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公开(公告)号：US06380621B1
公开(公告)日：2002-04-30
申请号：US09543769
申请日：2000-04-05
IPC分类号： H01L2310
CPC分类号： H01L24/32 , H01L21/563 , H01L23/3735 , H01L23/433 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/92125 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/351 , H05K3/303 , H05K3/3436 , H05K3/3463 , H05K2201/094 , H05K2201/09781 , H05K2201/2036 , H05K2203/047 , Y02P70/613 , H01L2924/00
摘要： An electrically reliable heat radiating package provided with ball grid array (BGA) structure and a method of manufacturing the package are disclosed. In the concrete, a semiconductor chip is mounted on one surface of a ceramic wiring board via a first soldered bump electrode and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered. Further, a radiating fin made of aluminum is provided on the heat diffusing plate and stuck via silicone rubber in which thermally conductive filler is included. Further, the above first soldered bump electrode and a second soldered bump electrode with a lower melting point than that of solder used for the above soldering are formed on the rear surface of the above ceramic wiring board and the above BGA package provided with heat radiating structure is formed. This BGA package is mounted on a glass epoxy wiring board at low temperature.
摘要翻译： 公开了一种具有球栅阵列（BGA）结构的电可靠性散热封装和制造该封装的方法。具体而言，通过第一焊接突起电极和树脂将半导体芯片安装在陶瓷布线板的一个表面上 填充在布线板的一个表面和半导体芯片的主表面之间的间隙区域中。 在与半导体芯片的主表面相对的后表面上布置有由氮化铝形成的具有比半导体芯片更大的平面尺寸的热扩散板并焊接。此外，在散热片上设置由铝制成的散热片 并通过其中包含导热填料的硅橡胶粘贴。此外，上述第一焊接凸块电极和熔点低于用于上述焊接的焊料熔点低的第二焊接凸块电极形成在 形成陶瓷布线板以上的上述BGA封装，并具有散热结构。该BGA封装在低温下安装在玻璃环氧树脂布线板上。
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公开(公告)号：US6111322A
公开(公告)日：2000-08-29
申请号：US858695
申请日：1997-05-19
IPC分类号： H01L21/56 , H01L21/60 , H01L23/12 , H01L23/36 , H01L23/373 , H01L23/433 , H05K3/30 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/32 , H01L21/563 , H01L23/3735 , H01L23/433 , H01L24/81 , H01L24/92 , H05K3/3436 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/92125 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/351 , H05K2201/094 , H05K2201/09781 , H05K2201/2036 , H05K2203/047 , H05K3/303 , H05K3/3463 , Y02P70/613
摘要： An electrically reliable heat radiating package provided with a ball grid array (BGA) structure and a method of manufacturing the package are disclosed.A semiconductor chip is mounted on one surface of a ceramic wiring board via first solder bump electrodes and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in a larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered.Further, a radiating fin made of aluminum is provided on the heat diffusing plate and struck via silicone rubber in which a thermally conductive filler is includes.Further, the above first solder bump electrodes and second solder bump electrodes with a lower melting point than that of the solder used for the above soldering are formed on the rear surface of the above ceramic wiring board, and the above BGA package provided with a heat radiating structure is formed.This BGA package is mounted on a glass epoxy wiring board at low temperature.
摘要翻译： 公开了一种具有球栅阵列（BGA）结构的电可靠性散热封装和制造封装的方法。 半导体芯片通过第一焊料凸块电极安装在陶瓷布线板的一个表面上，并且树脂填充在布线板的一个表面和半导体芯片的主表面之间的间隙区域中。 在与半导体芯片的主表面相对的后表面上布置有由氮化铝形成的具有比半导体芯片大的平面尺寸的热扩散板，并且被焊接。 此外，在散热板上设置由铝制成的散热片，并通过其中包含导热填料的硅橡胶进行打击。 此外，在上述陶瓷布线板的后表面上形成上述第一焊锡凸块电极和具有比用于上述焊接的焊料熔点低的熔点的第二焊料凸块电极，并且上述具有热量的BGA封装 形成辐射结构。 该BGA封装在低温下安装在玻璃环氧树脂布线板上。
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公开(公告)号：US06433412B1
公开(公告)日：2002-08-13
申请号：US09800589
申请日：2001-03-08
申请人： Hideko Ando , Hiroshi Kikuchi , Ikuo Yoshida , Toshihiko Sato , Tomo Shimizu
发明人： Hideko Ando , Hiroshi Kikuchi , Ikuo Yoshida , Toshihiko Sato , Tomo Shimizu
IPC分类号： H01L2302
摘要： A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between a main face (lower face) of the memory chip 1 and a main face of the package substrate 2 is filled with underfill resin (seal resin) 10 constituting a seal member for achieving protection of connecting portions and for relaxation of thermal stress. An outer edge of the underfill resin 10 is extended to an outer side of the memory chip 1 and covers entire faces of the chip condensers 7 mounted at vicinities of the memory chip 1.
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公开(公告)号：US20140109717A1
公开(公告)日：2014-04-24
申请号：US14130675
申请日：2012-06-13
申请人： Kohei Maruyama , Naoto Sen , Hideto Nebuya , Toshihiko Sato , Takayuki Yoshimura , Go Suzaki , Hirotaka Takiguchi , Masaru Kanda
发明人： Kohei Maruyama , Naoto Sen , Hideto Nebuya , Toshihiko Sato , Takayuki Yoshimura , Go Suzaki , Hirotaka Takiguchi , Masaru Kanda
IPC分类号： G05G1/40
CPC分类号： G05G1/40 , B60K26/021 , B60K2026/023 , B60W30/146 , B60W50/16 , Y10T74/20534
摘要： An accelerator pedal reaction force control device for controlling a depression reaction force of an accelerator pedal provided to a motor vehicle, the control device including: a reaction force actuator that provides the accelerator pedal with a depression reaction force; a target reaction force setting unit that sets a target depression reaction force; and a vehicle speed maintenance depression amount setting unit that sets an amount of depression of the accelerator pedal for maintaining a current vehicle speed as a vehicle speed maintenance depression amount, wherein, when a pedal depression amount exceeds the vehicle speed maintenance depression amount, the target reaction force setting unit performs a cruise assist whereby the target depression reaction force is set to a value of a cruise assist depression reaction force.
摘要翻译： 一种加速踏板反作用力控制装置，用于控制设置在机动车辆上的加速器踏板的抑制反作用力，所述控制装置包括：反作用力致动器，其向加速踏板提供抑制反作用力; 目标反力设定单元，其设定目标抑制反作用力; 以及车速维持抑制量设定单元，其将用于维持当前车速的加速踏板的下压量设定为车速维持抑制量，其中，当踏板下压量超过车速维持抑制量时，所述目标 反作用力设定单元执行巡航辅助，由此将目标抑制反作用力设定为巡航辅助抑制反作用力的值。
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公开(公告)号：US06805401B2
公开(公告)日：2004-10-19
申请号：US10346984
申请日：2003-01-13
IPC分类号： B62D2520
CPC分类号： B62D21/157 , B62D21/152 , B62D25/025 , B62D25/20 , B62D25/2018 , B62D25/2036
摘要： A vehicle floor structure with a floor body provided to a body frame is provided. The floor body is a hollow panel integrally formed by arranging a plurality of core materials with spaces on a flat plate and placing another flat plate over the core materials. In order to increase the rigidity of the entire floor body, core materials in edge portions of the floor body are joined to the body frame.
摘要翻译： 提供具有设置在车体框架上的地板本体的车辆地板结构。 地板本体是通过在平板上布置多个具有空间的芯材并将另一个平板放置在芯材上而整体形成的中空板。 为了增加整个地板本体的刚性，将地板本体的边缘部分的芯材接合到主体框架。
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公开(公告)号：US5952692A
公开(公告)日：1999-09-14
申请号：US958845
申请日：1997-10-28
申请人： Kazuo Nakazato , Kiyoo Itoh , Hiroshi Mizuta , Toshihiko Sato , Toshikazu Shimada , Haroon Ahmed
发明人： Kazuo Nakazato , Kiyoo Itoh , Hiroshi Mizuta , Toshihiko Sato , Toshikazu Shimada , Haroon Ahmed
IPC分类号： H01L29/78 , G11C13/02 , G11C16/02 , H01L21/28 , H01L29/06 , H01L29/51 , H01L29/772 , H01L29/786 , H01L29/788
CPC分类号： H01L21/28185 , B82Y10/00 , G11C13/0014 , G11C13/02 , H01L21/28194 , H01L21/28229 , H01L29/511 , H01L29/517 , H01L29/772 , H01L29/78642 , H01L29/7888 , H01L21/28211
摘要： A memory device includes a memory node (1) to which charge is written through a tunnel barrier configuration (2) from a control electrode (9). The stored charge effects the conductivity of a source/drain path (4) and data is read by monitoring the conductivity of the path. The charge barrier configuration comprises a multiple tunnel barrier configuration, which may comprise alternating layers (16) of polysilicon of 3 nm thickness and layers (15) of Si.sub.3 N.sub.4 of 1 nm thickness, overlying polycrystalline layer of silicon (1) which forms the memory node. Alternative barrier configurations (2) are described, including a Schottky barrier configuration, and conductive nanometre scale conductive islands (30, 36, 44), which act as the memory node, distributed in an electrically insulating matrix.
摘要翻译： 存储器件包括从控制电极（9）通过隧道势垒配置（2）写入电荷的存储器节点（1）。 存储的电荷影响源/漏路径（4）的电导率，并且通过监测路径的电导率来读取数据。 电荷势垒配置包括多隧道势垒结构，其可以包括3nm厚度的多晶硅的交替层（16）和1nm厚度的Si 3 N 4层（15），覆盖形成存储器节点的硅的多晶层（1） 。 描述了包括肖特基势垒结构的替代屏障配置（2）和用作存储节点的导电纳米级导电岛（30,36,44），其分布在电绝缘矩阵中。
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公开(公告)号：US5305724A
公开(公告)日：1994-04-26
申请号：US20404
申请日：1993-02-22
申请人： Masataka Chikamatsu , Shigetaka Kuroda , Kazutomo Sawamura , Toshihiko Sato , Takayoshi Nakayama
发明人： Masataka Chikamatsu , Shigetaka Kuroda , Kazutomo Sawamura , Toshihiko Sato , Takayoshi Nakayama
CPC分类号： F02M25/0809 , F02M25/08
摘要： Disclosed is an evaporative fuel purging apparatus used for an internal combustion engine. A canister having an absorbing agent for absorbing an evaporative fuel generated in a fuel tank of the internal combustion engine is provided. A drain control valve is provided on a drain port for opening the canister to the atmospheric air, and which is adapted to open and close the drain port. A purge control valve is provided on a purge passage communicating the canister to a part of an intake system, and which is adapted to purge the evaporative fuel absorbed into the canister through opening and closing the purge passage. A diagnostic device diagnoses the presence or absence of leakage in a purge system which is sealed up by closing the drain control valve and the purge control valve after pressure-reduction treatment. In the above apparatus, the drain control valve is opened after termination of the diagnosis by the diagnostic device, to open the canister to the atmospheric air through the drain port, and after an elapse of a specified time, the purge is started by opening the purge control valve. With this construction, it is possible to prevent the rapid change in the air-fuel ratio in re-starting the purge after termination of the diagnosis for the purge system, and hence to improve the stabilization of the emission and the drivability.
摘要翻译： 公开了一种用于内燃机的蒸发式燃料净化装置。 提供一种具有用于吸收在内燃机的燃料箱中产生的蒸发燃料的吸收剂的罐。 排水控制阀设置在排水口上，用于将罐打开到大气中，并适于打开和关闭排放口。 清洗控制阀设置在净化通道上，该净化通道将罐连通到进气系统的一部分，并且适于通过打开和关闭净化通道来吹扫吸收到罐中的蒸发燃料。 诊断装置诊断在清除系统中是否存在泄漏，其通过在减压处理之后关闭排水控制阀和清洗控制阀而被密封。 在上述装置中，通过诊断装置诊断结束之后，排水控制阀打开，通过排水口将罐排放到大气中，经过规定时间后，通过打开 清洗控制阀。 利用这种结构，可以防止清除系统的诊断结束之后重新启动吹扫的空燃比的快速变化，从而改善排放的稳定性和驾驶性能。
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公开(公告)号：USRE29632E
公开(公告)日：1978-05-16
申请号：US133990
申请日：1971-04-14
IPC分类号： G03G5/087 , G03G15/045 , G03G15/09 , G03G15/22 , G03G15/28 , G03G15/30 , G03G21/00 , G03G21/10
CPC分类号： G03G15/045 , G03G15/09 , G03G15/22 , G03G15/226 , G03G15/286 , G03G15/30 , G03G21/0017 , G03G21/10 , G03G5/087
摘要： .Iadd.Electrophotographic copying device including novel means for forming a high contrast electrostatic image on a photosensitive member, as well as means for developing said high contrast electrostatic image with toner particles, means for transferring the visualized electrostatic image to copying material and novel cleaning means for removing from the photosensitive member, residual toner particles after transfer of the image. .Iaddend.
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公开(公告)号：US09176515B2
公开(公告)日：2015-11-03
申请号：US14130675
申请日：2012-06-13
申请人： Kohei Maruyama , Naoto Sen , Hideto Nebuya , Toshihiko Sato , Takayuki Yoshimura , Go Suzaki , Hirotaka Takiguchi , Masaru Kanda
发明人： Kohei Maruyama , Naoto Sen , Hideto Nebuya , Toshihiko Sato , Takayuki Yoshimura , Go Suzaki , Hirotaka Takiguchi , Masaru Kanda
CPC分类号： G05G1/40 , B60K26/021 , B60K2026/023 , B60W30/146 , B60W50/16 , Y10T74/20534
摘要： An accelerator pedal reaction force control device for controlling a depression reaction force of an accelerator pedal provided to a motor vehicle, the control device including: a reaction force actuator that provides the accelerator pedal with a depression reaction force; a target reaction force setting unit that sets a target depression reaction force; and a vehicle speed maintenance depression amount setting unit that sets an amount of depression of the accelerator pedal for maintaining a current vehicle speed as a vehicle speed maintenance depression amount, wherein, when a pedal depression amount exceeds the vehicle speed maintenance depression amount, the target reaction force setting unit performs a cruize assist whereby the target depression reaction force is set to a value of a cruize assist depression reaction force.
摘要翻译： 一种加速踏板反作用力控制装置，用于控制设置在机动车辆上的加速器踏板的抑制反作用力，所述控制装置包括：反作用力致动器，其向加速踏板提供抑制反作用力; 目标反力设定单元，其设定目标抑制反作用力; 以及车速维持抑制量设定单元，其将用于维持当前车速的加速踏板的下压量设定为车速维持抑制量，其中，当踏板下压量超过车速维持抑制量时，所述目标 反作用力设定单元进行冲击辅助，由此将目标抑制反作用力设定为冲击辅助抑制反作用力的值。
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公开(公告)号：US08524534B2
公开(公告)日：2013-09-03
申请号：US13533779
申请日：2012-06-26
IPC分类号： H01L21/00
CPC分类号： H01L24/14 , H01L23/28 , H01L23/3128 , H01L23/50 , H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0652 , H01L25/18 , H01L2224/1134 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06558 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2224/92247 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要： Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
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