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公开(公告)号：US08441112B2
公开(公告)日：2013-05-14
申请号：US12896283
申请日：2010-10-01
CPC分类号： H01L25/50 , H01L22/22 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/08145 , H01L2224/13025 , H01L2224/131 , H01L2224/32145 , H01L2224/73267 , H01L2224/97 , H01L2225/06524 , H01L2225/06527 , H01L2225/06558 , H01L2225/1035 , H01L2225/1064 , H01L2924/01029 , H01L2924/07802 , H01L2924/3511 , H01L2224/19 , H01L2224/83 , H01L2924/00 , H01L2924/014
摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires.
摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括：主要部分，包括第一和第二层部分; 以及多个第一和第二端子，其分别设置在主要部分的顶表面和底表面上，并且电连接到多个导线。 第一和第二端子通过使用第一和第二层部分的电极形成。 层叠芯片封装通过层叠两个子结构（其中包括多个预备层部分的阵列），然后切割层状子结构而制造层状子结构来制造。 分层子结构包括多个初级线，其布置在两个相邻的预分离主体之间并且将成为多根线。
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公开(公告)号：US08426981B2
公开(公告)日：2013-04-23
申请号：US13240048
申请日：2011-09-22
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
CPC分类号： H01L24/96 , H01L21/6835 , H01L24/06 , H01L24/24 , H01L24/94 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/03011 , H01L2224/0346 , H01L2224/03618 , H01L2224/0401 , H01L2224/05147 , H01L2224/05644 , H01L2224/24145 , H01L2224/32145 , H01L2224/83005 , H01L2224/94 , H01L2225/06551 , H01L2225/06558 , H01L2225/06565 , H01L2225/1064 , H01L2924/07802 , H01L2224/03 , H01L2224/83 , H01L2924/00 , H01L2924/0105
摘要： A composite layered chip package includes first and second subpackages that are stacked. Each subpackage includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface; first terminals disposed on the top surface of the main part; and second terminals disposed on the bottom surface of the main part. The first and second terminals are electrically connected to the wiring. The first and second subpackages are arranged in a specific relative positional relationship, different from a reference relative positional relationship, with each other.
摘要翻译： 复合分层芯片封装包括堆叠的第一和第二子封装。 每个子包包括主体和接线。 主体包括：具有顶表面和底表面的主要部分; 第一端子设置在主要部件的顶表面上; 以及设置在主要部分的底表面上的第二端子。 第一端子和第二端子电连接到布线。 第一子包和第二子包以不同于参考相对位置关系的特定相对位置关系彼此排列。
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43.发明申请公开(公告)号：US20130057987A1
公开(公告)日：2013-03-07
申请号：US13224954
申请日：2011-09-02
CPC分类号： G11B5/1278 , G11B5/3106 , G11B5/3116 , G11B5/3136 , G11B5/607 , Y10T29/49032 , Y10T428/1186
摘要： A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer. The thin-film magnetic head has a substrate side coil layer disposed between the main magnetic pole layer and the substrate. In the thin-film magnetic head, a space between a lower end face of the leading shield part and the substrate and a space between an upper end face in the substrate side coil layer and the substrate are formed equal to each other.
摘要翻译： 薄膜磁头被构造为使得主磁极层，写入屏蔽层，间隙层和薄膜线圈层叠在基板上。 薄膜磁头具有与主磁极层的基板侧的主磁极层相对的主屏蔽部。 薄膜磁头具有设置在主磁极层和基板之间的基板侧线圈层。 在薄膜磁头中，形成前导屏蔽部的下端面与基板之间的空间与基板侧线圈层的上端面与基板之间的空间。
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公开(公告)号：US08358015B2
公开(公告)日：2013-01-22
申请号：US13156941
申请日：2011-06-09
CPC分类号： H01L23/5389 , H01L21/561 , H01L21/6835 , H01L22/22 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0235 , H01L2224/02371 , H01L2224/02373 , H01L2224/02379 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05008 , H01L2224/05013 , H01L2224/05147 , H01L2224/05644 , H01L2224/1146 , H01L2224/13024 , H01L2224/13144 , H01L2224/16148 , H01L2224/24011 , H01L2224/2405 , H01L2224/24146 , H01L2224/245 , H01L2224/2512 , H01L2224/25171 , H01L2224/25175 , H01L2224/25177 , H01L2224/2746 , H01L2224/29024 , H01L2224/29144 , H01L2224/32145 , H01L2224/32148 , H01L2224/75101 , H01L2224/8112 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8313 , H01L2224/83191 , H01L2224/83203 , H01L2224/83815 , H01L2224/8385 , H01L2224/83986 , H01L2224/92 , H01L2224/92244 , H01L2224/94 , H01L2224/95 , H01L2225/06541 , H01L2225/06551 , H01L2225/06558 , H01L2225/06565 , H01L2225/1058 , H01L2924/07802 , H01L2924/0105 , H01L2224/82 , H01L2924/00014 , H01L2224/83 , H01L2224/11 , H01L2224/27 , H01L2224/0231 , H01L21/78 , H01L2224/81 , H01L2924/00
摘要： A layered chip package includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface and including three or more layer portions stacked on one another; a plurality of first terminals disposed on the top surface of the main part; and a plurality of second terminals disposed on the bottom surface of the main part. Each layer portion includes a semiconductor chip having first and second surfaces, and a plurality of electrodes electrically connected to the wiring. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. A first layer portion located closest to the top surface of the main part and a second layer portion located closest to the bottom surface of the main part are arranged so that the second surfaces of their respective semiconductor chips face toward each other. The plurality of first terminals are formed by using the plurality of electrodes of the first layer portion. The plurality of second terminals are formed by using the plurality of electrodes of the second layer portion.
摘要翻译： 分层芯片封装包括主体和布线。 主体包括：具有顶表面和底表面并且包括彼此堆叠的三个或更多个层部分的主要部分; 多个第一端子，设置在所述主要部件的顶表面上; 以及设置在主要部分的底表面上的多个第二端子。 每个层部分包括具有第一和第二表面的半导体芯片和电连接到布线的多个电极。 多个电极设置在半导体芯片的第一表面的一侧。 位于最靠近主要部分的顶表面的第一层部分和最靠近主要部分的底表面的第二层部分被布置成使得它们各自的半导体芯片的第二表面朝向彼此。 多个第一端子通过使用第一层部分的多个电极形成。 多个第二端子通过使用第二层部分的多个电极形成。
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45.发明授权Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive 有权薄膜磁头，制造方法，磁头万向架组件和硬盘驱动器公开(公告)号：US08310787B1
公开(公告)日：2012-11-13
申请号：US13246153
申请日：2011-09-27
IPC分类号： G11B5/31
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3163
摘要： A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. The shield magnetic layer is connected to the main magnetic pole layer. The shield magnetic layer has a lower front shield part. A front end angle representing an angle formed between a front end face of the lower front shield part and a lower end face is set at an obtuse angle. The front end face is disposed in the medium-opposing surface. The lower end face is disposed at a position closest to the substrate in the lower front shield part.
摘要翻译： 薄膜磁头被构造为使得主磁极层，写入屏蔽层，间隙层和薄膜线圈层叠在基板上。 薄膜磁头具有屏蔽磁性层。 屏蔽磁性层连接到主磁极层。 屏蔽磁性层具有下部前屏蔽部分。 形成在下侧前屏蔽部的前端面与下端面之间的角度的前端角被设定为钝角。 前端面设置在介质相对面上。 下端面设置在下侧前屏蔽部的最靠近基板的位置。
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公开(公告)号：US08203215B2
公开(公告)日：2012-06-19
申请号：US12835291
申请日：2010-07-13
IPC分类号： H01L23/48
CPC分类号： H01L23/522 , H01L21/563 , H01L21/6835 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2223/54406 , H01L2223/54433 , H01L2223/54453 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05008 , H01L2224/05644 , H01L2224/05647 , H01L2224/1146 , H01L2224/13144 , H01L2224/16148 , H01L2224/24011 , H01L2224/24146 , H01L2224/245 , H01L2224/2746 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/32148 , H01L2224/81121 , H01L2224/8113 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/82005 , H01L2224/821 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8313 , H01L2224/83191 , H01L2224/83193 , H01L2224/83203 , H01L2224/83815 , H01L2224/8385 , H01L2224/9202 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/96 , H01L2224/97 , H01L2225/06551 , H01L2225/06565 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2224/81 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2221/68304
摘要： A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip, and a plurality of electrodes that are electrically connected to the wires. The electrodes include a plurality of first electrodes that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes that are not in contact with the semiconductor chip. In at least one of the layer portions, the first electrodes are in contact with and electrically connected to the semiconductor chip.
摘要翻译： 分层芯片封装包括主体和布线，所述布线包括设置在主体的侧表面上的多根布线。 主体包括主要部分和多个端子。 主要部分包括堆叠的多个层部分。 端子设置在主要部件的顶表面和底表面中的至少一个中并电连接到电线。 每个层部分包括半导体芯片和电连接到导线的多个电极。 电极包括旨在建立与半导体芯片的电连接的多个第一电极和不与半导体芯片接触的多个第二电极。 在至少一个层部分中，第一电极与半导体芯片接触并电连接。
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公开(公告)号：US20120032318A1
公开(公告)日：2012-02-09
申请号：US12852767
申请日：2010-08-09
CPC分类号： H01L25/50 , H01L23/5382 , H01L24/01 , H01L25/0657 , H01L2225/06527 , H01L2225/06551 , H01L2924/07802 , H01L2924/00
摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other.
摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括：主要部分，包括多个层部分; 多个第一端子，其设置在所述主体部的上表面并与所述布线连接; 以及多个第二端子，其设置在所述主体部的底面并与所述布线连接。 每个层部分包括半导体芯片。 多个第二端子被定位成在垂直于主体顶表面的方向上与多个第一端子重叠。 经由导线电连接的多对第一和第二端子包括定位为不彼此重叠的多对第一端子和第二端子。
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48.发明申请Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive 有权热辅助磁头，制造方法，磁头万向节组件和硬盘驱动器公开(公告)号：US20110242703A1
公开(公告)日：2011-10-06
申请号：US12662138
申请日：2010-03-31
CPC分类号： G11B5/6005 , G02B6/122 , G11B5/3116 , G11B5/314 , G11B5/3163 , G11B5/6088 , G11B2005/0021
摘要： A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure.
摘要翻译： 一种热辅助磁头包括主磁极层，具有产生在介质相对表面内布置的近场光的产生端部分的近场光产生层和将光引导到近场光产生 层。 热辅助磁头包括基底层，基底槽部分的宽度随着深度方向逐渐变小并且在与介质相对表面相交的相交方向上延伸。 近场光产生层具有形成在基槽部内的内槽生成层。 槽内产生层沿着基部槽部的内壁面形成，具有薄膜状结构。
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49.发明申请公开(公告)号：US20110228418A1
公开(公告)日：2011-09-22
申请号：US12727666
申请日：2010-03-19
IPC分类号： G11B5/02
CPC分类号： G11B5/314 , G11B5/3163 , G11B5/6088 , G11B2005/001 , G11B2005/0021
摘要： A near-field light generating element has an outer surface including a bottom surface that lies at an end closer to a top surface of a substrate, a waveguide facing surface that lies at an end farther from the top surface of the substrate and faces a waveguide, a front end face located in a medium facing surface, and a side surface that connects the bottom surface, the waveguide facing surface and the front end face to each other. The front end face includes a first side that lies at an end of the bottom surface, a tip that lies at an end farther from the top surface of the substrate and forms a near-field light generating part, a second side that connects an end of the first side to the tip, and a third side that connects the other end of the first side to the tip. The waveguide facing surface includes a width changing portion that has a width in a direction parallel to the bottom surface and the front end face, the width decreasing with decreasing distance to the front end face.
摘要翻译： 近场光产生元件具有外表面，该外表面包括位于更靠近基板顶表面的一端的底表面，位于远离基板顶表面的一端的波导对面的表面 ，位于介质相对表面中的前端面以及将所述底表面，所述波导对向表面和所述前端面彼此连接的侧表面。 所述前端面包括位于所述底面的端部的第一侧，位于距离所述基板的上表面更远的一端并形成近场光产生部的端部，所述第二侧将端部 并且将第一侧的另一端连接到尖端的第三侧。 面向波导的表面包括宽度改变部分，该宽度改变部分在平行于底面和前端面的方向上具有宽度，宽度随着与前端面的距离的减小而减小。
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公开(公告)号：US20110228416A1
公开(公告)日：2011-09-22
申请号：US12659691
申请日：2010-03-17
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
CPC分类号： G11B5/3163 , B82Y20/00 , G02B6/1226 , G11B5/105 , G11B5/314 , G11B5/6088 , G11B2005/0021 , Y10T29/49021 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49052
摘要： A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step.
摘要翻译： 通过以该顺序执行头部成形工艺，安装部件形成工艺和光源安装工艺来形成热辅助磁头。 在头部成形处理中，将规划区域固定在滑块基板的光源放置面上，然后将磁头部形成在除了规划区域以外的头部区域上，并且用于固定激光二极管的安装空间的间隔件 在规划区域形成。 在安装部形成工序中，通过移除间隔件形成光源安装部。 在光源安装过程中，激光二极管安装在由安装部分形成步骤形成的光源安装部分上。
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