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公开(公告)号：US08329423B2
公开(公告)日：2012-12-11
申请号：US13011514
申请日：2011-01-21
IPC分类号： G01N33/553
CPC分类号： C12Q1/37 , B82Y30/00 , G01N33/54373
摘要： The present invention provides liquid crystal-based devices and methods for bioagent detection. In certain aspects, the present invention is directed to devices and methods utilizing liquid crystals and membranes containing polymerized targets that can report the presence of bioagents including, but not limited to, enzymes, antibodies, and toxins.
摘要翻译： 本发明提供了基于液晶的装置和用于生物鉴定检测的方法。 在某些方面，本发明涉及利用液晶和含有聚合靶的膜的装置和方法，所述聚合靶可以报告生物制剂的存在，包括但不限于酶，抗体和毒素。
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公开(公告)号：US20110055145A1
公开(公告)日：2011-03-03
申请号：US12799217
申请日：2010-04-19
申请人： Eric A. Johnson , Don Kainer , Adrian Fan
发明人： Eric A. Johnson , Don Kainer , Adrian Fan
IPC分类号： G06N5/02
CPC分类号： G06K9/6284 , G06K9/6223
摘要： An Insightful Dimensional Clustering (IDC) application is disclosed. The insightful dimensional clustering engine may perform various functions, including, performing an iterative process to determine the identity of dimensions that are important to the tag and the identity of the segment of a population having a target behavior, segmenting the population within the data space into clusters, analyzing the resulting clusters for a high tag concentration, and displaying the resulting clusters to name a few. The insightful dimensional clustering engine may be implemented as one or more processes operating on a computer or server, or may be a specially adapted computer or hardware device configured to perform the one or more operations described herein.
摘要翻译： 披露了一个深层次的维度聚类（IDC）应用程序。 有洞察力的维度聚类引擎可以执行各种功能，包括执行迭代过程以确定对标签重要的维度的身份以及具有目标行为的群体的段的身份，将数据空间内的群体分段成 集群，分析产生的集群以获得高标签集中，并显示所生成的集群等等。 有见识的维度聚类引擎可以被实现为在计算机或服务器上操作的一个或多个进程，或者可以是经配置以执行本文所述的一个或多个操作的经特别调整的计算机或硬件设备。
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43.发明授权公开(公告)号：US07807209B1
公开(公告)日：2010-10-05
申请号：US11469192
申请日：2006-08-31
IPC分类号： A23L1/212
摘要： A composition comprising a watermelon juice includes the following colorimeter values, an L value of about 19 or greater, an A value of about 32 or greater, a B value of about 24 or greater. Watermelon juice extract is typically free of any added, artificial colorants or sweeteners. The present invention also generally includes a food composition that utilizes a clarified watermelon juice or a cloudy watermelon juice, where the cloudy watermelon juice has the following colorimeter values, an L value of about 19 or greater, an A value of about 32 or greater, a B value of about 24 or greater, and the clarified watermelon juice is derived from the cloudy watermelon juice. The food compositions incorporating the watermelon juice are usually a beverage, a sorbet, a yogurt, a sauce, a salad dressing, a fruit salad, a dessert, a bakery filling, a candy, or a bar mix.
摘要翻译： 包含西瓜汁的组合物包括以下比色计值，约19或更大的L值，约32或更大的A值，约24或更大的B值。 西瓜汁提取物通常不含任何添加的人造色素或甜味剂。 本发明还通常包括使用澄清的西瓜汁或混浊西瓜汁的食物组合物，其中混浊西瓜汁具有以下色度计值，约19或更大的L值，约32或更大的A值， 约24或更大的B值，澄清的西瓜汁源自多云西瓜汁。 结合西瓜汁的食品组合物通常是饮料，冰糕，酸奶，酱汁，沙拉酱，水果沙拉，甜点，面包店馅，糖果或酒吧混合物。
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公开(公告)号：US06984286B2
公开(公告)日：2006-01-10
申请号：US10338963
申请日：2003-01-08
IPC分类号： B32B31/20
CPC分类号： H01L23/4334 , H01L21/4882 , H01L21/563 , H01L23/3735 , H01L24/32 , H01L2224/73203 , H01L2224/83951 , H01L2924/01006 , H01L2924/01033 , H01L2924/351 , Y10T29/4913 , H01L2924/3512 , H01L2924/00
摘要： An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
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公开(公告)号：US06933619B2
公开(公告)日：2005-08-23
申请号：US10273786
申请日：2002-10-18
申请人： David V. Caletka , Eric A. Johnson
发明人： David V. Caletka , Eric A. Johnson
IPC分类号： H01L23/31 , H01L23/433 , H01L23/28
CPC分类号： H01L23/3128 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/0102 , H01L2924/15311 , H01L2924/00
摘要： An electronic package and method of making same in which a thermally conductive member is in thermally conductive communication with a semiconductor chip encapsulated within a dielectric material that surrounds portions of a thermally conductive member, semiconductor chip, and a predefined portion of a circuitized substrate. The present invention's thermally conductive member includes two portions of different bending stiffness to assure reduced interfacial stresses between the semiconductor chip and the circuitized substrate.
摘要翻译： 一种电子封装及其制造方法，其中导热构件与封装在介电材料内的半导体芯片导热连通，所述绝缘材料围绕导热构件，半导体芯片和电路化基板的预定部分。 本发明的导热构件包括两个不同弯曲刚度的部分，以确保半导体芯片和电路化衬底之间的界面应力降低。
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公开(公告)号：US06665186B1
公开(公告)日：2003-12-16
申请号：US10280642
申请日：2002-10-24
IPC分类号： H05K720
CPC分类号： H01L23/42 , H01L21/563 , H01L23/16 , H01L23/473 , H01L2224/32225 , H01L2224/32245
摘要： A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.
摘要翻译： 散热系统利用高导电性液体金属的薄层来为诸如半导体芯片的电子子组件提供冷却。 液体金属优选是镓或其合金，其将热量从芯片传递到散热器或散热器。 该系统包括一个或多个通气口，其允许填充和排出由液体占据的空间。 它还使用柔性密封件，例如O形圈或用保持环保持在适当位置的膜，或密封填充通气口的塞子。 密封件弯曲以适应液体的膨胀和收缩，以及从液相到固相的相变。
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公开(公告)号：US06623775B2
公开(公告)日：2003-09-23
申请号：US09809146
申请日：2001-03-15
申请人： Eric A. Johnson , Gerhard J. Haas
发明人： Eric A. Johnson , Gerhard J. Haas
IPC分类号： A23L33508
CPC分类号： A61K36/185 , Y02A50/469 , Y10S435/842
摘要： The present invention relates to the discovery that hop extract is useful as an antibacterial agent against the dangerous pathogens Clostridium botulinum, Clostridium difficile, and Helicobacter pylori at levels below that at which a flavor from the acids contained therein is objectionable. More specifically, a process and associated product is described herein, comprising applying a solution of hop extract to a food, beverage or other medium so that the final concentration of hop ingredients is about 1 ppm or higher in order to inhibit the growth of Clostridium botulinum, Clostridium difficile, and/or Helicobacter pylori.
摘要翻译： 本发明涉及一种发现，啤酒花提取物可用作抗危险病原体的抗菌剂，肉毒杆菌，艰难梭菌和幽门螺杆菌的水平低于其中含有的酸的味道是令人反感的。 更具体地，本文描述了方法和相关产品，包括将啤酒花提取物的溶液施加到食品，饮料或其它介质，使得啤酒花成分的最终浓度为约1ppm或更高以抑制肉毒杆菌的生长 ，艰难梭菌和/或幽门螺杆菌。
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48.发明授权公开(公告)号：US06594481B1
公开(公告)日：2003-07-15
申请号：US08367972
申请日：1994-12-30
申请人： Eric A. Johnson , Mark J. Handzel
发明人： Eric A. Johnson , Mark J. Handzel
IPC分类号： H04Q734
CPC分类号： H04W12/12 , H04L63/1416 , H04L63/1425 , H04M3/38 , H04M15/00 , H04M15/41 , H04M15/47 , H04M15/88 , H04M15/887 , H04M17/00 , H04M2203/6027 , H04M2215/0116 , H04M2215/014 , H04M2215/0148 , H04M2215/0164 , H04M2215/32 , H04W4/24 , H04W12/06 , H04W60/00
摘要： The present invention provides an apparatus for credit based management of a telecommunication system. One embodiment of the apparatus includes an interface for communicating credit information on a particular subscriber and for receiving call records for the particular subscriber that are derived from a switch which establishes connections between telecommunication devices. A credit limit device then utilizes the credit information to establish a credit limit for the subscriber. The apparatus also includes a device for comparing the particular subscriber's call usage to a credit limit established for the subscriber based on information obtained from the credit bureau. An output device is used to provide an indication that the subscriber has exceeded their credit limit. Another embodiment of the apparatus, includes a device for, upon expiration of a predetermined time period, contacting the credit bureau to obtain a new credit score for a subscriber and use this score to update the subscriber's credit limit.
摘要翻译： 本发明提供了一种用于电信系统的信用管理的装置。 该装置的一个实施例包括用于在特定订户上传送信用信息的接口，以及用于接收从建立电信设备之间的连接的交换机导出的特定用户的呼叫记录。 信用限额设备然后利用信用信息为用户建立信用限额。 该装置还包括一个装置，用于根据从信用局获得的信息将特定用户的呼叫使用量与为用户建立的信用限额进行比较。 输出设备用于提供用户已经超过其信用限额的指示。 该装置的另一实施例包括一种装置，用于在预定时间段期满后，联系信用局以获得用户的新信用评分，并使用该分数来更新用户的信用限额。
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公开(公告)号：US06541857B2
公开(公告)日：2003-04-01
申请号：US09754782
申请日：2001-01-04
申请人： David V. Caletka , Eric A. Johnson
发明人： David V. Caletka , Eric A. Johnson
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L23/49816 , H01L23/49838 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/094 , H05K2201/0989 , H05K2201/099 , Y02P70/613 , H01L2924/00
摘要： A method of forming BGA interconnections having improved fatigue life is disclosed. In particular, a combination of mask-defined and pad-defined solder joints are selectively positioned within the BGA package. The mask-defined solder joints possess a high equilibrium height, which forces the pad-defined solder joints to elongate, thereby making the pad-defined solder joints more compliant. Further, the pad-defined solder joints possess a slightly longer fatigue life because the stress concentrations found in the mask-defined solder joints are not present in the pad-defined solder joints. Therefore, the fatigue life of BGA packages is increased by implementing a majority of mask-defined solder joints to maintain a high equilibrium height, and selectively placing pad-defined solder joints in high stress areas of the BGA package.
摘要翻译： 公开了一种形成具有改善的疲劳寿命的BGA互连的方法。 特别地，掩模限定和限定焊点的组合被选择性地定位在BGA封装内。 掩模定义的焊点具有高的平衡高度，这迫使焊盘限定的焊点伸长，从而使焊盘限定的焊点更顺应。 此外，焊盘限定的焊点具有稍长的疲劳寿命，因为在焊盘限定的焊点中不存在在掩模限定的焊点中发现的应力集中。 因此，通过实施大多数掩模定义的焊点以保持高平衡高度，并且将焊盘限定的焊点选择性地放置在BGA封装的高应力区域中，从而增加了BGA封装的疲劳寿命。
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公开(公告)号：US06507116B1
公开(公告)日：2003-01-14
申请号：US09430075
申请日：1999-10-29
申请人： David V. Caletka , Eric A. Johnson
发明人： David V. Caletka , Eric A. Johnson
IPC分类号： H01C2848
CPC分类号： H01L23/3128 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/0102 , H01L2924/15311 , H01L2924/00
摘要： An electronic package and method of making same in which a thermally conductive member is in thermally conductive communication with a semiconductor chip encapsulated within a dielectric material that surrounds portions of a thermally conductive member, semiconductor chip, and a predefined portion of a circuitized substrate. The present invention's thermally conductive member includes two portions of different bending stiffness to assure reduced interfacial stresses between the semiconductor chip and the circuitized substrate.
摘要翻译： 一种电子封装及其制造方法，其中导热构件与封装在介电材料内的半导体芯片导热连通，所述绝缘材料围绕导热构件，半导体芯片和电路化基板的预定部分。 本发明的导热构件包括两个不同弯曲刚度的部分，以确保半导体芯片和电路化衬底之间的界面应力降低。
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