公开(公告)号：US20090282673A1

公开(公告)日：2009-11-19

申请号：US12316750

申请日：2008-12-15

申请人： Chih-Ming Huang ,  Chih-Lun Chen

发明人： Chih-Ming Huang ,  Chih-Lun Chen

IPC分类号： G02B7/04

CPC分类号： G02B7/026 ,  G03B13/32 ,  Y10T29/53

摘要： A lens-fastening apparatus for assembling a voice coil motor of a camera module is provided. The voice coil motor has a lens holder. The lens-fastening apparatus includes a guiding plate; a rotation stopping jig having a central and a lateral portions, disposed on the guiding plate, and fit with the lens holder for stopping a rotation of the lens holder; a focusing ring for rotating the lens; a first pressing device pressing the central portion of the rotation stopping jig to fasten the rotation stopping jig on the guiding plate; and a second pressing device pressing the lateral portion of the rotation stopping jig.

摘要翻译： 提供了一种用于组装相机模块的音圈电机的镜头固定装置。 音圈电机具有透镜架。 透镜紧固装置包括导板; 具有中央和外侧部分的旋转止动夹具，设置在所述引导板上，并与所述透镜保持器配合以停止所述透镜保持器的旋转; 用于旋转透镜的聚焦环; 按压所述旋转停止夹具的中心部分的第一按压装置将所述转动停止夹具紧固在所述引导板上; 以及按压旋转停止夹具的侧部的第二按压装置。

公开(公告)号：US20090093089A1

公开(公告)日：2009-04-09

申请号：US12241847

申请日：2008-09-30

申请人： Chien-Ping Huang ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Chih-Ming Huang

IPC分类号： H01L21/02

CPC分类号： H01L23/3677 ,  H01L21/4871 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/4334 ,  H01L23/49548 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an insulating core layer, a thin metallic layer formed on each of an upper surface and a lower surface of the insulating core layer and a thermal via hole formed in the insulating core layer. A molding process is performed to encapsulate the chip and the heat sink with an encapsulant to form a package unit. A singulation process is performed to peripherally cut the package unit. A part of the encapsulant above the thin metallic layer on the upper surface of the heat sink is removed, such that the thin metallic layer on the upper surface of the heat sink is exposed, and heat generated by the chip can be dissipated through the heat sink.

摘要翻译： 提供散热半导体封装及其制造方法。 半导体芯片安装在芯片载体上。 散热器安装在芯片上，并且包括绝缘芯层，形成在绝缘芯层的上表面和下表面中的每一个上的薄金属层和形成在绝缘芯层中的热通孔。 进行成型工艺以用密封剂封装芯片和散热器以形成封装单元。 执行单个处理以周边地切割包装单元。 在散热器的上表面上的薄金属层上方的一部分密封剂被去除，使得散热器上表面上的薄金属层被暴露，并且由芯片产生的热量可以通过热量散发 水槽。

公开(公告)号：US20080075439A1

公开(公告)日：2008-03-27

申请号：US11861838

申请日：2007-09-26

申请人： Chih-Ming Huang

发明人： Chih-Ming Huang

IPC分类号： H02P7/29

CPC分类号： H02P6/08 ,  H02P6/14

摘要： A torque compensation method and system for a DC brushless motor. When the DC brushless motor coupled with an asymmetric load is rotating, the difference between an instant current and an average current of a shunt resister is an index of adjusting control signals within an absolute rotor position for the purpose of approaching the corresponding instant current to the average current.

摘要翻译： 一种用于直流无刷电机的转矩补偿方法和系统。 当与非对称负载耦合的DC无刷电动机旋转时，分流电阻器的瞬时电流和平均电流之间的差异是在绝对转子位置内调整控制信号的指标，以便接近对应于瞬时电流 平均电流。

公开(公告)号：US07339280B2

公开(公告)日：2008-03-04

申请号：US10319211

申请日：2002-12-13

申请人： Jui-Yu Chuang ,  Lien-Chi Chan ,  Chih-Ming Huang

发明人： Jui-Yu Chuang ,  Lien-Chi Chan ,  Chih-Ming Huang

IPC分类号： H01L23/29

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package with a lead frame as a chip carrier and a method for fabricating the same are provided. The lead frame includes a die pad and a plurality of leads properly spaced apart from the die pad, each lead being composed of an inner lead portion and an outer lead portion, wherein the inner lead portion is directed toward the die pad, and the outer lead portion has a terminal. At least a chip is mounted on the die pad, and a first encapsulant is formed for encapsulating the chip, die pad and inner lead portions. An injection-molded second encapsulant is formed for encapsulating the first encapsulant and outer lead portions, but exposing the terminals of the outer lead portions. The second encapsulant made by injection molding can prevent resin flash over the exposed terminals, thereby assuring electrical-connection quality of the semiconductor package.

摘要翻译： 提供了具有引线框架作为芯片载体的半导体封装及其制造方法。 引线框架包括管芯焊盘和与管芯焊盘适当间隔开的多个引线，每个引线由内引线部分和外引线部分组成，其中内引线部分指向管芯焊盘，外引线 引线部分具有端子。 至少芯片安装在管芯焊盘上，形成第一密封剂以封装芯片，管芯焊盘和内引线部分。 形成注射成型的第二密封剂，用于封装第一密封剂和外引线部分，但暴露外引线部分的端子。 通过注射成型制成的第二密封剂可以防止树脂在暴露的端子上闪烁，从而确保半导体封装的电连接质量。

公开(公告)号：US07271493B2

公开(公告)日：2007-09-18

申请号：US11112108

申请日：2005-04-21

申请人： Chien Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang

发明人： Chien Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang

IPC分类号： H01L29/40

CPC分类号： H01L21/4857 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

摘要翻译： 提供一种半导体封装及其制造方法，其中使用形成有多个开口的电介质材料层，并且将焊料材料施加到每个开口中。 第一铜层和第二铜层又沉积在介电材料层和焊料材料上，并且第一和第二铜层被图案化以形成多个导电迹线，每个导电迹线具有涂覆有金属层的端子。 芯片安装在导电迹线上，并通过接合线电连接到端子，电介质材料层和焊料材料暴露于外部。 该封装结构可以灵活地布置导电迹线并有效地缩短接合线，从而提高半导体封装的迹线布线性和电连接质量。

公开(公告)号：US20070202633A1

公开(公告)日：2007-08-30

申请号：US11651708

申请日：2007-01-09

申请人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

发明人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC分类号： H01L21/00

CPC分类号： H01L21/4882 ,  H01L23/3675 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor package and a method for fabricating the same are provided. The method includes providing a substrate having recognition points and a heat sink having openings, and placing the heat sink on the substrate with the recognition points being exposed through the openings; using a checking system to inspect the recognition points through the openings so as to ensure that the heat sink is placed at a predetermined position on the substrate; and attaching the heat sink to the substrate via an adhesive. By the above semiconductor package and method, there is no need to form positioning holes in the substrate such that any adverse effect on the circuit layout and reliability of the semiconductor package is avoided, and any positional shifting of the heat sink relative to the substrate can be determined in a real time manner.

摘要翻译： 提供半导体封装及其制造方法。 该方法包括提供具有识别点的基板和具有开口的散热器，并且将散热器放置在基板上，识别点通过开口露出; 使用检查系统通过开口检查识别点，以确保散热器被放置在基板上的预定位置; 以及通过粘合剂将散热器附接到基板。 通过上述半导体封装和方法，不需要在衬底中形成定位孔，从而避免对半导体封装的电路布局和可靠性的任何不利影响，并且散热片相对于衬底的任何位置偏移可以 以实时的方式确定。

公开(公告)号：US20070164386A1

公开(公告)日：2007-07-19

申请号：US11648045

申请日：2006-12-28

申请人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/0203 ,  H01L21/56

CPC分类号： H01L27/14687 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.

摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

公开(公告)号：US20070145561A1

公开(公告)日：2007-06-28

申请号：US11643147

申请日：2006-12-20

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

IPC分类号： H01L23/02

CPC分类号： H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 保护层形成有用于暴露接合焊盘的开口。 在成对的接合焊盘之间形成有一个沟槽，其长度大于安装在成对接合焊盘上的电子部件的宽度。 该沟槽与一对接合焊盘相邻，并与该接合焊盘露出的相应的一个开口连通。 因此，电子部件和电子载体板之间的间隙可以有效地填充用于封装电子部件的绝缘树脂，从而防止成对焊盘之间的空隙和不期望的电桥发生。

公开(公告)号：US20070138632A1

公开(公告)日：2007-06-21

申请号：US11642439

申请日：2006-12-19

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H05K3/3452 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. An opening is formed in the protective layer to expose at least three sides of each of the paired bond pads. The protective layer includes at least one independent residual portion located in the opening and between the paired bond pads, such that an electronic component is mounted on the independent residual portion and electrically connected to the bond pads. A groove without a dead space is formed between the electronic component and the carrier, such that a molding compound for encapsulating the electronic component can flow through the groove to fill the opening and a space under the electronic component and encapsulate the at least three sides of each of the bond pads.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 在保护层中形成开口以暴露每个配对接合焊盘的至少三个侧面。 保护层包括至少一个独立的残留部分，位于开口内和成对的接合焊盘之间，使得电子部件安装在独立的残留部分上并电连接到接合焊盘。 在电子部件和载体之间形成没有死空间的凹槽，使得用于封装电子部件的模制化合物可以流过凹槽以填充开口和电子部件下方的空间，并将至少三个侧面 每个接合垫。

公开(公告)号：US07173828B2

公开(公告)日：2007-02-06

申请号：US10674317

申请日：2003-09-29

申请人： Ying-Ren Lin ,  Chih-Ming Huang ,  Ho-Yi Tsai

发明人： Ying-Ren Lin ,  Chih-Ming Huang ,  Ho-Yi Tsai

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/17051 ,  H01L2224/17106 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/17104 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.

摘要翻译： 公开了一种用于防止焊料挤出的接地焊盘结构和具有接地焊盘结构的半导体封装，其中接地焊盘结构具有沿其接地平面的圆周定位的接地焊盘以非阻焊掩模定义的方式形成。 因此，保持良好的接地质量，并且可以避免相邻导电迹线之间的电桥接的发生，因为熔融焊料凸块从沿着接地焊盘结构的圆周朝向其相邻导电迹线的接地焊盘的挤出是有效的 防止了