公开(公告)号：US06749889B2

公开(公告)日：2004-06-15

申请号：US10409400

申请日：2003-04-07

申请人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： B05D512

CPC分类号： H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

摘要翻译： 在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着 部分从外围加强。 电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。 这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。

公开(公告)号：US06603207B2

公开(公告)日：2003-08-05

申请号：US10086210

申请日：2002-02-27

申请人： Yoshihiro Bessho

发明人： Yoshihiro Bessho

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L21/76888 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02163 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00

摘要： An electrode structure for a semiconductor device and a method for forming the electrode structure, and a mounted body including the semiconductor device are provided in which the semiconductor device can be easily connected to a circuit board with high reliability. An aluminum electrode is formed on an IC substrate. A passivation film is formed on the IC substrate so as to cover the peripheral portion of the aluminum electrode. A bump electrode is formed on the aluminum electrode by a wire bonding method. An aluminum oxide film is formed on the surface of the aluminum electrode that is exposed around the bump electrode. A conductive adhesive is applied as a bonding layer to the tip portion of the bump electrode of the semiconductor device by a transfer method or a printing method. The semiconductor device is aligned in the face-down state in such a manner that the bump electrode abuts on a terminal electrode of a circuit board, and is provided on a circuit board. In this state, the conductive adhesive is hardened. A gap between the IC substrate and the circuit board is filled with an insulating resin.

公开(公告)号：US06518514B2

公开(公告)日：2003-02-11

申请号：US09928869

申请日：2001-08-13

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01R1204

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

公开(公告)号：US06488869B2

公开(公告)日：2002-12-03

申请号：US09056774

申请日：1998-04-08

申请人： Hiroaki Takezawa ,  Minehiro Itagaki ,  Yoshihiro Bessho

发明人： Hiroaki Takezawa ,  Minehiro Itagaki ,  Yoshihiro Bessho

IPC分类号： H01B102

CPC分类号： H05K1/095 ,  H01B1/22 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/10636 ,  H05K2203/121 ,  Y02P70/611 ,  Y10T428/24917 ,  Y10T428/3192

摘要： A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.

摘要翻译： 导电糊具有金属颗粒表面涂覆有厚度小于10nm且在所述金属颗粒上不具有自发氧化膜的相同金属的复合物的导电颗粒和主要由绝缘树脂构成的粘合剂。

公开(公告)号：US06452280B1

公开(公告)日：2002-09-17

申请号：US09117695

申请日：1998-08-04

申请人： Tsukasa Shiraishi ,  Yoshihiro Bessho

发明人： Tsukasa Shiraishi ,  Yoshihiro Bessho

IPC分类号： H01L2352

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/75 ,  H01L2224/05124 ,  H01L2224/05644 ,  H01L2224/05671 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/17 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00014

摘要： A semiconductor apparatus in which the height of the projected electrode (4) formed on the semiconductor element (1) is deformed plastically so as to unify the distance of the protruding surface of the projected electrode (4) and the surface of the electrode terminal (7) at the side of the circuit substrate (5), and the semiconductor element and the circuit substrate are connected electrically with reliability. A method for producing the semiconductor apparatus also is disclosed. After the semiconductor element (1) is positioned on the predetermined part of the circuit substrate (5), the projected electrode (4) is deformed plastically by pushing the semiconductor element (1) from the back and the height of the projected electrode (4) is processed appropriately. According to the method for producing the semiconductor apparatus, even if there is irregularity of the height of the surface of the electrode terminal (7) formed on the circuit substrate (5) which connects with the semiconductor element (1), the semiconductor element (1) and the circuit substrate (5) can be connected electrically with reliability.

摘要翻译： 形成在半导体元件（1）上的突出电极（4）的高度塑性变形的半导体装置，以将突出的电极（4）的突出表面与电极端子的表面 7），电路基板（5）的一侧，半导体元件和电路基板电连接的可靠性。 还公开了一种半导体装置的制造方法。 在将半导体元件（1）定位在电路基板（5）的预定部分上之后，通过从后部推出半导体元件（1）并将突出的电极（4）的高度 ）被适当地处理。 根据半导体装置的制造方法，即使形成在与半导体元件（1）连接的电路基板（5）上的电极端子（7）的表面高度不规则，半导体元件 1），并且电路基板（5）可以可靠地电连接。

公开(公告)号：US06387794B2

公开(公告)日：2002-05-14

申请号：US09197334

申请日：1998-11-19

申请人： Yoshihiro Bessho

发明人： Yoshihiro Bessho

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L21/76888 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02163 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00

摘要： An electrode structure for a semiconductor device and a method for forming the electrode structure, and a mounted body including the semiconductor device are provided in which the semiconductor device can be easily connected to a circuit board with high reliability. An aluminum electrode is formed on an IC substrate. A passivation film is formed on the IC substrate so as to cover the peripheral portion of the aluminum electrode. A bump electrode is formed on the aluminum electrode by a wire bonding method. An aluminum oxide film is formed on the surface of the aluminum electrode that is exposed around the bump electrode. A conductive adhesive is applied as a bonding layer to the tip portion of the bump electrode of the semiconductor device by a transfer method or a printing method. The semiconductor device is aligned in the face-down state in such a manner that the bump electrode abuts on a terminal electrode of a circuit board, and is provided on a circuit board. In this state, the conductive adhesive is hardened. A gap between the IC substrate and the circuit board is filled with an insulating resin.

摘要翻译： 提供了一种用于半导体器件的电极结构和用于形成电极结构的方法，以及包括半导体器件的安装体，其中半导体器件可以容易地以高可靠性连接到电路板。 在IC基板上形成铝电极。 在IC基板上形成钝化膜，以覆盖铝电极的周边部分。 通过引线接合方法在铝电极上形成凸起电极。 在暴露在凸块电极周围的铝电极的表面上形成氧化铝膜。 通过转印方法或印刷方法将导电粘合剂作为结合层施加到半导体器件的凸块电极的末端部分。 半导体器件以面对齐状态对准，使得凸块电极邻接电路板的端子电极，并且设置在电路板上。 在这种状态下，导电粘合剂硬化。 IC基板和电路板之间的间隙填充有绝缘树脂。

公开(公告)号：US06376051B1

公开(公告)日：2002-04-23

申请号：US09519984

申请日：2000-03-07

申请人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： B32B300

CPC分类号： H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

公开(公告)号：US06310393B1

公开(公告)日：2001-10-30

申请号：US09412593

申请日：1999-10-05

申请人： Tetsuyosi Ogura ,  Yukihiro Fukumoto ,  Hideki Iwaki ,  Yutaka Taguchi ,  Yoshihiro Bessho

发明人： Tetsuyosi Ogura ,  Yukihiro Fukumoto ,  Hideki Iwaki ,  Yutaka Taguchi ,  Yoshihiro Bessho

IPC分类号： H01L2348

CPC分类号： H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The semiconductor package of this invention includes: a semiconductor element having a power supply terminal, a ground terminal, and an output terminal; an inductance; and a capacitance. One of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element, and the other terminal is connected to the ground terminal of the semiconductor element. The ground terminal of the semiconductor element is connected to a ground terminal of the semiconductor package, the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package via the inductance, and the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.

摘要翻译： 本发明的半导体封装包括：具有电源端子，接地端子和输出端子的半导体元件; 电感; 和电容。 电容的相对端子之一连接到半导体元件的电源端子，另一个端子连接到半导体元件的接地端子。 半导体元件的接地端子与半导体封装的接地端子连接，半导体元件的电源端子通过电感连接到半导体封装的电源端子，半导体元件的输出端子 连接到半导体封装的输出端子。

公开(公告)号：US5651179A

公开(公告)日：1997-07-29

申请号：US731521

申请日：1996-10-15

申请人： Yoshihiro Bessho ,  Yoshihiro Tomura

发明人： Yoshihiro Bessho ,  Yoshihiro Tomura

IPC分类号： H01L21/56 ,  H01L23/485 ,  H05K3/30

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L24/13 ,  H01L24/28 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method for mounting a semiconductor device on a circuit board which includes the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than the plasticizing temperature of the thermoplastic conductive adhesive is disclosed.

摘要翻译： 一种将半导体器件安装在电路板上的方法，包括以下步骤：通过热塑性导电粘合剂将半导体器件的端子电极连接到电路板的连接电极; 允许热固性树脂填充半导体器件和电路板之间的间隙; 并且公开了在等于或高于热塑性导电粘合剂的塑化温度的温度下固化热固性树脂。

公开(公告)号：US5547530A

公开(公告)日：1996-08-20

申请号：US189482

申请日：1994-01-31

申请人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Kazuhiro Miura

发明人： Yoshifumi Nakamura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Kazuhiro Miura

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  B32B31/04 ,  B32B31/12 ,  B32B31/24 ,  C04B41/81

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L21/4867 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49163 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.

摘要翻译： 本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成膏的层压体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。