公开(公告)号：US20050067688A1

公开(公告)日：2005-03-31

申请号：US10949693

申请日：2004-09-24

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.

摘要翻译： 提供一种封盖芯片，其包括芯片和盖构件，所述芯片具有前表面和暴露在前表面的多个接合焊盘，所述盖构件具有面向芯片的前表面的底表面，并且具有顶部 表面与前表面相对。 多个通孔从盖构件的底表面延伸到顶表面。 所述封装芯片组件还包括多个金属互连件，所述多个金属互连件至少部分地穿过所述通孔从所述接合焊盘延伸，所述金属互连件包括连接到所述接合焊盘的柱形凸块，所述凸块凸块接触并接合（i） 围绕通孔的帽构件的顶表面和（ii）通孔的内表面。

公开(公告)号：US08545599B2

公开(公告)日：2013-10-01

申请号：US12914786

申请日：2010-10-28

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： B03C3/40

CPC分类号： G03G21/206 ,  B03C3/06 ,  B03C3/60 ,  B03C2201/14 ,  C23C10/28 ,  C23C14/16 ,  C23C14/5806 ,  C25D7/00

摘要： A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.

摘要翻译： 热管理装置包括电动液体加速器，其中发射电极和另一电极通电以激励流体流动。 电极之一包括由具有第一性能特性的溶剂金属和具有第二性能特性的溶质材料形成的固溶体。 第一和第二性能特征在电极中基本独立地表现，因为溶剂金属和溶质材料在固溶体中保持基本上纯的。 制造EHD产品的方法包括向电极提供这样的固溶体，并且相对于另一电极定位电极以在通电时激励流体流动。

公开(公告)号：US20110006432A1

公开(公告)日：2011-01-13

申请号：US12670952

申请日：2008-07-25

申请人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

发明人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

IPC分类号： H01L23/538 ,  H01L21/50

CPC分类号： H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

摘要翻译： 提供堆叠的微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），在前表面暴露的触点（22），后表面（118）和边缘（18 ，20）在前表面和后表面之间延伸。 与触点连接的轨迹（24）可以沿着前表面朝着微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元触点覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

公开(公告)号：US07858445B2

公开(公告)日：2010-12-28

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US07569424B2

公开(公告)日：2009-08-04

申请号：US11600289

申请日：2006-11-15

申请人： Michael J. Nystrom ,  Christopher Paul Wade ,  Giles Humpston

发明人： Michael J. Nystrom ,  Christopher Paul Wade ,  Giles Humpston

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L27/14618 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly, positioning a molding surface in contact with the deposited flowable material and controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned between the upper surface and the molding surface.

摘要翻译： 在微电子组件中形成壁结构的方法包括在微电子组件中的第一元件的上表面上选择性地沉积可流动材料，将模制表面定位成与沉积的可流动材料接触并且控制上表面之间的距离 第一元件和模制表面，其中一个或多个物体位于上表面和模制表面之间。

公开(公告)号：US07443597B2

公开(公告)日：2008-10-28

申请号：US11318821

申请日：2005-12-27

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： G02B1/06

CPC分类号： G02B3/14 ,  G02B26/005 ,  H04N5/2254 ,  H04N5/2257

摘要： An electronic camera module includes a lens or refractive element formed by a pair of immiscible liquids and having optical properties which can be varied by applying a voltage so as to deform the meniscus. One of the two liquids extends from the meniscus all the way to the front surface of the sensor, so that light passing through the meniscus does not encounter further changes in refractive index enroute to the sensor.

摘要翻译： 电子照相机模块包括由一对不混溶液体形成的具有光学特性的透镜或折射元件，该特性可以通过施加电压以使弯液面变形来改变。 两个液体中的一个液体从弯液面一直延伸到传感器的前表面，使得穿过弯月面的光不会遇到传感器的折射率的进一步变化。

公开(公告)号：US20080191300A1

公开(公告)日：2008-08-14

申请号：US12004149

申请日：2007-12-20

申请人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

发明人： Michael J. Nystrom ,  David B. Tuckerman ,  Belgacem Haba ,  Giles Humpston ,  Jesse Burl Thompson

IPC分类号： H01L27/146

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.

摘要翻译： 本发明涉及摄像机模块。 相机模块包括具有顶侧，底侧和透明区域的电路板，电路板具有导体。 该模块还包括设置在电路板的底侧上的传感器单元，并且传感器单元包括半导体芯片，该半导体芯片具有前表面，该前表面包括与透明区域对准的向前方向的成像区域和适于 产生表示入射到成像区域上的光学图像的信号。 模块还包括从电路板的底侧突出的柱，其中至少一些柱是具有底表面的接合柱，并且至少一些底表面邻接传感器单元的接合表面。

公开(公告)号：US20060138626A1

公开(公告)日：2006-06-29

申请号：US11025432

申请日：2004-12-29

申请人： Victor Liew ,  Giles Humpston

发明人： Victor Liew ,  Giles Humpston

IPC分类号： H01L23/06

CPC分类号： H01L23/49822 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.

摘要翻译： 微电子封装包括微电子器件，单一陶瓷衬底和多个端子。 微电子器件在其上具有前表面和多个电触点。 衬底具有第一和第二相对表面。 窗口从第一表面上的第一开口沿侧壁延伸到第二表面上的第二开口。 可以在侧壁和/或第二基板表面上设置导电区域。 衬底位于器件和端子之间，使得衬底的第一表面面向器件的前表面，并且第一开口与前器件表面上的至少一个触点对准。 还提供了用于生产微电子封装和晶片级组件的方法。

公开(公告)号：US20060108402A1

公开(公告)日：2006-05-25

申请号：US10993962

申请日：2004-11-19

申请人： Richard Crisp ,  Giles Humpston

发明人： Richard Crisp ,  Giles Humpston

IPC分类号： B23K31/02

CPC分类号： H01L21/6835 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H05K3/3484 ,  H05K2203/0338 ,  H05K2203/043

摘要： A method of forming and applying a solder mass comprised of depositing solder paste containing a carrier and a solder onto a first substrate, not wettable by said solder; reflowing the solder paste on the first substrate to cause the solder to coalesce into a solder mass; and transferring the solder mass from the first substrate to a second substrate.

摘要翻译： 一种形成和施加焊料块的方法，所述焊料质量包括将包含载体和焊料的焊膏沉积到第一衬底上，所述焊料不能被所述焊料润湿; 在第一基板上回流焊膏以使焊料聚结成焊料; 以及将所述焊料块从所述第一基板转移到第二基板。

公开(公告)号：US20050248680A1

公开(公告)日：2005-11-10

申请号：US11121434

申请日：2005-05-04

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： G02B7/02 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225

CPC分类号： H04N5/2254 ,  G02B7/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.

摘要翻译： 电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。 光学单元（50）包括一个或多个光学元件，例如透镜（58）。 光学单元具有接合特征（64），其接合传感器单元上​​的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。