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158 条记录 (耗时 0.057 秒)

    Multilayer printed wiring board with filled viahole structure
    41.
    发明授权
    Multilayer printed wiring board with filled viahole structure 有权
    多层印刷线路板，带有通孔结构

    公开(公告)号：US07622183B2

    公开(公告)日：2009-11-24

    申请号：US11385904

    申请日：2006-03-22

    申请人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

    发明人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

    IPC分类号： B32B3/00

    CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

    摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

    摘要翻译： 本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半，小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

    OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION
    47.
    发明申请
    OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION 有权
    光路转换构件，多层印刷电路板和光通信装置

    公开(公告)号：US20070297729A1

    公开(公告)日：2007-12-27

    申请号：US11763670

    申请日：2007-06-15

    申请人： Hiroaki KODAMA ,  Motoo Asai ,  Kazuhito Yamada

    发明人： Hiroaki KODAMA ,  Motoo Asai ,  Kazuhito Yamada

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4214 ,  G02B6/42 ,  G02B6/43 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H05K1/0274 ,  H05K3/4602 ,  H01L2224/05599

    摘要： A device for optical communication comprising; at least a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal; and an optical element or a package substrate on which an optical element is mounted, wherein an optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit, the optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface, and the lens is provided at least one position selected from the entrance surface, the exit surface, and inside of the optical path conversion mirror.

    摘要翻译： 一种用于光通信的装置，包括： 至少形成并层压的导体电路和绝缘层，用于发送光信号的光路和光路; 以及安装有光学元件的光学元件或封装基板，其中光路转换部件设置在用于发送光信号的光路上，以便在光学元件和光学电路之间传输光学信号， 光路转换构件包括具有入射面，出射面和反射面的透镜和光路转换镜，并且透镜设置在从入射面，出射面和光学内侧的至少一个位置 路径转换镜。

    Multilayer printed circuit board
    49.
    发明授权
    Multilayer printed circuit board 失效
    多层印刷电路板

    公开(公告)号：US06831234B1

    公开(公告)日：2004-12-14

    申请号：US08871890

    申请日：1997-06-09

    申请人： Motoo Asai ,  Yoichiro Kawamura

    发明人： Motoo Asai ,  Yoichiro Kawamura

    IPC分类号： H01R1204

    CPC分类号： H05K1/112 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3478 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/043 ,  H01L2924/00

    摘要： Multilayer printed circuit board includes a core substrate and multilayer wiring layers formed on the core substrate by alternately laminating interlaminar insulating layer and conductor circuit. The multilayer printed circuit board further includes a group of solder pads having solder bumps planarly arranged on an outermost surface of the multilayer wiring layers. Solder pads located in at least one and up to five rows from an outer position of the solder pad group have flat pads connected to a conductor pattern located on the outermost surface and have solder bumps formed on surfaces of the solder pads, while solder pads other than the solder pads connected to the conductor pattern on the outermost surface form an inner layer pad group. Solder pads of the inner layer pad group are connected to viaholes connected to flat inner layer pads located on one of a first inner layer and at least one further inner layer with solder bumps being formed in recess portions of the viaholes, the inner layer pad group comprising solder pads located in at least one and up to five rows from an outer position of the inner layer pad group that are connected through the viaholes to flat pads connected to conductor patterns on the first inner layer, while solder pads of the inner layer pad group other than the solder pads connected to flat pads connected to conductor patterns on the first inner layer are connected through the viaholes to flat pads located on the at least one further inner layer located inward relative to the first inner layer.

    摘要翻译： 多层印刷电路板包括通过交替层叠层间绝缘层和导体电路而在芯基板上形成的芯基板和多层布线层。 多层印刷电路板还包括一组焊盘，其具有平坦地布置在多层布线层的最外表面上的焊料凸块。 位于焊盘组的外部位置至少一排至五行的焊盘具有连接到位于最外表面上的导体图案的平坦焊盘，并且在焊盘表面上形成焊料凸块，而焊盘其它 比连接到最表面上的导体图案的焊盘形成内层焊盘组。 内层焊盘组的焊盘连接到连接到位于第一内层和至少一个另外的内层中的一个上的平坦内层焊盘的通孔，其中焊料凸块形成在通孔的凹部中，内层焊盘组 包括位于从内层焊盘组的外部位置至少一行至多五行的焊盘，所述焊盘通过通孔连接到连接到第一内层上的导体图案的平垫，而内层焊盘的焊盘 连接到连接到第一内层上的导体图案的平坦焊盘的焊盘以外的焊盘通过穿孔连接到位于相对于第一内层位于内部的至少一个另外的内层上的平垫。