-
公开(公告)号：US20140252401A1
公开(公告)日：2014-09-11
申请号：US14196754
申请日：2014-03-04
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Yoshitaka BANDO , Hiroto TAMAKI
IPC: H01L33/62 , H01L23/495
CPC classification number: H01L33/62 , H01L23/495 , H01L2924/0002 , H01L2924/00
Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.
Abstract translation: 可以承受与发光元件的直接接合的高质量的引线框架和利用引线框架的高可靠性的发光器件。 引线框架包括作为至少第一金属层和第二金属层的堆叠层的包覆材料，由与第一金属层的金属不同的金属制成的第二金属层和贯通部。 在贯通部中，第一金属层的端面和第二金属层的端面被电镀层覆盖。 第一金属层或第二金属层的端面比另一金属层的端面进一步向贯通部突出。
-
公开(公告)号：US20140042488A1
公开(公告)日：2014-02-13
申请号：US14059243
申请日：2013-10-21
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
IPC: H01L33/48 , H01L31/0203
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
-
公开(公告)号：US20190140152A1
公开(公告)日：2019-05-09
申请号：US16218292
申请日：2018-12-12
Applicant: NICHIA CORPORATION
Inventor： Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
-
公开(公告)号：US20180006205A1
公开(公告)日：2018-01-04
申请号：US15692542
申请日：2017-08-31
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
-
公开(公告)号：US20170345978A1
公开(公告)日：2017-11-30
申请号：US15680212
申请日：2017-08-18
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI
CPC classification number: H01L33/507 , H01L24/97 , H01L33/505 , H01L33/54 , H01L2224/16 , H01L2924/181 , H01L2933/0041 , H01L2933/005 , H01L2924/00012
Abstract: A light emitting device including a light emitting element including an element substrate and semiconductor layers formed thereon, an encapsulating member that covers the sides of the light emitting element and forms a cavity at the upper surface of the light emitting element, and a wavelength-conversion layer in the cavity. The wavelength-conversion layer being capable of converting that converts the wavelength of light emitted by the light emitting element. The wavelength-conversion layer includes a first wavelength-conversion sub layer which is disposed at the upper surface of the light emitting element, and a second wavelength-conversion sub layer which is disposed on the first wavelength-conversion sub layer. The first wavelength-conversion sub layer includes first phosphors having a first resistance to environmental exposure, and the second wavelength-conversion sub layer includes second phosphors having a second resistance which is higher than that of the first wavelength-conversion sub layer.
-
Patent Agency Ranking
公开(公告)号：US20170213941A1
公开(公告)日：2017-07-27
申请号：US15483269
申请日：2017-04-10
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L33/486 , H01L33/501 , H01L33/505 , H01L33/508 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
Abstract: A method of manufacturing a light emitting device including: forming a supporting body on a mounting surface of each of semiconductor light emitting elements; arranging the semiconductor light emitting elements to be spaced apart from each other by a predetermined distance; and forming a wavelength conversion layer to continuously cover an upper surface and side surfaces of at least one of the semiconductor light emitting elements. The forming the wavelength conversion layer includes spraying a slurry provided by mixing particles of a wavelength conversion member and a thermosetting resin in a solvent onto the upper surface and the side surfaces of the semiconductor light emitting element, so that a thickness of the wavelength conversion layer at a lower portion of the side surfaces of the supporting body is smaller than the thickness on the upper surface and the side surfaces of the semiconductor light emitting element.
-
公开(公告)号：US20170033267A1
公开(公告)日：2017-02-02
申请号：US15220681
申请日：2016-07-27
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Yoshiki SATO , Yoichi BANDO
CPC classification number: H01L33/52 , H01L33/46 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L2224/16225 , H01L2224/73253 , H01L2933/0025 , H01L2933/0041 , H01L2933/005
Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.
Abstract translation: 提供了一种发光器件。 发光装置包括发光元件，波长转换构件，透光构件，粘合构件和光反射构件。 波长转换构件具有上表面和侧表面，包含荧光物质，并且被放置在发光元件上。 透光构件覆盖波长转换构件的上表面。 粘合剂构件插入在发光元件和波长转换构件之间，并且覆盖波长转换构件的侧表面。 光反射构件通过粘合构件覆盖波长转换构件的侧表面。
-
公开(公告)号：US20160095184A1
公开(公告)日：2016-03-31
申请号：US14870007
申请日：2015-09-30
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Hiroto TAMAKI
CPC classification number: H05B33/22 , F21V13/08 , H01L33/20 , H01L33/486 , H01L33/504 , H01L33/505 , H01L33/60 , H01L2924/18161
Abstract: A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.
Abstract translation: 发光装置包括基座，发光元件，波长转换构件和光反射构件。 基座具有基座上表面。 发光元件设置在基底上，并且包括半导体层，透光基板和凹部。 半导体层设置在基底上，使得半导体下表面面向基底的基底上表面。 透光基板具有基板上表面，与基板上表面相对的基板下表面，以及基板上表面和基板下表面之间的基板侧面。 透光基板设置在半导体层上，使得基板下表面接触半导体层的半导体上表面。 凹部设置在透光基板的基板上表面上。 波长转换构件设置在凹部中。
-
公开(公告)号：US20160093780A1
公开(公告)日：2016-03-31
申请号：US14866317
申请日：2015-09-25
Applicant: Nichia Corporation
Inventor： Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/60 , H01L33/50 , H01L2224/73253 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
Abstract translation: 发光器件包括半导体发光元件; 以及具有多层结构并覆盖半导体发光元件的侧面的光反射构件。 光反射构件包括：设置在内部半导体发光元件侧的第一层，第一层包括含有光反射物质的透光树脂，以及设置成与第一层的外侧接触的第二层 第二层包括含有比第一层低的含量的光反射物质的透光树脂。
-
公开(公告)号：US20150340569A1
公开(公告)日：2015-11-26
申请号：US14710723
申请日：2015-05-13
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/486 , H01L24/97 , H01L33/50 , H01L33/507 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a light emitting element connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting element, the base material having a protruding component on the second main face, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.
Abstract translation: 发光装置具有配置有基材的基体和从第一主面到与第一主面相反的一侧的第二主面配置的一对连接端子， 连接到第一主面上的连接端子的发光元件; 以及覆盖发光元件的侧面的光反射部件，所述基材在所述第二主面上具有突出部，所述连接端子从所述第二主面的所述第二主面设置在所述第一主面上 并且在第一主面的两侧部分地从光反射部件露出。
-
-
-
-
-
-
-
-
-
Search Results
53
records
(took 0.028 seconds)
