公开(公告)号：US06720208B2

公开(公告)日：2004-04-13

申请号：US10322672

申请日：2002-12-19

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

摘要翻译： 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US06714383B2

公开(公告)日：2004-03-30

申请号：US09740957

申请日：2000-12-21

申请人： Yoshiyuki Kado ,  Hiroshi Kikuchi ,  Ikuo Yoshida

发明人： Yoshiyuki Kado ,  Hiroshi Kikuchi ,  Ikuo Yoshida

IPC分类号： G11B560

CPC分类号： G11B5/4846 ,  G11B5/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A technique to be applied to improve the reliability of a magnetic disk apparatus is disclosed. In detail, a magnetic disk apparatus comprises a disk-shaped magnetic recording medium that rotates in operation, a magnetic head for writing the data in the magnetic recording medium and for reading out the data written in the magnetic recording medium, a carriage mechanism having an arm on which the magnetic head is located and moving the magnetic head to an arbitrary position on the magnetic recording medium, a wiring member having wiring, a semiconductor chip having a first main surface and a second main surface that are opposed to each other and electrodes formed on the first main surface, the semiconductor chip being fixed to the wiring member in the state that the electrodes are facing to the wiring of the wiring member, and a housing that contains the magnetic recording medium, the magnetic head, the carriage mechanism, the wiring member, and the semiconductor chip, wherein the edge of the first main surface side of the semiconductor chip and the edge of the second main surface side are covered with insulative resin.

摘要翻译： 公开了一种应用于提高磁盘装置的可靠性的技术。 详细地说，一种磁盘装置包括一个在工作中旋转的盘形磁记录介质，一个磁头，用于将数据写入磁记录介质中，并读出写在磁记录介质中的数据;一个滑架机构， 磁头位于其上并将磁头移动到磁记录介质上的任意位置，具有布线的布线构件，具有彼此相对的第一主表面和第二主表面的半导体芯片和电极 形成在所述第一主表面上，所述半导体芯片在所述电极面对所述布线构件的布线的状态下固定到所述布线构件;以及壳体，其容纳所述磁记录介质，所述磁头，所述滑架机构， 布线部件和半导体芯片，其中半导体芯片的第一主表面侧的边缘和第二主表面的边缘 侧面用绝缘树脂覆盖。

公开(公告)号：US06528343B1

公开(公告)日：2003-03-04

申请号：US09646711

申请日：2000-11-29

申请人： Hiroshi Kikuchi ,  Yoshiyuki Kado ,  Ikuo Yoshida

发明人： Hiroshi Kikuchi ,  Yoshiyuki Kado ,  Ikuo Yoshida

IPC分类号： H01L2144

CPC分类号： H01L24/94 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/11 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/323 ,  H05K2201/023 ,  H05K2201/091 ,  H05K2201/10719 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Disclosed herein is a semiconductor device, which comprises a semiconductor chip including, over one main surface thereof, first wirings, protective films formed so as to cover other portions excluding parts of the first wirings, flexible layers respectively formed on the protective films so as to exclude the parts of the first wirings, and second wirings having first portions respectively electrically connected to the parts of the first wirings, and second portions respectively drawn onto the flexible layers; a wiring board having third wirings over one main surface thereof; and an adhesive comprising a large number of conductive particles contained in an insulative resin, and wherein the semiconductor chip is bonded to the wiring board with the adhesive interposed therebetween in a state in which the one main surface thereof is face to face with the one main surface of the wiring board, and the second portions of the second wirings are respectively electrically connected to the third wirings with some of the large number of conductive particles interposed therebetween.

摘要翻译： 这里公开了一种半导体器件，其包括在其一个主表面上包括第一布线的半导体芯片，形成为覆盖除了第一布线的部分以外的其它部分的保护膜，分别形成在保护膜上的柔性层，以便 排除第一布线的部分，第二布线具有分别电连接到第一布线的部分的第一部分和分别拉到柔性层上的第二部分; 布线板，其一个主表面上具有第三布线; 以及包含绝缘树脂中所含的大量导电性粒子的粘合剂，其中，所述半导体芯片在其一个主面与所述一个主体面对的状态下与所述配线基板接合， 布线板的表面和第二布线的第二部分分别电连接到第三布线，其中一些导电颗粒被插入其间。

公开(公告)号：US06433412B1

公开(公告)日：2002-08-13

申请号：US09800589

申请日：2001-03-08

申请人： Hideko Ando ,  Hiroshi Kikuchi ,  Ikuo Yoshida ,  Toshihiko Sato ,  Tomo Shimizu

发明人： Hideko Ando ,  Hiroshi Kikuchi ,  Ikuo Yoshida ,  Toshihiko Sato ,  Tomo Shimizu

IPC分类号： H01L2302

摘要： A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between a main face (lower face) of the memory chip 1 and a main face of the package substrate 2 is filled with underfill resin (seal resin) 10 constituting a seal member for achieving protection of connecting portions and for relaxation of thermal stress. An outer edge of the underfill resin 10 is extended to an outer side of the memory chip 1 and covers entire faces of the chip condensers 7 mounted at vicinities of the memory chip 1.

公开(公告)号：US06380621B1

公开(公告)日：2002-04-30

申请号：US09543769

申请日：2000-04-05

申请人： Hideko Ando ,  Hiroshi Kikuchi ,  Toshihiko Sato ,  Tetsuya Hayashida

发明人： Hideko Ando ,  Hiroshi Kikuchi ,  Toshihiko Sato ,  Tetsuya Hayashida

IPC分类号： H01L2310

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/3735 ,  H01L23/433 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/2036 ,  H05K2203/047 ,  Y02P70/613 ,  H01L2924/00

摘要： An electrically reliable heat radiating package provided with ball grid array (BGA) structure and a method of manufacturing the package are disclosed. In the concrete, a semiconductor chip is mounted on one surface of a ceramic wiring board via a first soldered bump electrode and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered. Further, a radiating fin made of aluminum is provided on the heat diffusing plate and stuck via silicone rubber in which thermally conductive filler is included. Further, the above first soldered bump electrode and a second soldered bump electrode with a lower melting point than that of solder used for the above soldering are formed on the rear surface of the above ceramic wiring board and the above BGA package provided with heat radiating structure is formed. This BGA package is mounted on a glass epoxy wiring board at low temperature.

摘要翻译： 公开了一种具有球栅阵列（BGA）结构的电可靠性散热封装和制造该封装的方法。具体而言，通过第一焊接突起电极和树脂将半导体芯片安装在陶瓷布线板的一个表面上 填充在布线板的一个表面和半导体芯片的主表面之间的间隙区域中。 在与半导体芯片的主表面相对的后表面上布置有由氮化铝形成的具有比半导体芯片更大的平面尺寸的热扩散板并焊接。此外，在散热片上设置由铝制成的散热片 并通过其中包含导热填料的硅橡胶粘贴。此外，上述第一焊接凸块电极和熔点低于用于上述焊接的焊料熔点低的第二焊接凸块电极形成在 形成陶瓷布线板以上的上述BGA封装，并具有散热结构。该BGA封装在低温下安装在玻璃环氧树脂布线板上。

公开(公告)号：US06375590B1

公开(公告)日：2002-04-23

申请号：US09550161

申请日：2000-04-14

申请人： Masato Tomobuchi ,  Tatsuo Arai ,  Hiroshi Kikuchi

发明人： Masato Tomobuchi ,  Tatsuo Arai ,  Hiroshi Kikuchi

IPC分类号： F16G520

CPC分类号： F16G1/28

摘要： A toothed belt particularly suitable for use in general industrial machineries includes a cured rubber belt body, a tensile member embedded in the belt body, and a tooth fabric adhered to the surface of teeth of the belt body. The belt body is formed primarily from a vulcanizable rubber composition containing hydrogenated nitrile rubber and zinc polymethacrylate. The zinc polymethacrylate and the hydrogenated nitrile rubber are blended together in a ratio of from 22:78 to 45:55 parts by weight. To the vulcanizable rubber composition, a vulcanizing agent comprised of peroxide and a reinforcer comprised of carbon black are added, and a mixture is vulcanized and pressed or otherwise molded to form the afore-said cured rubber belt body with the tensile member embedded therein. The tensile member is made of high-strength glass fibers. The glass fibers preferably have a resorcin-formalin-latex layer and an overcoat layer both formed thereon.

摘要翻译： 特别适用于一般工业机械的齿形带包括固化橡胶带体，嵌入带体中的拉伸构件和粘附到带体表面上的牙齿织物。 带体主要由含有氢化丁腈橡胶和聚甲基丙烯酸锌的可硫化橡胶组合物形成。 聚甲基丙烯酸锌和氢化丁腈橡胶以22:78至45:55重量份的比例混合在一起。 向可硫化橡胶组合物中加入由过氧化物和由炭黑构成的增强剂组成的硫化剂，并且将其中嵌入有拉伸构件的硫化和压制或其它方式模制以形成上述固化橡胶带体。 拉伸构件由高强度玻璃纤维制成。 玻璃纤维优选在其上形成间苯二酚 - 甲醛 - 胶乳层和外涂层。

公开(公告)号：US06204552B1

公开(公告)日：2001-03-20

申请号：US09481398

申请日：2000-01-12

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US06203886B1

公开(公告)日：2001-03-20

申请号：US09271649

申请日：1999-03-18

申请人： Hiroshi Kikuchi ,  Tooru Fujiwara ,  Mitsuo Kasahara ,  Yoshinori Itou

发明人： Hiroshi Kikuchi ,  Tooru Fujiwara ,  Mitsuo Kasahara ,  Yoshinori Itou

IPC分类号： B23B328

CPC分类号： B29D29/08 ,  F16G1/28 ,  Y10T428/24537 ,  Y10T428/24579 ,  Y10T428/24587

摘要： A skew-toothed belt includes tension members, a tooth portion, and a back portion. The tooth portion and the back portion are located on opposite sides of an array of the tension members. The tooth portion is covered with a tooth cloth, which is arranged such that the weft thread extends substantially perpendicular to the tooth trace direction of each skewed tooth. A method for manufacturing the skew-toothed belt includes the steps of: cutting an elongated tooth cloth material obliquely to the weft direction so as to obtain a tooth cloth sheet; bonding the opposite end portions of the tooth cloth sheet extending along the warp together to form a cylindrical tooth cloth; fitting the cylindrical tooth cloth onto a cylindrical die on which tooth-profiled grooves are formed; sequentially winding the tension members and an unvulcanized rubber compound sheet onto the fitted cylindrical tooth cloth; subjecting the resultant assembly to forming and vulcanization in a pressure chamber; and cutting the resultant cylindrical body into annular toothed belts, each having a predetermined width.

摘要翻译： 偏斜齿带包括张紧构件，齿部和后部。 齿部和后部位于张力构件的阵列的相对侧上。 齿部被齿布覆盖，齿布布置成使得纬纱基本上垂直于每个倾斜齿的齿迹方向延伸。 制造斜齿带的方法包括以下步骤：沿着纬向方向切割细长的齿布材料，以获得牙布片; 将沿着经纱延伸的牙布片的相对端部粘合在一起形成圆筒状的牙布; 将圆柱形齿布装配到形成齿形槽的圆柱形模具上; 将张紧构件和未硫化橡胶复合片顺序地卷绕到装配的圆柱形牙布上; 使所得组件在压力室中进行成型和硫化; 并将所得到的圆柱体切割成具有预定宽度的环形齿形带。

公开(公告)号：US6069029A

公开(公告)日：2000-05-30

申请号：US60368

申请日：1998-04-15

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

摘要翻译： 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US6048109A

公开(公告)日：2000-04-11

申请号：US595758

申请日：1996-02-02

申请人： Hiroshi Kikuchi

发明人： Hiroshi Kikuchi

IPC分类号： G03B17/02 ,  G03B17/00

CPC分类号： G03B17/02

摘要： An apparatus includes a shape memory member, a deforming device which deforms the shape memory member into a predetermined state, an operating device which performs a predetermined movement in response to a movement in which the shape memory member restores itself from the predetermined state to a memorized state, and a restraining device. The restraining device restrains an operation of the deforming device at least when the shape memory member performs the movement of restoring itself from the predetermined state to the memorized state.

摘要翻译： 一种装置，包括：形状记忆部件，将形状记忆部件变形为规定状态的变形装置;响应于形状记忆部件将其自身从规定状态恢复到记忆体的动作，进行规定的移动的操作装置; 状态和限制装置。 抑制装置至少在形状记忆部件进行从规定状态恢复到记忆状态的移动时，抑制变形装置的动作。