公开(公告)号：US07303944B2

公开(公告)日：2007-12-04

申请号：US11332383

申请日：2006-01-12

申请人： Tian-An Chen ,  Daoqiang Lu

发明人： Tian-An Chen ,  Daoqiang Lu

IPC分类号： H01L23/24 ,  H01L21/98 ,  B23K35/363 ,  C08L93/04 ,  C09D193/04

CPC分类号： H01L23/293 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/36 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

摘要： Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device with the substrate. Underfill material may be included around the interconnect structure between the microelectronic device and the substrate. The underfill material may include an organic rosin acid moiety derived from an anhydride adduct of a rosin compound that was used as a fluxing agent. Methods of making such microelectronic packages using anhydride adducts of rosin compounds are also disclosed.

摘要翻译： 公开了使用新型助熔剂形成的微电子封装。 一方面，微电子封装可以包括微电子器件，衬底和包括将微电子器件与衬底耦合的焊料材料的互连结构。 底部填充材料可以包括在微电子器件和衬底之间的互连结构周围。 底部填充材料可以包括衍生自用作助熔剂的松香化合物的酸酐加合物的有机松香酸部分。 还公开了使用松香化合物的酸酐加合物制备这种微电子封装的方法。

公开(公告)号：US07218007B2

公开(公告)日：2007-05-15

申请号：US10950691

申请日：2004-09-28

申请人： Song-Hua Shi ,  Tian-An Chen ,  Jason Zhang ,  Katrina Certeza

发明人： Song-Hua Shi ,  Tian-An Chen ,  Jason Zhang ,  Katrina Certeza

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： C08K3/36 ,  C08K9/04 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/13111 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2924/00014

摘要： An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a space between the electronic device and the substrate. A weight percentage of the filler particles is at least about 60%. A particle size of at least 90 wt % of the filler particles is less than about 2 μm and/or the filler particles are coated by an organic coupling agent. Once the underfill material is fully cured, its coefficient of thermal expansion is no more than 30 PPM/° C., and its glass transition temperature is at least 100° C., and its adhesion to a passivation layer of the electronic device, to the substrate and to the electronic device at its edges is such that the electronic structure passes standardized reliability tests without delamination of the ball limiting metallurgy.

摘要翻译： 电子结构包括通过导电凸块和球限制冶金（BLM）耦合到衬底的电子器件。 具有填料颗粒的底部填充材料设置在电子器件和基板之间的空间中。 填料颗粒的重量百分比为至少约60％。 填料颗粒的至少90重量％的粒径小于约2μm，和/或填料颗粒被有机偶联剂包覆。 一旦底部填充材料完全固化，其热膨胀系数不超过30PPM /℃，其玻璃化转变温度至少为100℃，并且其与电子器件的钝化层的粘合力， 基板和其边缘处的电子设备使得电子结构通过标准化的可靠性测试，而不会限制极限冶金的分层。

公开(公告)号：US07179684B2

公开(公告)日：2007-02-20

申请号：US11099907

申请日：2005-04-05

申请人： Song-Hua Shi ,  Lejun Wang ,  Tian-An Chen

发明人： Song-Hua Shi ,  Lejun Wang ,  Tian-An Chen

IPC分类号： H01L21/00 ,  H01L21/58

CPC分类号： C08G73/02 ,  B32B27/08 ,  C08L79/02 ,  C09J161/34 ,  C09J179/04 ,  H01B3/303 ,  H01B3/38 ,  H01L21/563 ,  H01L23/293 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K2201/0269 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

公开(公告)号：US20060255432A1

公开(公告)日：2006-11-16

申请号：US11485078

申请日：2006-07-12

申请人： Robert Meagley ,  Kevin O'Brien ,  Tian-An Chen ,  Michael Goodner ,  James Powers ,  Huey-Chiang Liou

发明人： Robert Meagley ,  Kevin O'Brien ,  Tian-An Chen ,  Michael Goodner ,  James Powers ,  Huey-Chiang Liou

IPC分类号： H01L23/58

CPC分类号： H01L23/5222 ,  H01L21/02118 ,  H01L21/02134 ,  H01L21/02137 ,  H01L21/02164 ,  H01L21/0234 ,  H01L21/02351 ,  H01L21/312 ,  H01L21/76224 ,  H01L21/7682 ,  H01L21/76825 ,  H01L21/76826 ,  H01L21/76828 ,  H01L21/76829 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor structure may be covered with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity.

公开(公告)号：US20060243315A1

公开(公告)日：2006-11-02

申请号：US11118814

申请日：2005-04-29

申请人： Gregory Chrysler ,  Shriram Ramanathan ,  Tian-An Chen

发明人： Gregory Chrysler ,  Shriram Ramanathan ,  Tian-An Chen

IPC分类号： H01L35/34

CPC分类号： H01L23/38 ,  H01L35/32 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. Certain methods include forming a thermoelectric cooling (TEC) structure on a die, the TEC structure including a plurality of spaced apart TEC legs. A polymer is positioned between the spaced apart TEC legs of the TEC structure. The TEC structure may be positioned between the die and the heat spreader. In one method, a polymer in solid form is positioned on the TEC legs. The polymer in solid form is heated to a temperature sufficient so that a liquid polymer is formed, and the liquid polymer flows between the TEC legs. After being positioned between the TEC legs, the liquid polymer is solidified. Other embodiments are described and claimed.

摘要翻译： 实施例包括用于形成电子组件的电子组件和方法。 某些方法包括在模具上形成热电冷却（TEC）结构，TEC结构包括多个间隔开的TEC支腿。 聚合物位于TEC结构的间隔开的TEC腿之间。 TEC结构可以位于模具和散热器之间。 在一种方法中，固体形式的聚合物位于TEC腿上。 将固体形式的聚合物加热到足以形成液体聚合物的温度，并且液体聚合物在TEC腿之间流动。 在定位在TEC腿之间时，液体聚合物固化。 描述和要求保护其他实施例。

公开(公告)号：US20060138643A1

公开(公告)日：2006-06-29

申请号：US11024553

申请日：2004-12-28

申请人： Daoqiang Lu ,  Tian-An Chen ,  Mike Garner

发明人： Daoqiang Lu ,  Tian-An Chen ,  Mike Garner

IPC分类号： H01L21/48 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates to a semiconductor package containing a package substrate, integrated heat spreader, and semiconductor die. An underfill material is embedded in the semiconductor package serving both as underfill and sealant.

摘要翻译： 本发明涉及包含封装基板，集成散热器和半导体管芯的半导体封装。 底部填充材料嵌入半导体封装中，既用作底部填充剂和密封剂。

公开(公告)号：US20060128834A1

公开(公告)日：2006-06-15

申请号：US11332383

申请日：2006-01-12

申请人： Tian-An Chen ,  Daoqiang Lu

发明人： Tian-An Chen ,  Daoqiang Lu

IPC分类号： B23K35/34 ,  H05K3/00 ,  C08L99/00 ,  H01L23/48 ,  C08K5/09 ,  C08L93/00 ,  C09J4/00

CPC分类号： H01L23/293 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/36 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

摘要： An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group of a carboxylic acid attached at an acyl group of the organic rosin acid moiety. In another aspect, the anhydride adduct of the rosin compound contains a plurality of linked organic rosin acid moieties. Methods of using the underfill materials and packages formed by curing the underfill materials are also disclosed.

摘要翻译： 公开了含有松香化合物的酸酐加成物的底部填充材料，例如无流动的底部填充材料。 一方面，松香化合物的酸酐加成物含有有机松香酸部分和在有机松香酸部分的酰基上连接的羧酸的羟基的取代部分。 另一方面，松香化合物的酸酐加成物含有多个连接的有机松香酸部分。 还公开了使用底部填充材料和通过固化底部填充材料形成的包装的方法。

公开(公告)号：US20060060987A1

公开(公告)日：2006-03-23

申请号：US10949995

申请日：2004-09-23

申请人： Tian-An Chen ,  Daoqiang Lu

发明人： Tian-An Chen ,  Daoqiang Lu

IPC分类号： H01L23/48

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/01083 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/0401

摘要： Amine-based no-flow underfill materials and a method to produce flip-chip devices electrically bonded to a substrate are described. The no-flow underfill material includes an amine-based curing agent and a fluxing agent, which activates at a fluxing temperature and is neutral at the temperatures lower than the fluxing temperature. The fluxing agent of the no-flow underfill material heated to the activation temperature generates a reactive acid in-situ during chip attachment process to facilitate joint formation. The no-flow underfill material is formed on the substrate. A chip is placed on the no-flow underfill material formed on the substrate. A temperature is increased to activate the fluxing agent. The temperature is further increased to form conductive joints between the chip and the substrate. Further, the no-flow underfill material is cured. The conductive joints between the chip and the substrate may be lead-free.

摘要翻译： 描述了基于胺的无流动底部填充材料和制造电连接到基底的倒装芯片器件的方法。 无流动的底部填充材料包括胺基固化剂和助熔剂，其在助熔温度下活化并在低于助熔温度的温度下为中性。 加热到活化温度的无流动底部填充材料的助熔剂在芯片附着过程期间原位产生反应性酸以促进接头形成。 在底物上形成无流动的底部填充材料。 将芯片放置在形成在基板上的无流动底部填充材料上。 增加温度以激活助熔剂。 进一步增加温度以在芯片和衬底之间形成导电接头。 此外，固化了无流动的底部填充材料。 芯片和衬底之间的导电接头可以是无铅的。

公开(公告)号：US20050067468A1

公开(公告)日：2005-03-31

申请号：US10676959

申请日：2003-09-30

申请人： Daoqiang Lu ,  Tian-An Chen

发明人： Daoqiang Lu ,  Tian-An Chen

IPC分类号： B23K1/20 ,  B23K35/36 ,  H01L21/56 ,  H01L21/60 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/203 ,  B23K35/3613 ,  B23K2101/42 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75702 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： An embodiment of the present invention is a technique to utilize water soluble polymer-containing flux to provide protection to low-k ILD of flip chip devices during flip chip assembly. A flux which includes at least a solvent, a water soluble monomer or polymer is applied on a substrate. A die is placed on the substrate, the die is reflowed in an oven at a reflow temperature to redistribute stress caused by coefficient thermal expansion (CTE) mismatch between the substrate and the die. The reflow temperature is higher than a melting point of the polymer.

摘要翻译： 本发明的一个实施方案是一种利用含水溶性聚合物的助熔剂在倒装芯片组装期间为倒装芯片器件的低k ILD提供保护的技术。 将包含至少一种溶剂，水溶性单体或聚合物的助熔剂施加在基材上。 将芯片放置在基板上，将模具以回流温度在烘箱中回流，以重新分布由基板和模具之间的系数热膨胀（CTE）失配引起的应力。 回流温度高于聚合物的熔点。

公开(公告)号：US06761975B1

公开(公告)日：2004-07-13

申请号：US09471299

申请日：1999-12-23

申请人： Tian-An Chen ,  Anna M. George ,  Kreistler S. Y. Lau ,  Hui-Jung Wu

发明人： Tian-An Chen ,  Anna M. George ,  Kreistler S. Y. Lau ,  Hui-Jung Wu

IPC分类号： C08G7700

CPC分类号： H01L21/02126 ,  C09D171/00 ,  C09D183/16 ,  H01B3/46 ,  H01L21/02118 ,  H01L21/312 ,  H01L21/3121 ,  H05K3/389 ,  Y10T428/31612 ,  Y10T428/31663 ,  C08L83/00

摘要： The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.

摘要翻译： 通过聚碳硅烷助剂添加剂或底漆，低k聚（亚芳基醚）介电涂层组合物的粘附力得到有效的提高。 通过（a）提供聚（亚芳基醚）组合物制备涂料组合物; 和（b）向所述组合物中加入少量有效粘合促进量的某些聚碳硅烷。 通过在超过50℃的温度下的热处理来固化粘合增强涂料组合物，以形成用于半导体器件的具有低k介电常数的聚碳硅烷改性聚（亚芳基醚）聚合物组合物。