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    Channelization for dispersion limited waveguide communication channels
    41.
    发明授权
    Channelization for dispersion limited waveguide communication channels 有权

    公开(公告)号：US10277322B2

    公开(公告)日：2019-04-30

    申请号：US15965637

    申请日：2018-04-27

    Applicant: Intel Corporation

    Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

    IPC: H04B10/00 ,  H04B10/2575 ,  H04B10/2513 ,  H04J14/00

    Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

    Waveguide connector with slot launcher
    42.
    发明授权
    Waveguide connector with slot launcher 有权

    公开(公告)号：US10256521B2

    公开(公告)日：2019-04-09

    申请号：US15280823

    申请日：2016-09-29

    Applicant: Intel Corporation

    Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Telesphor Kamgaing

    IPC: H01P5/10 ,  H01P11/00 ,  H01P5/107

    Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

    PACKAGE STRUCTURES INCLUDING DISCRETE ANTENNAS ASSEMBLED ON A DEVICE
    46.
    发明申请
    PACKAGE STRUCTURES INCLUDING DISCRETE ANTENNAS ASSEMBLED ON A DEVICE 有权
    包装结构包括在装置上组装的离散天线

    公开(公告)号：US20160043471A1

    公开(公告)日：2016-02-11

    申请号：US14918508

    申请日：2015-10-20

    Applicant: Intel Corporation

    Inventor： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

    IPC: H01Q9/04 ,  H01Q21/00 ,  H01Q1/52

    CPC classification number: H01Q9/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P11/00 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q21/0006 ,  Y10T29/49018

    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

    Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括形成包括设置在设备的背侧的分立天线的封装结构，其中分立天线包括天线基板，通过天线基板垂直设置的通过天线基板。 垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

    Semiconductor package including a modular side radiating waveguide launcher
    49.
    发明授权
    Semiconductor package including a modular side radiating waveguide launcher 有权

    公开(公告)号：US11830831B2

    公开(公告)日：2023-11-28

    申请号：US16327810

    申请日：2016-09-23

    Applicant: INTEL CORPORATION

    Inventor： Georgios Dogiamis ,  Sasha Oster ,  Johanna Swan ,  Shawna Liff ,  Adel Elsherbini ,  Telesphor Kamgaing ,  Aleksandar Aleksov

    IPC: H01L23/66 ,  H01P3/12

    CPC classification number: H01L23/66 ,  H01P3/121 ,  H01L2223/6627

    Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

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