Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same
    46.
    发明申请
    Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same 有权
    热固性硅酮组合物,其固化产物和安装方法以及使用其的半导体器件的散热结构

    公开(公告)号:US20030127496A1

    公开(公告)日:2003-07-10

    申请号:US10316078

    申请日:2002-12-11

    Abstract: This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25null C. before curing is 10-1000 Panulls, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps. Component (A): 100 weight parts of an organopolysiloxane having at least two alkenyl groups in the molecule, and a viscosity of 10-100,000 mm2/s at 25null C., Component (B): An organohydrogenpolysiloxane having at least two hydrogen atoms bonded directly to silicon atoms in the molecule, in an amount such that (total number of hydrogen atoms bonded directly to silicon atoms/total number of alkenyl groups in Component (A)) is 0.5-5.0, Component (C): A low melting metal powder having a melting point of 40-250null C., and an average particle size of 0.1-100 micrometers, Component (D): A highly thermoconducting filler having a melting point of more than 250null C., and an average particle size of 0.1-100 micrometers, the total amount of component (C) and Component (D) being 800-2,200 weight parts, and (C)/((C)null(D))null0.05-0.9, Component (E): A catalytic platinum selected from a group comprising platinum and platinum compounds, 0.1-500 ppm relative to Component (A) calculated in terms of platinum atom, Component (F): 0.001-5 weight parts of a controlling agent which suppresses the catalytic activity of Component (E).

    Abstract translation: 本发明公开了一种导热硅氧烷组合物,其包含以下组分(A) - (F),其中在固化前25℃下的粘度为10-1000Pa·s,安装该组合物的方法,散热结构 使用其的半导体装置以及通过两步加热该组合物而形成的固化物。 组分(A):100重量份分子中具有至少两个烯基的有机聚硅氧烷,25℃下的粘度为10-100,000mm 2 / s。组分(B):具有至少两个氢原子的有机氢聚硅氧烷 成分(C):低熔点(C):成分(C):低分子量(C):低分子量的碳原子直接与硅原子直接键合,其数量使得(直接与硅原子键合的氢原子的总数/成分(A)中的烯基的总数)为0.5〜 熔点为40-250℃,平均粒度为0.1-100微米的金属粉末,组分(D):熔点大于250℃的高导热性填料,平均粒子 组分(C)和组分(D)的总量为800-2200重量份,(C)/((C)+(D))= 0.05-0.9,组分(E) :选自铂和铂化合物的催化剂铂,相对于以铂a计算的成分(A)为0.1-500ppm 成分(F):0.001-5重量份抑制成分(E)的催化活性的控制剂。

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