公开(公告)号：US10153257B2

公开(公告)日：2018-12-11

申请号：US15456273

申请日：2017-03-10

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Meitl ,  Carl Ray Prevatte, Jr. ,  Salvatore Bonafede ,  Robert R. Rotzoll

IPC: H01L25/075 ,  H01L27/32 ,  H01L33/62 ,  H01L25/00

Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.

公开(公告)号：US20180286734A1

公开(公告)日：2018-10-04

申请号：US15937450

申请日：2018-03-27

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Brook Raymond ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Erich Radauscher ,  Carl Ray Prevatte, JR. ,  António José Marques Trindade ,  Tanya Yvette Moore

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/91 ,  B32B37/00

Abstract: A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support substrate, providing a release layer over the micro-device or the pocket, optionally providing a base layer on a side of the release layer opposite the micro-device, disposing the micro-device in the pocket with the release layer between the micro-device and the support substrate so that no portion of the support substrate or the optional base layer is in contact with the micro-device, etching the release layer to completely separate the micro-device from the support substrate or the optional base layer, providing a stamp having a conformable stamp post and pressing the stamp post against the separated micro-device to adhere the micro-device to the stamp post, and removing the stamp and micro-device from the support substrate.

公开(公告)号：US09991413B2

公开(公告)日：2018-06-05

申请号：US15668466

申请日：2017-08-03

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl

IPC: H01L21/00 ,  H01L23/24 ,  H01L33/00 ,  H01L23/00 ,  H01L21/78 ,  H01L21/20 ,  H01L21/18 ,  H01L25/00 ,  H01L33/22 ,  H01L33/44

CPC classification number: H01L33/007 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/7806 ,  H01L24/81 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/44 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2924/00011 ,  H01L2924/13055 ,  H01L2933/0025 ,  H01L2924/00 ,  H01L2224/81805

Abstract: The disclosed technology relates generally to a method and system for micro assembling GaN materials and devices to form displays and lighting components that use arrays of small LEDs and high-power, high-voltage, and or high frequency transistors and diodes. GaN materials and devices can be formed from epitaxy on sapphire, silicon carbide, gallium nitride, aluminum nitride, or silicon substrates. The disclosed technology provides systems and methods for preparing GaN materials and devices at least partially formed on several of those native substrates for micro assembly.

公开(公告)号：US20180145058A1

公开(公告)日：2018-05-24

申请号：US15875955

申请日：2018-01-19

Applicant: OSRAM Opto Semiconductors GmbH ,  X-Celeprint Limited

Inventor： Matthew Meitl ,  Christopher Bower ,  Tansen Varghese

IPC: H01L25/075 ,  H01L33/44 ,  H01L33/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/38 ,  H01L33/22 ,  H01L33/60 ,  H01L21/78

CPC classification number: H01L25/0753 ,  H01L21/7806 ,  H01L33/0066 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/382 ,  H01L33/44 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0091

Abstract: A method for producing a plurality of semiconductor components and a semiconductor component are disclosed. In an embodiment the component includes a light transmissive carrier, a semiconductor body disposed on the light transmissive carrier, the semiconductor body including a first semiconductor layer, a second semiconductor layer and an active region being arranged between the first semiconductor layer and the second semiconductor layer, wherein the semiconductor body includes a first patterned main surface facing the light transmissive carrier and a second main surface facing away from the carrier and a contact structure including a first contact area and a second contact area arranged on the second main surface, wherein the second contact area is electrically connected to the second semiconductor layer, and wherein the contact structure comprises a via extending from the second main surface throughout the second semiconductor layer and the active region into the first semiconductor layer.

公开(公告)号：US20180138071A1

公开(公告)日：2018-05-17

申请号：US15811959

申请日：2017-11-14

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

IPC: H01L21/683 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L21/6835 ,  H01L24/13 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2933/0066

Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

公开(公告)号：US20180119931A1

公开(公告)日：2018-05-03

申请号：US15796259

申请日：2017-10-27

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok ,  Brent Fisher

IPC: F21V19/00 ,  F21V7/04

Abstract: An light-emitting diode (LED) optical component includes a component substrate having an LED side, an opposite side opposing the LED side, and, optionally, a broken or separated component tether. An LED structure includes an LED and, optionally, a broken or separated LED tether separate from the component substrate. The LED structure is disposed on or adjacent to the LED side of the component substrate and the LED emits light when provided with electrical power. An optical element is disposed at least partly in contact with the component substrate such that at least a portion of the emitted light is incident on the optical element. A second optical element can optionally be disposed between the LED and the component substrate or on the opposite side of the component substrate. An LED optical system includes a system substrate on which one or more LED optical components are disposed. The system substrate can be or include one or more optical elements.

公开(公告)号：US20180031974A1

公开(公告)日：2018-02-01

申请号：US15662214

申请日：2017-07-27

Applicant: X-Celeprint Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Matthew Meitl

IPC: G03F7/20 ,  H05K3/30

CPC classification number: G03F7/20 ,  H01L23/00 ,  H01L33/00 ,  H05K1/16 ,  H05K3/30 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/1189 ,  Y02P70/613

Abstract: A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.

公开(公告)号：US09871345B2

公开(公告)日：2018-01-16

申请号：US14834009

申请日：2015-08-24

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01S5/04 ,  H01S5/32 ,  H01S5/40 ,  H01S3/0915 ,  H01S5/00 ,  H01S5/022 ,  H01S5/323

CPC classification number: H01S5/041 ,  H01S3/0915 ,  H01S5/005 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02296 ,  H01S5/32 ,  H01S5/32341 ,  H01S5/4025

Abstract: According to an embodiment, a crystalline color-conversion device includes an electrically driven first light emitter, for example a blue or ultraviolet LED, for emitting light having a first energy in response to an electrical signal. An inorganic solid single-crystal direct-bandgap second light emitter having a bandgap of a second energy less than the first energy is provided in association with the first light emitter. The second light emitter is electrically isolated from, located in optical association with, and physically connected to the first light emitter so that in response to the electrical signal the first light emitter emits first light that is absorbed by the second light emitter and the second light emitter emits second light having a lower energy than the first energy.

公开(公告)号：US20180006186A1

公开(公告)日：2018-01-04

申请号：US15705785

申请日：2017-09-15

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

IPC: H01L33/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/36 ,  H01L33/44

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US09786646B2

公开(公告)日：2017-10-10

申请号：US15040810

申请日：2016-02-10

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade

IPC: H01L27/02 ,  H01L23/528 ,  H01L21/66 ,  H01L33/62 ,  H01L25/16

CPC classification number: H01L27/0207 ,  H01L22/14 ,  H01L22/32 ,  H01L23/528 ,  H01L25/167 ,  H01L27/11582 ,  H01L28/00 ,  H01L33/62 ,  H01L2933/0066

Abstract: A repairable matrix-addressed system includes a system substrate, an array of electrically conductive row lines, and an array of electrically conductive column lines disposed over the system substrate. The row lines extend over the system substrate in a row direction and the column lines extend over the system substrate in a column direction different from the row direction to define an array of non-electrically conductive intersections between the row lines and the column lines. An array of electrically conductive line segments is disposed over the system substrate. The line segments extend over the system substrate substantially parallel to the row direction and have a line segment length that is less than the distance between adjacent column lines. Each line segment is electrically connected to a column line. One or more devices are electrically connected to each row line and to each line segment adjacent to the row line.