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    LIGHT EMITTING DEVICE
    42.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20170331021A1

    公开(公告)日：2017-11-16

    申请号：US15667599

    申请日：2017-08-02

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Jong Hyeon CHAE ,  So Ra LEE ,  Kyung Hee YE

    IPC: H01L33/62 ,  H01L33/36

    CPC classification number: H01L33/62 ,  H01L33/08 ,  H01L33/36 ,  H01L33/38

    Abstract: A light emitting device includes a first bonding pad configured to be mounted to a substrate, a first electrode electrically connected to the first bonding pad, a first conductive type semiconductor layer having a middle area disposed between two, opposing end areas, a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer and connected to the first electrode; and a first contact portion and a plurality of second contact portions disposed on the first conductive type semiconductor layer, in which the first contact portion is disposed adjacent one end area of the first conductive type semiconductor layer, the second contact portions are disposed in the middle area of the first conductive type semiconductor layer, and the first bonding pad exposes at least one of the second contact portion.

    LIGHT EMITTING DIODE FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME
    46.
    发明申请
    LIGHT EMITTING DIODE FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME 有权

    公开(公告)号：US20250070100A1

    公开(公告)日：2025-02-27

    申请号：US18940305

    申请日：2024-11-07

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Jong Hyeon CHAE ,  Chang Yeon KIM ,  Ho Joon LEE ,  Seong Gyu JANG ,  Chung Hoon LEE ,  Dae Sung CHO

    IPC: H01L25/13 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/38 ,  H01L33/40 ,  H01L33/50 ,  H01L33/62

    Abstract: A light emitting device including a first LED sub-unit having a thickness in a first direction, a second LED sub-unit disposed on a portion of the first LED sub-unit in the first direction, each of the first and second LED sub-units comprising a first-type semiconductor layer, a second-type semiconductor layer, and an active layer, a reflective electrode disposed adjacent to the first LED sub-unit and electrically connected to the first-type semiconductor layer of the first LED sub-unit, and a first ohmic electrode forming ohmic contact with the second-type semiconductor layer of the first LED sub-unit, in which the active layer of the first LED sub-unit is configured to generate light, includes AlxGa(1-x-y)InyP (0≤x≤1, 0≤y≤1), and overlaps the active layer of the second LED sub-unit in the first direction, and the active layer of the second LED sub-unit includes the same material as the active layer of the first LED sub-unit.

    LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    47.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20250006869A1

    公开(公告)日：2025-01-02

    申请号：US18885554

    申请日：2024-09-13

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Chi Hyun IN ,  Jun Yong PARK ,  Kyu Ho LEE ,  Dae Woong Suh ,  Jong Hyeon CHAE ,  Chang Hoon KIM ,  Sung Hyun LEE

    IPC: H01L33/48 ,  H01L33/20 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62

    Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.

    LIGHT EMITTING DEVICE FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME
    48.
    发明公开
    LIGHT EMITTING DEVICE FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME 审中-公开

    公开(公告)号：US20240363600A1

    公开(公告)日：2024-10-31

    申请号：US18769385

    申请日：2024-07-11

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Seom Geun LEE ,  Seong-Kyu JANG ,  Yong Woo RYU ,  Jong Hyeon CHAE

    IPC: H01L25/075 ,  H01L33/42 ,  H01L33/62

    CPC classification number: H01L25/0756 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/62

    Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material.

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