 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181

Abstract: A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.

Abstract translation: 提供了一种用于电子封装的复合引线框架。 聚合物层涂覆引线框架的一部分。 聚合物层增加了引线框和模制树脂之间的粘结。 水蒸气不会积聚在引线下方，并附着桨叶使爆米花效果最小化。

公开(公告)号：US5103292A

公开(公告)日：1992-04-07

申请号：US442877

申请日：1989-11-29

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: H01L23/02 ,  H01L23/04 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/12 ,  H01L23/14 ,  H01L23/498 ,  H01L23/50

CPC classification number: H01L23/04 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/142 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/3025

Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.

Abstract translation: 提供了一种金属针格栅阵列封装和用于组装封装的工艺。 该封装包括具有有序阵列的孔的金属或金属合金基底部件。 端子引脚电连接到所需的电路并延伸穿过有序阵列的孔。 电介质聚合物密封剂将覆盖组分粘合到电路和基底组分上。 在包装组装过程中，聚合物密封剂流入包括有序排列的孔的孔，使端子销与基座部件电隔离。

公开(公告)号：US5096508A

公开(公告)日：1992-03-17

申请号：US563766

申请日：1990-07-27

Applicant: John F. Breedis ,  George J. Muench ,  Deepak Mahulikar

Inventor： John F. Breedis ,  George J. Muench ,  Deepak Mahulikar

IPC: C23C8/80 ,  C23C14/48

CPC classification number: C23C14/48 ,  C23C8/80 ,  Y10T428/12882

Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.

Abstract translation: 提供具有改性表面的复合铜合金。 可溶于铜和与氮反应的元素或组合的元素或铜组合形成固态溶液。 该合金与氮化物形成剂反应以改变表面。 通过在含氮气体中加热形成连续的表面膜。 通过注入氮离子形成氮化物沉淀物在铜基质中的分散体。

公开(公告)号：US5023398A

公开(公告)日：1991-06-11

申请号：US504741

申请日：1990-04-04

Applicant: Deepak Mahulikar ,  James M. Popplewell

Inventor： Deepak Mahulikar ,  James M. Popplewell

IPC: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14

CPC classification number: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/142 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195

Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

Abstract translation: 本发明涉及一种适于容纳诸如半导体集成电路的电子设备的封装。 封装部件由铝基合金组成。 包装部件的表面的至少一部分被阳极化以增强耐腐蚀性并增加粘结强度。 基于铝的包装的特征在于比基于铜的包装更轻的重量，并且比基于塑料的包装具有更好的导热性。

公开(公告)号：US4821151A

公开(公告)日：1989-04-11

申请号：US811911

申请日：1985-12-20

Applicant: Michael J. Pryor ,  Narendra N. Singhdeo ,  Deepak Mahulikar

Inventor： Michael J. Pryor ,  Narendra N. Singhdeo ,  Deepak Mahulikar

IPC: H01L21/48 ,  H01L23/04 ,  H01L23/538 ,  H05K7/10

CPC classification number: H01L23/04 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701

Abstract: A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

Abstract translation: 一种适于容纳多个半导体器件的气密密封封装。 封装包括由多个陶瓷基板和设置在其间的导电电路图形成的多层电路器件。 具有适于接收半导体管芯的至少一个腔的陶瓷盖被密封到多层电路器件。 电引线连接到半导体器件并从封装向外延伸以连接到多层电路内的导电电路图案。

公开(公告)号：US4704626A

公开(公告)日：1987-11-03

申请号：US752872

申请日：1985-07-08

Applicant: Deepak Mahulikar ,  Satyam C. Cherukuri

Inventor： Deepak Mahulikar ,  Satyam C. Cherukuri

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/02 ,  H01L23/06 ,  H01L23/48

CPC classification number: H01L23/10 ,  H01L23/373 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195

Abstract: A graded seal assembly adapted for hermetically sealing a semiconductor package is disclosed. First and second members having first and second coefficients of thermal expansion respectively are provided. A leadframe is disposed between the first and second members. A first sealing glass is bonded to opposite surfaces of the leadframe and is disposed between the leadframe and the first member for sealing the leadframe to the first member. The second sealing glass is bonded to the second member. The second sealing glass has a third CTE which has a mismatch of less than about 5.times.10.sup.-7 in/in/.degree.C. with said second member. A graded interface zone having stratified layers fuses the first and second sealing glasses. Each of the layers in the zone has a coefficient of thermal expansion which is mismatched less than about 5.times.10.sup.-7 in/in/.degree.C. with an adjacent layer to absorb thermal stress formed by exposure of the semiconductor package to thermal cycling.

Abstract translation: 公开了一种适于气密密封半导体封装的分级密封组件。 提供具有第一和第二热膨胀系数的第一和第二构件。 引线框设置在第一和第二构件之间。 第一密封玻璃结合到引线框架的相对表面，并且设置在引线框架和第一构件之间，用于将引线框架密封到第一构件。 第二密封玻璃结合到第二构件。 第二密封玻璃具有与所述第二构件不匹配的小于约5×10 -7 in / in /℃的第三CTE。 具有分层的分级界面区使第一和第二密封眼镜融合。 区域中的每个层具有小于约5×10 -7 in / in /℃的失配系数，具有相邻层以吸收由半导体封装暴露于热循环形成的热应力。

公开(公告)号：US08974677B2

公开(公告)日：2015-03-10

申请号：US12850915

申请日：2010-08-05

Applicant: Saeed H. Mohseni ,  Deepak Mahulikar

Inventor： Saeed H. Mohseni ,  Deepak Mahulikar

IPC: C02F1/00 ,  B01D37/00 ,  B01D29/56 ,  B01D35/143 ,  B01D29/00

CPC classification number: B01D35/143 ,  B01D29/56 ,  B01D29/96 ,  B01D2201/265

Abstract: Fluid processing apparatuses and systems are disclosed. In some embodiments the fluid processing apparatuses include a movable enclosure, a plurality of filter housings disposed substantially within the movable enclosure, and a stand disposed within the enclosure. The filter housings are in fluid communication with one another. Each filter housing defines an elongate path and is configured to support a respective filter along the elongate flow path to filter a substantially continuous flow of fluid. The stand supports each filter housing such that the elongate flow path of each filter housing is substantially parallel to a vertical axis, wherein each filter housing is independently rotatable, relative to the stand.

Abstract translation: 公开了流体处理装置和系统。 在一些实施例中，流体处理设备包括可移动的外壳，基本上设置在可移动外壳内的多个过滤器外壳以及设置在外壳内的支架。 过滤器壳体彼此流体连通。 每个过滤器壳体限定细长的路径并且构造成沿着细长流动路径支撑相应的过滤器以过滤基本连续的流体流。 支架支撑每个过滤器壳体，使得每个过滤器壳体的细长流动路径基本上平行于垂直轴线，其中每个过滤器壳体相对于支架独立地可旋转。

公开(公告)号：US08961815B2

公开(公告)日：2015-02-24

申请号：US12828766

申请日：2010-07-01

Applicant: Bin Hu ,  Abhiskek Singh ,  Gert Moyaerts ,  Deepak Mahulikar ,  Richard Wen

Inventor： Bin Hu ,  Abhiskek Singh ,  Gert Moyaerts ,  Deepak Mahulikar ,  Richard Wen

IPC: C09K13/04 ,  C09K3/14 ,  C09G1/02 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L29/66

CPC classification number: H01L21/30625 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/0475 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/76819 ,  H01L29/66545

Abstract: The present disclosure is directed to a highly dilutable chemical mechanical polishing concentrate comprising an abrasive, an acid, a stabilizer, and water with a point-of-use pH ranging from 2.2-3.5 for planarizing current and next generation semiconductor integrated circuit FEOL/BEOL substrates.

Abstract translation: 本公开涉及一种高度可稀释的化学机械抛光浓缩物，其包含研磨剂，酸，稳定剂和水，其使用点pH为2.2-3.5，用于平坦化电流和下一代半导体集成电路FEOL / BEOL 底物。

公开(公告)号：US20120055865A1

公开(公告)日：2012-03-08

申请号：US13159915

申请日：2011-06-14

Applicant: Saeed H. Mohseni ,  Deepak Mahulikar ,  Elizabeth Gramm

Inventor： Saeed H. Mohseni ,  Deepak Mahulikar ,  Elizabeth Gramm

IPC: B01D29/00 ,  B08B3/12 ,  B08B3/00 ,  C09K13/00 ,  C11D17/00 ,  C09K13/04 ,  C09K13/02 ,  B08B7/04 ,  B08B9/00

CPC classification number: B08B3/08 ,  B01D41/04 ,  B08B3/14 ,  C11D3/43 ,  C11D7/50

Abstract: A method for removing particles or deposits from a surface having particles or deposits thereon. The method involves contacting a surface with a chemical composition sufficient to selectively dissolve and remove at least a portion of the particles or deposits from the surface. The chemical composition is compatible with the surface. This disclosure also relates to a system of specially designed equipment for removing particles or deposits from a surface having particles or deposits thereon. The disclosure is useful, for example, in cleaning porous surfaces, media for cartridge, pleated and membrane surfaces, and internal walls of tanks or filter housings.

Abstract translation: 从其上具有颗粒或沉积物的表面去除颗粒或沉积物的方法。 该方法包括将表面与足以选择性地溶解并从表面去除至少一部分颗粒或沉积物的化学组合物接触。 化学成分与表面相容。 本公开还涉及一种用于从其上具有颗粒或沉积物的表面去除颗粒或沉积物的专门设计的设备的系统。 本公开可用于例如清洁多孔表面，用于筒的介质，褶皱和膜表面以及罐或过滤器壳体的内壁。

公开(公告)号：US20060124593A1

公开(公告)日：2006-06-15

申请号：US11141162

申请日：2005-05-31

Applicant: Gert Moyaerts ,  Ken Delbridge ,  Nichole Koontz ,  Saeed Mohseni ,  Gerome Sayles ,  Deepak Mahulikar

Inventor： Gert Moyaerts ,  Ken Delbridge ,  Nichole Koontz ,  Saeed Mohseni ,  Gerome Sayles ,  Deepak Mahulikar

IPC: C09K3/14 ,  C09G1/02 ,  C09K13/00 ,  H01L21/461 ,  B44C1/22 ,  H01L21/302 ,  C09C1/68 ,  C23F1/00 ,  B24D3/02

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  C23F3/04 ,  H01L21/30625

Abstract: A composition for chemical mechanical polishing a surface of a substrate having a plurality of ultra high purity sol gel processed colloidal silica particles for chemical mechanical polishing having alkali metals Li, Na, K, Rb, Cs, Fr and a combination thereof, at a total alkali concentration of about 300 ppb or less, with the proviso that the concentration of Na, if present, is less than 200 ppb; and a medium for suspending the particles is provided. Also, provided are methods of chemical mechanical polishing which included a step of contacting a substrate and a composition according to the present invention. The contacting is carried out at a temperature and for a period of time sufficient to planarize the substrate.

Abstract translation: 一种用于化学机械抛光基底表面的组合物，其具有多个超高纯度溶胶凝胶加工的用于具有碱金属Li，Na，K，Rb，Cs，Fr及其组合的化学机械抛光的胶体二氧化硅颗粒，其总计 碱浓度为约300ppb以下，条件是Na（如果存在）的浓度小于200ppb; 并提供用于悬浮颗粒的介质。 此外，提供了化学机械抛光的方法，其包括使基底和根据本发明的组合物接触的步骤。 接触在足以使基材平坦化的温度下进行一段时间。